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Modeling Issues and Solutions at 20 Gb/s
September 24, 2008 |Estimated reading time: Less than a minute
When signals reach 20 Gb/s, standard approaches for analyzing signal integrity at the PCB and package level are no longer valid. Presented at DesignCon 2008, this technical paper discusses electromagnetic models and offers a practical workflow and design rules for the analysis of differential signals in high-speed multilayer PCB. Click here to read this paper, written by Antonio Ciccomancini Scogna, CST of America, and Cisco Systems' Jianmin Zhang, Kelvin Qiu and Qinghua Bill Chen.