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The Five Most-read Design007 Articles of 2022
December 27, 2022 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes
Each December, we like to look back at the most popular articles of the past 12 months. You never know which article is going to blow up like a Blake Shelton album.
So, put on your ugliest holiday sweater and prop up that iPad. For your holiday enjoyment, here’s a blast from the past: the top five most-read Design007 articles of 2022.
Ventec’s Book on Thermal Management: The Summer Sequel You’ve Been Waiting For
The I-Connect007 eBooks have been moving like hotcakes, and Ventec’s 2022 offering got a lot of eyeballs on the page. Co-written by Ventec’s Didier Mauve and Robert Art, The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrate, Volume 2 was the second in the series, and PCB designers snapped it up. This article about the book launch was the most-read Design007 article of the year.
High-Voltage Circuit Design Guidelines and Materials
More of our readers seem to be entering the high-voltage arena lately, and this article by Celso Faia and Davi Correia of Cadence Design Systems rode a voltage spike into our top five. As they point out, a lot of high-voltage issues can be precluded early in the design cycle—if you know what you’re doing. Check it out.
Flexible Hybrid Electronics Design: Reducing Time to Market
Flex and rigid-flex design has been a hot topic for a few years, and Sean Nachnani’s article on flexible hybrid design flexed its biceps all the way into our five most-read items. NextFlex is leading much of the research in this space, and they’ve published a variety of articles this year. As we’ve seen, many of our readers are being forced into flex for one reason or another, and flex hybrids are making inroads into this segment now.
Kris Moyer Discusses New IPC Role
There’s an old saying in business-to-business publishing: People like reading about other people, and it shows. Our interview with IPC design instructor Kris Moyer was the most popular PCB design interview of 2022. More young people are entering this segment, and designers and design engineers are yearning for cutting-edge design education.
Altium Focusing on Educating Designers of Today and Tomorrow
Altium has been working with the educational community for years, providing EDA software to universities and holding educational events such as AltiumLive and Altium Education. This interview with Altium VP of Education Rea Callender and consultant Zach Peterson shot up into our most-read earlier this year. Education may be the hottest of the hot topics in PCB design now.
Suggested Items
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.