Register Now for Mentor's DFM Analysis Webinar on Oct. 16


Reading time ( words)

Historically, design-for-manufacturability (DFM) checks have taken place during the fabrication process and have typically been performed by PCB manufacturing engineers or fab houses utilizing DFM-specific analysis software. The typical PCB designer would only run their own built-in prefabrication DRC and integrity checks prior to sending out for manufacturing and wait to hear back from the fabricator if issues were encountered.

Today, DFM analysis allows you to identify and correct potential fabrication and assembly issues in the design database before they hit the production floor. Without DFM, you leave changes in the manufacturer’s hands, where the focus is on increasing yield, not on the electrical performance of the final product.

In this webinar by Mentor, a Siemens business, attendees will learn how PADS Professional can empower you to eliminate costly manufacturing delays by minimizing supplier call-backs and design re-spins.

What You Will Learn

  • Common DFM issues that cause delays in fabrication 
  • Common DFA issues that cause delays in assembly 
  • Panelization using PADS Professional's FabLink 
  • Producing an output file: ODB++ vs. Gerber
  • Proper data to include in design for fabrication and assembly

Who Should Attend

  • Engineering managers
  • Electrical and hardware engineers
  • PCB designers

Date/Time

Oct 16, 2019
2:00 PM - 3:00 PM Europe/London

 

Oct 16, 2019
2:00 PM - 3:00 PM US/Eastern

Click here to register for this free webinar.

 

Share

Print


Suggested Items

Emerging Engineer: Jesse Vaughan

03/31/2021 | Andy Shaughnessy, Design007 Magazine
Jesse Vaughan, a member of the IPC Emerging Engineer program, discusses some of the takeaways from this year's virtual IPC APEX EXPO.

Brad Griffin Discusses Cadence’s New Transient Solver Technology

10/26/2020 | Andy Shaughnessy, Design007 Magazine
Andy Shaughnessy speaks with Brad Griffin, product marketing director for Cadence Design Systems, about their new Clarity 3D Transient Solver, which is designed for system-level EMI simulation. Brad explains how the new solver, based on the company’s matrix technology, can yield results 10 times faster than existing solvers when simulating IC packages, PCBs, and SoIC designs.

Just Ask Happy: Manufacturing Issues From a Designer’s Viewpoint

07/23/2020 | I-Connect007 Editorial Team
We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.



Copyright © 2021 I-Connect007. All rights reserved.