During SMTA International, EPTAC Technical Director Leo Lambert and Managing Editor Nolan Johnson discuss a variety of recent IPC educational program updates, many of which are designed to smooth out the training process. Lambert also explains how these changes will allow EPTAC instructors to optimize the way they present IPC classes, which include the CID and CID+.
Simon Fried, president of Nano Dimension, discusses how the company has taken the additive manufacturing process to the next level through printed electronics. He also shares his thoughts on the growing demand for 3D circuits, as well as how this could potentially be a game-changer for PCB designers.
Over the years, I have focused on high-speed design, signal and power integrity, and EMC design techniques in a plethora of published technical articles—all of which have key points to consider and present a tremendous amount of...
For newbies just entering the industry or experienced designers who have always worked for a corporation, the transition to contractor can be a real culture shock. The allure of working from home and setting your own hours can quickly...
When we started planning this issue, I found an interesting tidbit of information: Electronics packaging predates the printed circuit board. Most electronics history buffs seem to agree that the Braun Tube of 1897, the forerunner of...
Steph Chavez: Breaking the Design Data Bottleneck, a conversation with Steph Chavez
Getting on the Same Page: A Data Story, by Mark Thompson, CID+
At GreenSource, Lean and Green Starts on the Front End, a conversation with JanNell Taylor and Andy Schilloff
Design Data: File Naming Conventions, by Kelly Dack, CID+
Digital Specs for Automated Manufacturing: Find the Missing Link! by Jan Pedersen