Just Ask Joe: Optimum Copper Plating for Thermal Via Farms


Reading time ( words)

First, we asked you to send in your questions for Happy Holden. Now, it’s Joe Fjelstad’s turn! Inventor, columnist, instructor, and founder of Verdant Electronics, Joe has been involved with rigid PCBs and flexible circuits for decades, and he’s ready to share some of his knowledge with our readers. We hope you enjoy “Just Ask Joe.”

Q: What is the optimum copper plating thickness for thermal via farms?  

A: The question is an important one, but it is not easy, or perhaps even possible, to provide a hard answer to the question as there are many variables to consider. How many vias? What is their pitch? What size (diameter and depth) are they? How much heat needs to be removed? Are they filled with copper or just hole-wall plated? Are they independent features or connected en masse to a copper plane? In a sense, the best answer is perhaps that they collectively resemble the extent possible a copper slug. I would suggest that some thermal modeling of the solution be performed beforehand.

That said, there are some interesting technologies being rolled out at the present time. One is from the Silicon Valley company, Kuprion, which has developed a nanoparticle “copper solder,” which appears worth considering as an alternative to plating vias.   

To pose your own question for Joe Fjelstad, click here.

Joe Fjelstad is founder and CEO of Verdant Electronics and an international authority and innovator in the field of electronic interconnection and packaging technologies with more than 185 patents issued or pending. To read past "Flexible Thinking" columns or contact Fjelstad, click here. Download your free copy of Fjelstad’s book Flexible Circuit Technology, 4th Edition, and watch the micro webinar series on flexible circuit technology.

Share

Print


Suggested Items

EIPC Technical Snapshot: PCB Surface Finishes

12/28/2020 | Pete Starkey, I-Connect007
For the third in a series of Technical Snapshot webinars, EIPC chose to focus on PCB surface finishes, comparing specific properties, examining corrosion behaviour and discussing selection criteria for low-loss, high frequency applications.

Happy Holden: ECWC15 Virtual Event a Success

12/15/2020 | Happy Holden, I-Connect007
This is the first Electronic Circuits World Convention that I have not attended in person since 1978. To refresh your memory, these are held every three years on a rotating basis. The HKPCA hosted this year’s conference and they kept up the fine tradition of collecting outstanding keynotes, nearly 60 technical presentations and myriad poster papers. HKPCA was also kind enough to provide English slides and translations. It is still possible to sign up and view the presentations. I have listened to 20 of the presentations, and hope to attend even more in the coming days as they are all worth watching.

Pacothane on the Future of Laminate Technologies

12/08/2020 | Nolan Johnson, I-Connect007
Nolan Johnson recently spoke with the Pacothane Technologies team about the current drivers of circuit board technology and how that has influenced and increased their product development of lamination and lamination assist products.



Copyright © 2021 I-Connect007. All rights reserved.