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Byron Blackmore, product manager for electronics cooling at Mentor, will present the benefits of the new features in FloTHERM v12 in a webinar scheduled on September 21, 2017.
The webinar will feature the new functionality of FloTHERM, including a new and improved Command Center, and ho these new features can help increase your productivity. There will be an opportunity to ask questions at the end of the presentation.
You will also learn how to:
- Easily create, solve, and analyse model variants to fully explore and improve the thermal design.
- Copy/Paste data exchange with external tools, makes interaction and report generation quicker.
- Support for Phase Change Materials (PCM). Encapsulated PCMs have become a common thermal solution for consumer applications, and have been difficult to simulate in the past. FloTHERM now accepts latent heat and melt temperature as inputs and utilizes these values automatically in transient applications. The impact of PCMs on component and touch temperatures can now be fully explored and optimized in FloTHERM.
Andy Shaughnessy, PCBDesign007
I had the opportunity to talk with our contributor Doug Brooks recently. He has been doing some research on temperature effects on PCB traces over the last few years, and I wanted to check the status of his latest thermal efforts. He discussed his work with Dr. Johannes Adam, why temperature charts based on a trace in isolation are inaccurate, and how the industry remained so wrong about PCB temperatures for so long.
Bin Zhou, EDADOC
With the development of communication and IT industries and the ever-increasing demand for information analysis, many chip makers have racked their brains trying to provide customers with better technology, such as increased computing power and storage capacity of chips as well as diversifying their product offerings.
Dr. John Parry, CEng, Mentor
When designing a PCB, thermal issues are often locked in at the point of selecting and laying out the chip package for the board. After that, only remedial actions are possible if the components are running too hot. Assumptions made about the uniformity of the airflow in these early design stages can mean a disaster for the commercial viability of a PCB if those assumptions are incorrect. A different approach is needed to improve reliability and to optimize board performance. Dr. John Parry of Mentor explains.