-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Elevate Engineering Simulation with Ansys 2022 R1
February 2, 2022 | ANSYSEstimated reading time: 4 minutes
Ansys announces the release of their 2022 software package. The latest version of Ansys software and services reduces obstacles to enable customers to solve today’s complex engineering challenges. Engineering simulation has expanded beyond highly specialized experts and into mainstream product design and development, enabling more companies to save time, reduce costs, and innovate. At the same time, engineering complexity has skyrocketed, requiring organizations to scale like never before, driving demand for advanced computing resources and cross-discipline engineering solutions. The new products, technologies, and tools that make up Ansys 2022 R1 enable experts to go deep with custom workflows for industry-specific applications while also extending broad ease-of-use features that turbocharge collaboration across teams.
"Schneider Electric leverages Ansys simulation to accelerate key business initiatives, improving the quality of our products while making them smarter. This is an enabler of our vision for a more sustainable, energy-efficient future,” said Jayaraman Raghuraman, senior vice president of Schneider Electric. “Ansys expertise and cutting-edge technology accelerate our digital transformation and help us simplify the application landscape across our engineering organization.”?
New, industry-focused solutions are expanding the definition of what is possible. Ansys 2022 R1 includes a dedicated aerospace workspace in Ansys Fluent that tailors the user interface to external aerodynamics simulations, enabling aircraft designers to evaluate aircraft efficiency and study dynamics from subsonic to very high-speed flows. Similarly, the new Ansys Forming product enables engineers to digitally design and validate every step of the sheet metal forming process commonly found in automotive, appliances, aerospace, and packaged goods industries. Ansys RF Advisor On Demand is targeted specifically to help engineers solve the challenge of radio frequency interference for the next generation of high-tech devices.
With 2022 R1, Ansys continues to bring ground-breaking technologies to address printed circuit board (PCB) and 3D IC (integrated circuit) package design challenges as well as advancements in 5G, autonomous, and electrification simulation. Building on the success of HFSS Mesh Fusion, the introduction of the Phi Plus meshing technology brings extraordinary speed and robustness to complex system simulation including 3D IC packaging challenges. In semiconductors, 2022 R1 introduces RedHawk-SC SigmaDVD, a technology breakthrough that identifies the worst-case dynamic voltage-drop in hours instead of months. This novel, statistically realistic modeling technique makes it possible to achieve near 100% coverage of all relevant switching scenarios of neighboring cells, making chip designs more robust and giving chip designers greatly expanded confidence in RedHawk-SC’s golden signoff analysis. New workflows and integrations in Ansys 2022 R1 produce even greater insight into product performance. In this latest release, Ansys Sherlock features a new, semi-automated workflow that takes advantage of integrations with Ansys AEDT Icepak to deliver more predictively accurate thermal analysis simulations for PCBs.
"The importance of electronics is continuously increasing in the automotive industry,” said Dr. Pascal Schirmer, development engineer Power Electronics at BMW Group. “The use of simulation tools from Ansys, such as Ansys Sherlock, allows us to optimize, in a very early design phase, the performance and reliability of the electronic components while managing for the growing complexity.”
Managing complexity to achieve both speed and predictive accuracy is critical to nearly every industry. Increasingly, these next-generation products require integrated semiconductors and electronics along with embedded software, advanced sensors, and displays. Product success requires consideration of how a full system will operate in a broad context that encompasses traditional design and extends into operation effectiveness. Ansys solutions help design teams meet stringent requirements for functional safety, industry-standards’ compliance, and long-term operational reliability. Ansys 2022 R1 delivers product offerings that complement traditional multiphysics with safety, reliability, cybersecurity, digital mission engineering, and digital twins.
The optical technologies offered by Ansys span from Ansys Lumerical at the microscale, to Ansys Zemax at the macroscale, all the way to human and sensor perception for systems with Ansys Speos. The Ansys 2022 R1 release delivers increased functionality supporting Ansys' unique and comprehensive solution for the design of optical and photonic devices in datacom, consumer electronics, automotive, aerospace, healthcare, and more. On the other end of the scale are enormous simulations to support digital mission engineering like Ansys STK (Systems Tool Kit) that now includes enhanced tools to support large satellite mega-constellations being evaluated and designed across the commercial space industry. In between are examples from nearly every industry where fast, high-fidelity simulations of increasingly complex phenomena are needed to meet tight product development deadlines.
Another means to meet those deadlines is to pair advanced simulation with high-performance computing (HPC) resources. With Ansys 2022 R1, many more applications support Ansys Cloud and take advantage of the power that the latest graphics processing units (GPUs) can provide. For example, a new Multi-GPU solver available in Fluent accelerates steady-state computational fluid dynamics (CFD) simulations, producing results that show four high-end GPUs provide the same performance as more than 1,000 CPUs, while reducing hardware costs by up to 7x and power consumption by up to 4x. Ansys 2022 R1 also expands Ansys Discovery’s astonishing live physics in the critical area of thermal management through the addition of coupled fluid-solid multiphysics simulation. This fast, fault-tolerant approach means that the simulation of heat exchangers, liquid cooling devices, and exhaust systems is now markedly easier to perform and up to 50x faster allowing for even greater design exploration.
“Speed, fidelity, and scalability are crucial to integrating simulation across the enterprise, enabling engineers to connect with global collaborators to keep pace with innovation in high-growth areas, such as autonomous vehicles, electrification, and artificial intelligence,” said Shane Emswiler, senior vice president of products at Ansys. “The new features in Ansys 2022 R1 enable engineers to both solve more complex challenges and expand the reach of simulation’s benefits.”
Suggested Items
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
Standard Of Excellence: The Products of the Future
09/19/2023 | Anaya Vardya -- Column: Standard of ExcellenceIn my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering
09/18/2023 | ViTroxViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel Unveils Industry-Leading Glass Substrates to Meet Demand for More Powerful Compute
09/18/2023 | IntelIntel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.