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Glenn Oliver of DuPont discusses his award-winning paper, “Round Robin of High-Frequency Test Methods by IPC-D24C Task Group." Co-authors include Jonathan Weldon of DuPont, John Andresakis of Park Electrochemical, Chudy Nwachukwu of Isola, John Coonrod of Rogers Corporation, David L. Wynants of Taconic Advanced Dielectric Division, and Don DeGroot of Connected Community Networks, Inc. The paper looks at high-frequency offerings from a variety of materials providers.
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John Coonrod, Rogers Corporation
Ready or not, 5G is coming, and it will require the right circuit materials for many different types of high-frequency circuits, including power amplifiers. 5G represents the latest and greatest in wireless technology, and it will be challenging to design and fabricate, starting with the circuit board materials, because it will operate across many different frequencies, such as 6 GHz and below, as well as at millimeter-wave frequencies (typically 30 GHz and above).
Andy Shaughnessy, Design007 Magazine
Whether we’re ready for it or not, 5G technology is coming. We decided to speak with John Hendricks, market segment manager for wireless infrastructure at Rogers Corporation, and Ben Jordan, director of product and persona marketing for Altium, about the challenges related to 5G and what this means for PCB designers and fabricators.
Andy Shaughnessy, PCBDesign007
Polar Instruments has pretty been busy lately. In the last year, Managing Director Martyn Gaudion has written two books for I-Connect007, and the company has been working to upgrade its tools, especially library functionality. I met with Martyn at PCB West. We discussed Polar’s newest tool updates, Martyn’s new side job as an author of technical books, and the continuing growth of the EDA segment, including among young people.