Jeff De Serrano, president of PCB Technologies USA, discusses the launch of their new company, iNPACK, which focuses on high-tech substrate technologies, microelectronics assembly, and electronics packaging. He details his plans to continue expanding iNPACK over the next year and to meet with customers and exhibit at the International Microwave Symposium Show in Denver June 19-24.
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Matt Bergeron, Integra
Integra is one of the largest and most experienced semiconductor die prep, assembly, test, and qualification facilities in the United States, with locations in both Wichita, Kansas, and Silicon Valley. At the recent IPC Advanced Packaging Symposium, Integra was invited to present information about how we meet our customers’ specific needs.
Nolan Johnson, I-Connect007
During a recent tour of the MKS facility in Beaverton, Oregon, I met with Todd Templeton, Chris Ryder, Kyle Baker, and Martin Orrick. As a reminder, MKS acquired ESI in 2019 and has retained the ESI brand. In this interview, they explain their approach to HDI and ultra HDI, the current state of base materials, and what the future looks like on the cutting edge of technology.
Dan Beaulieu, D.B. Management Group
Bob Duke has been involved in global sourcing for over 20 years, and by global sourcing, it’s far beyond basic PCBs and PCBAs. Bob was doing this sort of thing before it was cool. He has been involved in everything from metal and plastic fabrication to cables and wire harnesses— just about anything an electronics customer might need. So, when American Standard Circuits started a new division to expand its global sourcing solutions, it was no surprise that CEO Anaya Vardya tapped his long-time friend Bob Duke to lead the way. I sat down to have a talk with Bob about this new division and his plans for the future.