TE Connectivity Collaborates with SnapEDA


Reading time ( words)

TE Connectivity (TE), a world leader in connectivity and sensors, and SnapEDA, the Internet’s first parts library for circuit board design, are collaborating to make more than 25,000 new digital models available to electronics designers, helping them bring their products to market faster.

Traditionally, designers have spent days creating models for each component in their designs, a tedious and time-consuming process. Some components, such as connectors, are particularly challenging to create models for due to their non-standard shapes, pitches, pads, and cutouts.

With this new collaboration, designers can now download free PCB footprints and symbols for TE components instantly, saving them days of time so they can focus on product optimization and innovation. The models are compatible with Altium, OrCAD, Allegro, Eagle, PADS, DXDesigner, and KiCad.

snapeda image smaller.JPG

These components include a wide range of connectors—such as USB, flexible printed circuit, modular, mobile battery, terminal, and jack connectors—as well as sensors, fuses, switches, relays, DC-DC converters, thermistors, resistors, and diodes.

“TE Connectivity has an extremely broad product portfolio. With everything from connectors to sensors, designers can now seamlessly select and design-in a wide variety of components into their designs by downloading the symbol and footprint for that product instantly,” said Natasha Baker, CEO of SnapEDA.

“As a global technology company with more than 7,000 engineers, we know how important these digital models can be for designers,” said David Sinisi, VP of Engineering Excellence at TE Connectivity. “We’re excited to partner with SnapEDA to make our models available free of charge so that it’s easier, faster and more convenient for engineers to optimize their products and bring them to market.”

The process is simple. Designers simply search for their desired product on the or TE Connectivity or SnapEDA websites, download the model, and then drag and drop it into their designs.

In addition to providing the models themselves, SnapEDA provides transparency into the standards that each model follows. For instance, designers can see whether a footprint follows TE Connectivity’s recommended dimensions, or industry standards (such as IPC-7351B). Each model also includes an automated report generated by SnapEDA’s patent-pending verification checker to help prevent common manufacturing issues.

About TE Connectivity

TE Connectivity Ltd. (NYSE: TEL) is a $13 billion global technology and manufacturing leader creating a safer, sustainable, productive, and connected future. For more than 75 years, our connectivity and sensor solutions, proven in the harshest environments, have enabled advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With 78,000 employees, including more than 7,000 engineers, working alongside customers in nearly 150 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedIn, Facebook, WeChat and Twitter

About SnapEDA

SnapEDA is the Internet’s first and leading parts library for circuit board design. By providing ready-to-use building blocks for circuit board design via our website and plugins for PCB design tools, we shave days off product development, so that designers can focus on product optimization and innovation. Over half a million engineers use SnapEDA each year, evaluating nearly two million electronic components. These engineers are making everything from medical devices, to electric airplanes. SnapEDA is funded by Y Combinator and private investors. Learn more at www.snapeda.com.

Media Contacts

TE Connectivity:                                                     
Rachel Quimby                                                       
610-893-9593                                                          
Rachel.quimby@te.com 

SnapEDA:
Natasha Baker
650-644-6199  
natasha@snapeda.com

 

Share




Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

01/20/2023 | Andy Shaughnessy, Design007 Magazine
We’re in the middle of show season, and it certainly “shows.” Thank you very much. I’m here all week. Don’t forget to tip your wait staff. This week, we published a variety of articles, columns, and news items, and much of it centered on trade shows. Technical Editor Dan Feinberg brings us a report from CES 2023. IPC announced the winners of the Best Technical Paper awards for IPC APEX EXPO 2023. And we have an interview with Altium’s Rea Callender about the company’s educational efforts at APEX and around the globe.

Altium Focuses on Design Education

01/16/2023 | I-Connect007 Editorial Team
Altium keeps its eyes on the designers of the future. The company has been working with colleges and universities for years, providing free seats of Altium Designer for the next generation of PCB designers and design engineers. At IPC APEX EXPO 2023, Altium will be providing software for the finalists in the IPC Design Competition just as it did last year. They offer a variety of other educational programs as well, including Upverter classes and a design competition that aims to address environmental change. Here, Rea Callender, Altium’s VP of education, discusses its educational programs and plans for the week of the show.

The Battle of the Boards

01/12/2023 | Patrick Crawford, IPC
Last year, IPC held its first-ever design competition at IPC APEX EXPO in San Diego. PCB designers from around the world competed in a series of heats during the months before the show, culminating in a showdown on the show floor between the top three finalists. Rafal Przeslawski, now with AMD, took home the top prize last year. This year, the competition is back for its sophomore year. I asked Patrick Crawford, manager of design standards and related programs for IPC, to “layout” the details on the design contest, including lessons learned in 2022 and what’s new for the 2023 competition.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.