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Top 10 Most-read PCB Design Magazine Articles of 2013
December 31, 2013 | I-Connect007Estimated reading time: 3 minutes
When our contributors speak, people listen! We've compiled a list of 10 of the most-read PCB Design Magazine articles in 2013. Take another look and enjoy these gems one more time.At #10, Differential Signal Design, Part 2, by Lee W. Ritchey, Speeding Edge: Lee Ritchey concludes his two-part series on differential signal design and design rules and he addresses the many misconceptions surrounding differential pair design.At #9, EMI: What it Is, Where it Comes From, and How to Control It, by Lee Ritchey, Speeding Edge: There are a variety of technical books that address EMI and EMC. However, none of them really gets down to the basics of where EMI comes from, what it really is, why it is an issue, and what to do about it. Lee Ritchey takes a closer look.At #8, Is the Cloud a New Paradigm for Electronic Design?, by Dr. Raul Camposano and Steven McKinney, Nimbic Inc.: There's a buzz surrounding the cloud, and how computing is moving to it. Most know that a cloud is a remote storage location to back up files, but is it more than that? What is the cloud in the context of computing, and what are the benefits for PCB design companies? Dr. Raul Camposano and Steven McKinney shine some sunlight on the cloud.At #7, Domestic vs. Offshore PCB Manufacturing, by Nolan Johnson, Sunstone Circuits: If you are sending your PCB manufacturing offshore, what factors weighed heaviest in your decision-making? How do you know if offshore manufacturing still makes sense for you? This article considers both simple and complex ideas for cost-benefit analysis to help guide your decision process.At #6, A 10-layer HDI PCB at a 4-Layer Cost: Why This is Not Going to Happen, by Chris Ryder, AT&S: As sales manager, Chris Ryder is often asked questions along these lines: "How much does it cost to upgrade from a 2-n-2 to a 3-n-3?" The answer, much to the annoyance of the PCB buyer, is "It depends." But with HDI, a little planning and communication goes a long way.At #5, Zen & the Collaborative Art of Designing, Manufacturing, & Implementing Low-loss, High-speed Flex Interconnects, Part 1, by Glenn Oliver, DuPont; Matt Doyle & John Dangler, IBM, & Rick Brandwein and Paul Abrahamson, Molex: To maximize performance improvements and ensure the success of advanced flex materials, new design and fabrication trade-offs must be understood by material suppliers, OEMs, and fabricators. This article represents collaboration between an OEM, a fabricator, and a material supplier with the goal of broadening flex circuits in higher-speed applications.At #4, A Small Leak can Sink a Great Ship: EMC Behavior of Traces Crossing Split Planes, Part I, by Ralf Bruening, Zuken: Laying out a trace across a split or gap with reference planes is a major EMC design rule violation. But often, PCB designers have no alternative other than to place some signals that cross cutouts, gaps, or voids underneath or above the routing path. Zuken's Ralf Bruening takes a closer look.At #3, Next-Generation High-Speed Materials: An Updated List, by Tom Doslak, Streamline Circuits: The evolution of high-speed PCB materials moves just as quickly as the circuit that passes through them. It is no surprise that sometimes a very busy product developer might be confused by, or simply be unaware of, the newest advancements in cutting-edge substrates.At #2, Top 10 Key EMC Design Considerations, by Ashish Kumar and Pushek Madaan, Cypress Semiconductor: For years, PCB designers didn't worry too much about EMC issues. But now, designers are realizing that proper design techniques can indeed help to eliminate EMI. Ashish Kumar and Pushek Madaan of Cypress Semiconductor have crafted a handy Top 10 list of EMC design tips.And, in the #1 spot for 2013, Optimizing PCB New Product Introduction Using ODB++, by Julian Coates, ODB++ Solutions Alliance: The industry does not need more data transfer formats. The maximum efficiency gains can be achieved at the minimum total cost to everyone by implementing existing industry-proven solutions. Julian Coates describes the business advantages of ODB++ intelligent data, along with some comparisons and contrasts with alternative formats.