Orange Co. DC Chapter Meeting: Flex and Rigid-Flex are Hot Topics


Reading time ( words)

On March 29, 2018, Scott McCurdy, president of the Orange County Chapter of the IPC Designers Council, hosted the quarterly Designers Council meeting at Harvard Athletic Park in Irvine, California. It was standing room only for this meeting of the largest Designers Council Chapter in the country. (McCurdy likes to remind us that OC has the most-attended DC chapter meetings in the US.)

A total of about 80 people were in attendance to hear two speakers at this Lunch ‘n’ Learn event. The first topic was Rigid-Flex PCB Design, presented by Vern Wnek, technical marketing engineer for Mentor. Wnek offered a variety of rigid-flex tips, and he fielded many relevant questions from the PCB designers who are seeing more applications and designs that require rigid-flex technology.

OCDC March image 1.JPG

The second topic was Flex for 5G: Why Materials Matter, which was presented by John Weldon, principal investigator from Dupont Circuit and Industrial Technologies. While Weldon admits that 5G is still a way off, he believes that the continual push for low Dk and heightened performance on flex demand a clear understanding of materials like polyimide and LCP.

The rise of flex and rigid-flex applications has created an increased hunger for information among PCB designers who need to keep up with the shifting landscape of issues related to these types of circuits. The large turnout at this week’s IPC Designers Council was a clear indicator of that thirst for information--and once again the Orange County Chapter delivered in spades.

Share




Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

01/20/2023 | Andy Shaughnessy, Design007 Magazine
We’re in the middle of show season, and it certainly “shows.” Thank you very much. I’m here all week. Don’t forget to tip your wait staff. This week, we published a variety of articles, columns, and news items, and much of it centered on trade shows. Technical Editor Dan Feinberg brings us a report from CES 2023. IPC announced the winners of the Best Technical Paper awards for IPC APEX EXPO 2023. And we have an interview with Altium’s Rea Callender about the company’s educational efforts at APEX and around the globe.

Altium Focuses on Design Education

01/16/2023 | I-Connect007 Editorial Team
Altium keeps its eyes on the designers of the future. The company has been working with colleges and universities for years, providing free seats of Altium Designer for the next generation of PCB designers and design engineers. At IPC APEX EXPO 2023, Altium will be providing software for the finalists in the IPC Design Competition just as it did last year. They offer a variety of other educational programs as well, including Upverter classes and a design competition that aims to address environmental change. Here, Rea Callender, Altium’s VP of education, discusses its educational programs and plans for the week of the show.

The Battle of the Boards

01/12/2023 | Patrick Crawford, IPC
Last year, IPC held its first-ever design competition at IPC APEX EXPO in San Diego. PCB designers from around the world competed in a series of heats during the months before the show, culminating in a showdown on the show floor between the top three finalists. Rafal Przeslawski, now with AMD, took home the top prize last year. This year, the competition is back for its sophomore year. I asked Patrick Crawford, manager of design standards and related programs for IPC, to “layout” the details on the design contest, including lessons learned in 2022 and what’s new for the 2023 competition.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.