RUSH PCB Unveils 10-Layer HDI Design and Manufacture Capabilities


Reading time ( words)

Rush PCB Inc. now offers the design and manufacturing of multilayer HDI PCBs of 10 layers and more.
 
In making the announcement, CEO Akber Roy stated, “To achieve very high-density interconnection, designers at Rush PCB Inc. use what we know as Every Layer Interconnect (ELIC) technology. This is a method wherein each layer has its own copper-filled laser-drilled microvias. When stacked up, it provides the opportunity for dynamic connections between any two layers in the PCB. Not only does this offer an increased level of flexibility, but it also maximizes circuit density.”
 
Roy adds that RUSH designers have taken up the additional complex challenges in routing with via-in-pad (VIP) and by employing blind and buried vias. They laser-drill via holes and filled them with conductive copper paste. 
 
“Before finalizing the design of multi-layer PCBs, our designers confirm the structure of the circuit board primarily based on the scale, physical size, and the requirements of electromagnetic compatibility (EMC)," said Roy. "Our designers use 10 layers of material, and in this stack-up design have decided that the placement of the innerlayer and the manner of distribution of different signals in these layers of the multilayer PCB. This careful planning and determination of the stack-up design beforehand save the user much time and effort in wiring and production later.”
 
Roy added, “Apart from very fine traces in the foil pattern, HDI requires sequential build-up (SBU) and microvias drilled with lasers. SBU technology is used to fabricate HDI boards. The HDI layers are usually built up from a traditionally manufactured double-sided core board or multilayer PCBs.”
 
About RUSH PCB Inc.
 
Rush PCB Inc., is a printed circuit design, fabrication and assembly company located in the heart of Silicon Valley. Rush PCB engineers are experts at handling small production runs and prototypes as well as full-scale production, using both manual and automated SMD assembly processes when appropriate. RUSH can execute single and double-sided placement for all SMT component types, including BGA, UBGA, QFP, QFN, PLCC, SOIC, POP, and various other small chip packages. They can efficiently handle passive chip packages as small as 0201s, and active components with a pitch of 8 mils or more. For more information, click here.

Share


Suggested Items

Julie Ellis: Communication and Fabrication Knowledge Critical for Designers

11/14/2018 | Andy Shaughnessy, Design007 Magazine
Field Application Engineer Julie Ellis of TTM sees it all: good designs, bad designs, and everything in between. Her classes on proper DFM techniques are always a big draw. She taught at the inaugural AltiumLive in 2017 and was back at this year’s event. I caught up with Julie and asked her to discuss some of the things she covered in class. As she points out, many issues could be eliminated if designers communicated with their fabricators and had a better understanding of how PCBs are manufactured.

Altium Designer Increasingly Used for High-Speed Design

11/05/2018 | Andy Shaughnessy, Design007 Magazine
I recently met with Mark Forbes, the director of technical marketing at Altium, during the AltiumLive event in San Diego. We discussed Mark’s class on MCAD/ECAD collaboration and the success of AltiumLive, as well as the growth of Altium users who design high-speed PCBs with Altium Designer.

Karl-Heinz Fritz on Cicor’s DenciTec Technology

10/24/2018 | Nolan Johnson, I-Connect007
In a recent interview, Karl-Heinz Fritz, VP of technology at Cicor, discusses the business, DenciTec technology, the impact of tariffs on trade, and applications for 3D printing and additive manufacturing, including potential new opportunities for PCB designers.



Copyright © 2018 I-Connect007. All rights reserved.