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I-Connect007 Publishes Second Annual Show & Tell Magazine—All About IPC APEX EXPO 2019
February 19, 2019 | I-Connect007Estimated reading time: Less than a minute
Welcome to the second annual Real Time with… IPC APEX EXPO 2019 Show & Tell Magazine.
This special publication is a supplement to our other monthly magazines and brings you exclusive, in-depth coverage of the recent event. These pages are packed with tons of great content including event photos, video interviews, attendees’ thoughts, reviews from our guest contributors and I-Connect007 editors, interviews with award winners and other industry experts, and coverage of the successful IPC STEM Student Outreach program. If that’s not enough, you will also enjoy our coverage of the Hand Soldering and Rework World Championship, the two executive forums, and all of the excitement around CFX.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/03/2024 | Nolan Johnson, I-Connect007This week’s most important news is strategic—and telling. When one puts together the IPC industry reports, we simply have to include the recent conversation with Shawn DuBravac and Tom Kastner. On the design side, check out the latest “On The Line With…” podcast featuring Brad Griffin from Cadence Design Systems, discussing SI and PI in the realm of intelligent system design.
IMI Welcomes New CEO
05/03/2024 | IMIIntegrated Micro-Electronics, Inc. (IMI),The IMI Board of Directors announced, in a disclosure dated April 25, 2024, the appointment of Louis Sylvester Hughes, Chief Executive Officer (CEO).
Gstar Announced the Strategic Move: Groundbreaking of Silicon Wafer Factory Construction in Indonesia
05/03/2024 | PRNewswireRecently, Gstar held a groundbreaking ceremony for its silicon rod and silicon wafer factory, marking the beginning of the rapid construction phase.
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.
On the Line With… Talks With Cadence Expert on SI/PI for PCB Designers
05/02/2024 | I-Connect007In “PCB 3.0: A New Design Methodology—SI/PI for PCB Designers,” subject matter expert Brad Griffin, Cadence Design Systems, discusses how an intelligent system design methodology can move some signal and power integrity decision-making into the physical design space, offering real-time feedback.