The Impact of PCB Dielectric Thickness on Signal Crosstalk


Reading time ( words)

This article studies the impact of dielectric thickness on crosstalk for transmission lines in single-ended and differential mode on outer (microstrip) and inner (stripline) PCB layers. Crosstalk analysis is performed in 2D simulation and S-parameters are subsequently observed.

Introduction to Crosstalk

Crosstalk is an unintentional electromagnetic (EM) field coupling between transmission lines on a PCB. This phenomenon becomes a major culprit in signal integrity (SI), contributing to the rise of bit error occurrence in data communications and electromagnetic interference (EMI). With the existence of mutual inductance and capacitance between two adjacent transmission lines on a PCB, crosstalk has become more severe due to the shorter signal rise/fall times at today’s higher data speed rates.

Crosstalk can be minimized by routing the PCB traces further apart and reducing the dielectric thickness between PCB trace and reference plane. We will observe how a PCB’s dielectric thickness affects the signal crosstalk. All crosstalk analyses are carried out in 2D simulation using Mentor’s HyperLynx.

To read this entire article, which appeared in the August 2018 issue of Design007 Magazine, click here.

Share

Print


Suggested Items

RTW IPC APEX EXPO 2019: For Elmatica, the Future is All About Data

01/30/2019 | Real Time with...IPC
At this year's IPC APEX EXPO, guest editor Judy Warner sits down with Elmatica CEO Didrik Bech to discuss the company's business model and CircuitData, their award-winning open-source PCB design data language.

Happy Anniversary, Gerber Format: Looking Ahead to Digital Innovation

01/25/2019 | Patrick McGoff, Mentor, a Siemens business
This year, we celebrate the 55th anniversary of the introduction of the Gerber machine language format. We can thank H. Joseph Gerber, the man who took manual PCB design to the next level with the automated photoplotter, for giving us this format in 1964. Gerber immigrated to the United States in 1940 with his mother following the death of his father during the Holocaust. Gerber started Gerber Scientific Instrument Company in 1948 to commercialize his first patented invention—the variable scale.

The Quest for Perfect Design Data Packages

01/18/2019 | Barry Matties, I-Connect007
There’s an ongoing problem in the PCB industry: fabrication shops are receiving incomplete or inadequate design data packages, leaving manufacturers scrambling to fill in the blanks. For a quick-turn prototype shop like Washington-based Prototron, with over 5,000 customers and up to 60% of orders coming from new customers each month, that can add up to a lot of wasted time and effort just in the quoting stage. Dave Ryder, Prototron president, and Mark Thompson, engineering support, delve into this continuing issue and more.



Copyright © 2019 I-Connect007. All rights reserved.