Electronic System Design Industry Reports 17% Revenue Growth in Q1 2021


Reading time ( words)

Electronic System Design (ESD) industry revenue increased 17% to $3.15 billion in Q1 2021, the strongest first-quarter growth ever, the ESD Alliance, a SEMI Technology Community, announced in the Q1 2021 Electronic Design Market Data (EDMD) report. The first-quarter revenue compares to $2.69 billion in Q1 2020. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 15%, the highest annual growth since 2011.

“The industry reported substantial, double-digit year-over-year revenue growth for Q1 2021,” said Walden C. Rhines, Executive Sponsor, SEMI Electronic Design Market Data report. “All product categories significantly contributed, with double-digit growth in the Computer Aided Engineering (CAE), IC Physical Design and Verification, Printed Circuit Board and Multi-Chip Module (PCB and MCM), and Semiconductor IP (SIP) segments.”

“Geographically, the Americas; Europe, Middle East, and Africa (EMEA); and Asia Pacific (APAC) also reported double-digit growth,” Rhines said. “Q1 2021 marked a new high for quarterly growth of total license and maintenance revenue, as well as IC physical design and verification.”

The companies tracked in the EDMD report employed 49,024 people in Q1 2021, a 6.7% increase over the Q1 2020 headcount of 45,938 and up 1.1% compared to Q4 2020.

The quarterly EDMD report contains detailed revenue information with the following category and geographic breakdowns.

Revenue by Product and Application Category

  • CAE revenue increased 14% to $974.1 million compared to Q1 2020. The four-quarter CAE moving average increased 12.5%.
  • IC Physical Design and Verification revenue surged 34.4% to $682.5 million compared to Q1 2020. The four-quarter moving average for the category rose 23.6%.
  • Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue increased 15.3% to $289.2 million compared to Q1 2020. The four-quarter moving average for PCB and MCM increased 5.3%.
  • SIP revenue rose 12.9% to $1,113 million compared to Q1 2020. The four-quarter SIP moving average grew 17.1%.
  • Services revenue increased 0.1% to $98.9 million compared to Q1 2020. The four-quarter Services moving average held steady with no growth.

Revenue by Region

  • The Americas, the largest reporting region by revenue, purchased $1.28 billion of electronic system design products and services in Q1 2021, a 15% increase compared to Q1 2020. The four-quarter moving average for the Americas rose 13.5%.
  • Europe, Middle East, and Africa revenue increased 14% to $447.3 million compared to Q1 2020. The four-quarter moving average for EMEA grew 6.7%.
  • Japan revenue decreased 3.7% to $258.8 million compared to Q1 2020. The four-quarter moving average for Japan rose 4.3%.
  • Asia Pacific revenue increased 26.9% to $1,166.3 million compared to Q1 2020. The four-quarter moving average for APAC increased 23.8%.

Share




Suggested Items

Electronic System Design Industry Logs $3.9B in Revenue in Q4 2022

05/02/2023 | SEMI
Electronic System Design (ESD) industry revenue increased 11.3% from $3,468.2 million in the fourth quarter of 2021 to $3,858.7 million in the fourth quarter of 2022, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report.

Sunstone and I-007eBooks Launch Book on Designing for Reality

10/24/2022 | I-Connect007
I-007eBooks is excited to announce the release of the latest title in its series for designers, The Printed Circuit Designer’s Guide to… Designing for Reality. This book covers both written and unwritten rules for how to create a realistic, manufacturable design.

Development of Flexible Hybrid Electronics

08/14/2019 | Weifeng Liu, PhD, Flex
This article will present a hybrid manufacturing process to manufacture FHE systems with a two-layer interconnect structure utilizing screen printing of silver conductive ink, filled microvias to connect ink traces at the different layers, and use of the traditional reflow process to attach the semiconductor chips to the printed substrates.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.