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This article studies the impact of dielectric thickness on crosstalk for transmission lines in single-ended and differential mode on outer (microstrip) and inner (stripline) PCB layers. Crosstalk analysis is performed in 2D simulation and S-parameters are subsequently observed.
Introduction to Crosstalk
Crosstalk is an unintentional electromagnetic (EM) field coupling between transmission lines on a PCB. This phenomenon becomes a major culprit in signal integrity (SI), contributing to the rise of bit error occurrence in data communications and electromagnetic interference (EMI). With the existence of mutual inductance and capacitance between two adjacent transmission lines on a PCB, crosstalk has become more severe due to the shorter signal rise/fall times at today’s higher data speed rates.
Crosstalk can be minimized by routing the PCB traces further apart and reducing the dielectric thickness between PCB trace and reference plane. We will observe how a PCB’s dielectric thickness affects the signal crosstalk. All crosstalk analyses are carried out in 2D simulation using Mentor’s HyperLynx.
To read this entire article, which appeared in the August 2018 issue of Design007 Magazine, click here.
Dan Beaulieu, D.B. Management Group
Over the course of his career, Mark Thompson, CID+, engineering support at Prototron Circuits, has evaluated thousands of data packages and delivered numerous talks to designers and engineers about how to create the perfect package. In the spirit of “garbage in, garbage out,” data packages must be perfect to create quality boards. Learn all this and more in The Printed Circuit Designer’s Guide to… Producing the Perfect Data Package!
Andy Shaughnessy, Design007 Magazine
Artificial intelligence (AI) has been making inroads into a variety of industries in the past decade or so, from automobiles to medical devices. Naturally, EDA tool companies are taking a look at AI. Does AI offer a way forward for PCB design tool developers? I recently interviewed Paul Musto, director of marketing for the Board Systems Division of Mentor. We discussed Mentor’s plans for integrating AI into EDA tools, and why we may be at the very beginning of understanding the pros and cons of this new technology.
Errors and inaccuracies slow the process down because the CAM department has to correct their data package or ask customers to clarify their intent. In the quick-turn prototype business where people pay for time, a slowdown on a three-day turn can be a disaster. I recently sat down with Thompson to find out more about his new book and discuss the quest for the perfect data package.