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New Solder Attach Method Challenges BGA Paradigm
October 7, 2009 | Real Time with...SMTAIEstimated reading time: Less than a minute
First-time SMTAI paper presenter Adam Stanczak, the Global Technolology Manager for Molex, explains how a new solder attach method can help designers move away from traditional BGAs. His paper, aimed largely at PCB designers, explains design hardships and technology verifications for PCB assemblies. Adam sat down for an interview with Steve Gold at SMTAI in San Diego.
Click here to watch.