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New IPC Board Members Nominated
February 22, 2007 | IPCEstimated reading time: 2 minutes
The Nominating and Governance Committee of the IPC Board of Directors will present five candidates for election at the IPC Annual Meeting, on Tuesday, February 20, 2007, in Los Angeles, Calif. Board members will serve a two-year term covering calendar years 2007 and 2008. The candidates are:
Jack Calderon, managing director, Lincoln Partners LLC, Chicago, Ill. Calderon has been a board member since 2003 and previously served as an IPC board member from 1997 to 2000. Prior to joining Lincoln International, Calderon spent 20 years in operating positions in the electronics manufacturing services (EMS) industry. Lincoln International is a mergers and acquisitions firm.
Bob Ferguson, president, Circuit Board Technologies, Rohm and Haas, Shanghai. Ferguson participates on numerous IPC committees including the Process Consumables Statistical Committee. He is the former chairman of the IPC PCB Suppliers Council and has been on the IPC Board since 2005. Rohm and Haas is a world leader in the creation, development and delivery of material technologies and fabrication solutions for the global circuit board market.
Pierre de Villemejane, president and CEO, Speedline Technologies, Franklin, Mass. Villemejane is a member of the IPC SMEMA Council steering committee and has been on the IPC Board since 2005. He has extensive global strategic planning, business development and marketing experience. Speedline Technologies is a global leader for single-source equipment, software, and services to the PCB assembly and semiconductor packaging industries.
Shane Whiteside, chief operating officer, TTM Technologies, Santa Ana, Calif. Whiteside has been a member of IPC's Board since 2005. Prior to joining TTM Technologies, he served as director of operations at Power Circuits and was previously employed by Technica USA, serving in the areas of product management and technical sales. TTM Technologies is a leading independent supplier of time-critical, technologically advanced printed circuit boards to original equipment manufacturers and electronic manufacturing services companies.
- Sammy Yi, vice president, Assembly Technology Development, Flextronics International, San Jose, Calif. Yi has been nominated to serve a third term. He has more than 15 years in engineering, quality system, technology development and operations management in electronics manufacturing with both original equipment manufacturing and EMS companies in the United States and overseas. Flextronics helps customers design, build, ship, and service electronics products for OEMs in the aerospace, automotive, computing, consumer digital, industrial, infrastructure, medical, and mobile market segments.
For more information regarding IPC's Board of Directors election and current members, visit http://www.IPC.org/BoD, or contact Anna Garrido, IPC director of marketing and communication at +1 847-597-2804 or AnnaGarrido@ipc.org .
About IPC
IPC (http://www.ipc.org/) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,400 member companies which represent all facets of the electronics interconnect industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.