IPC APEX EXPO: Glenn Oliver on His IPC 'Best Paper' on High-Frequency Materials


Reading time ( words)

Glenn Oliver of DuPont discusses his award-winning paper, “Round Robin of High-Frequency Test Methods by IPC-D24C Task Group." Co-authors include Jonathan Weldon of DuPont, John Andresakis of Park Electrochemical, Chudy Nwachukwu of Isola, John Coonrod of Rogers Corporation, David L. Wynants of Taconic Advanced Dielectric Division, and Don DeGroot of Connected Community Networks, Inc. The paper looks at high-frequency offerings from a variety of materials providers. 

To watch this video, click here.

Share




Suggested Items

Design Tips for Lowering Costs of Fab and Assembly

08/25/2022 | Cherie Litson, CID+, Litson1 Consulting
This is the million-dollar question of every project: How can I cut the cost of the PCB? There are about a thousand answers to this question. There are a few simple guidelines that everyone can follow to reduce costs. I talk about them in my IPC CID and CID+ courses. Designers, fabricators, and assemblers talk about them in a variety of articles. Some professionals who have published some great articles on cost-saving strategies include Tara Dunn, Happy Holden, Chris Church, Kella Knack, Judy Warner, Julie Ellis, Lars Wallin, and many, many others.

What Happens When You Assume?

07/05/2022 | I-Connect007 Editorial Team
What is design with manufacturing and what does true DWM look like in operation? In this interview, I-Connect007 columnist Dana Korf explains what it will take to achieve total communication among all the stakeholders in the PCB development cycle. He also stresses the need for everyone involved in PCB design and manufacturing to stop making assumptions, even at the risk of being labeled as “that guy” who asks too many questions.

Altium Invests in Future Designers

04/13/2022 | Andy Shaughnessy, Design007 Magazine
While at IPC APEX EXPO, I stopped by the Altium booth to visit with Rea Callender, vice president of education at Altium. Rea shared information about the company’s recent design competition for students around the world, as well as a new curriculum that is drawing interest from some unique locations.



Copyright © 2022 I-Connect007. All rights reserved.