Words of Advice: What are Your Biggest Problems Related to Flex Design?

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In a recent survey, we asked the following question: What are your biggest problems related to flex design? Here are a few of the answers, edited slightly for clarity.

1. We are lagging in technology.
2. None…design them correctly!
3. Stress cracking in FPC ZIF fingers.
4. We need to work more closely with our FPC fab vendors.
5. Signal integrity of signal paths through the flex and rigid parts of the PCB.

09/19/2019 | Rebecca Lord and John McMillan, Mentor, a Siemens business

PCB designs commonly undergo multiple respins as a result of inconspicuous signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI) violations. At an average cost of nearly $28,000 per respin, ensuring that a given design meets its performance, time to market, and cost goals is imperative. To help eliminate complicated and difficult-to-diagnose layout violations, some PCB tool suites offer unique electrical design rule checks (DRC).

09/16/2019 | I-Connect007 Research Team

In a recent survey, we asked the following question: What feature would you like to see in your CAD tool? Here are a few of the answers, edited slightly for clarity.

09/05/2019 | Andy Shaughnessy, Design007 Magazine

It's show season again! The 2019 AltiumLive PCB Design Summit will be here before you know it, taking place October 9-11 in San Diego, California. Teledyne LeCroy’s Eric Bogatin, the “signal integrity evangelist,” will be giving a keynote presentation titled “Breaking Bad: A Downside of Open Source Designs.” Eric gives us a preview of his presentation and discuss some of the biggest design challenges he sees today.