Reading time ( words)
I was first introduced to James Maxwell in 1967 as a college student. I had to decide whether I would take the Maxwell fields course or the switching and coding course. Being a chemical engineering major with a co-major in control theory, I had heard about the trials and tribulations of the infamous Maxwell fields course.
After a lot of consideration, I decided to take the switching and coding course, since it was more related to computer theory, while the fields course was more related to RF, power generation/distribution, and communications.
In those days, our transistors, tubes and ICs were still pretty slow, except for radio, radar, etc. At that time, signal integrity in board layout was not an issue. I was using RTL, DTL and slow TTL logic on breadboards of non-plated through-holes with tinned-copper wire and Teflon spaghetti tubing.
But after talking with students who had managed to successfully pass the fields course, I was awed by the mathematical rigors they had endured. I was astounded when these very same students found thermodynamics so difficult. Maxwell’s eqations are not easy.
To read this entire article, which appeared in the November issue of Design007 Magazine, click here.
Share
Suggested Items
03/09/2023 |
Anaya Vardya, American Standard Circuits
One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. The next final finishes to discuss in this series is OSP. As with all surface finishes there are pros and cons with the decision of which to use. It is a combination of application, cost, and the properties of the finish. OSP is RoHS-compliant as there is zero lead content in the finish.
02/14/2023 |
Anaya Vardya, American Standard Circuits
One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers (from the PCB manufacturer's perspective) and the design decisions that will impact product reliability.
01/26/2023 |
Kris Moyer, IPC
In today’s ever-shrinking world of electronics designs, the use of BGA parts with very fine pitch features is becoming more prevalent. As these fine-pitch BGAs continue to increase in complexity and user I/O (number of balls), the difficulty of finding escape routes and fan-out patterns increases. Additionally, with the shrinking of silicon geometry leading to both smaller channel length and increased signal integrity issues, some of the traditional BGA escape routing techniques will require a revisit and/or adjustment to allow for not only successful fan-out, but also successful functioning of the circuitry of the BGA design.