Just Ask Happy: The Future of Mechanical Blind, Buried Vias


Reading time ( words)

We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.

Q: Do mechanical blind and buried vias have a future?

A: Yes, especially for the newly invented VeCS technology, which uses a mechanical drill to gain the same density as laser-drilled microvias, but with higher reliability. For more information, read this series on VeCS technology by Joan Tourné of NextGin Technology, which ran in PCB007 Magazine in 2019 (also read Part 2, Part 3, and Part 4).

To pose your own question for Happy Holden, take the survey by clicking here.

Share

Print


Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

02/12/2021 | Andy Shaughnessy, Design007 Magazine
We’re moving on into 2021, and there’s quite a bit going on in the world of PCB design, fabrication, and assembly. IPC APEX EXPO is fast approaching, and I know a lot of you will be attending, albeit virtually. In this week’s Top Five, columnist Eric Camden provides a how-to guide for PCBA technologists planning their IPC APEX EXPO schedule.

Joe Fjelstad's Book Review: The Innovators

02/08/2021 | Joe Fjelstad, Verdant Electronics
"The Innovators: How a Group of Hackers, Geniuses, and Geeks Created the Digital Revolution" by Walter Isaacson is the best technology history book I have ever read, and at the same time one of the most engaging and entertaining. It is a forte of Isaacson to write biographies of great people. I have read his other books on DaVinci, Steve Jobs, Ben Franklin and Albert Einstein and found them equally brilliant. Isaacson has a number of other titles I have yet to get to in the future. He is a singularly great storyteller.

EIPC Technical Snapshot: Market Analysis and Advanced Manufacturing Tech

11/30/2020 | Pete Starkey, I-Connect007
Pete Starkey details the November EIPC webinar program that combined knowledgeable market analysis and advanced manufacturing technology, including insights from Prismark's Dr. Shiuh-Kao Chiang, Averatek's Mike Vinson, and Atotech's Roland Herold.



Copyright © 2021 I-Connect007. All rights reserved.