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Current IssueBreaking High-speed Material Constraints
Do you need specialty materials for your high-speed designs? Maybe not. Improvements in resins mean designers of high-speed boards can sometimes use traditional laminate systems. Learn more in this issue.
Level Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
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Asia and South Pacific Design Automation Conference 2018
December 13, 2017 | Cadence Design Systems, Inc.Estimated reading time: Less than a minute
ASP-DAC 2018, which will be held on January 22-25, 2018 in Jeju, Korea, is the twenty-third annual international conference on VLSI design automation in Asia and South Pacific region, one of the most active regions of design and fabrication of silicon chips in the world. The conference aims at providing the Asian and South Pacific CAD/DA and Design community with opportunities of presenting recent advances and with forums for future directions in technologies related to Electronic Design Automation (EDA).
As a specially recognized “Global Education Partner” by ACM SIGDA, Cadence will also sponsor the Student Research Forum at the ASP-DAC, which is renovated from a poster session for students to present their dissertation research with experts, extended to offer a great opportunityies to establish contacts for their future career. In addition, it helps companies to know the latest research and discover talents for the employment. Please join us and you will get a chance to talk with Cadence R&D leaders face to face.
For more details, click here.
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A Review of the 2024 Del Mar Electronics and Manufacturing Show
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TactoTek Licenses IMSE Technology to Polestar for Sustainable Electronics Design Innovation
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The Shaughnessy Report: Unlock Your High-speed Material Constraints
05/15/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportThe world of PCB materials used to be a fairly simple one. It was divided into two groups: the “traditional” laminates, often called FR-4, and the high-speed laminates developed especially for high-speed PCBs. These were two worlds that usually didn’t collide. But then traditional laminates started getting better, and high-speed designers and design engineers took notice and started to reconsider what FR-4 could be used for.