Zuken USA Now Accepting Abstracts for ZIW 2018


Reading time ( words)

Zuken USA is now accepting abstracts for Zuken Innovation World (ZIW) 2018, to be held on April 23-25 in San Diego, California. The event includes a two-day technical conference and one-day exhibition to be held at the Coronado Island Marriott Resort & Spa.

ZIW annually offers more than 40 technical sessions including Zuken University classes showcasing how-to and best practices for the current and upcoming 2018 product releases. Zuken’s Expert Bar and the Technology Showcase provide one-on-one access to Zuken’s technical team and partner solutions.

Abstracts are now being accepted for 45-minute educational presentations. Suggested presentation topics include design disciplines such as PCB, IC packaging, wire harness, control panel and design data management. Industry trends, process innovation and new design methodologies are also topics of interest.

Presentations must be noncommercial in nature and should focus on technology, techniques or methodology. Case studies, how-to information and usage tips are favored and individual or team presentations are welcome.

Abstracts of 100-300 words and speaker biographies should be submitted to Zuken by November 3, 2017. For additional details and deadline information, visit the ZIW Speakers Corner.

About ZIW

Zuken Innovation World conferences take place annually at venues around the globe. The conferences bring together the best technical and business minds in the Zuken community for dynamic interaction that interests, educates and inspires our attendees. The ZIW Americas agenda will feature a mix of user presentations, Zuken University classes, discussion groups and lively networking events.

Share


Suggested Items

Excerpt: The Printed Circuit Designer’s Guide to…Flex and Rigid-Flex Fundamentals

06/20/2018 | Dave Lackey and Anaya Vardya, American Standard Circuits
The design process is arguably the most important part of the flex circuit procurement process. The decisions made in the design process will have a lasting impact, for better or worse, throughout the manufacturing cycle. In advance of providing important details about the actual construction of the flex circuit, it is of value to provide some sort of understanding of the expected use environment for the finished product.

Faster Board Speeds Demand Constraint-Driven Design

06/19/2018 | Ralf Bruening, Zuken
Using powerful constraint techniques can be a double-edged sword. While the design process is made much safer by including constraints, it is all too easy to over-constrain the design and make it impossible to complete routing and placement. Even paper design guidelines can make products uneconomic to produce unless a great deal of engineering knowledge is applied during the design.

Making the Most of PCB Materials for 5G Microwave and mmWave Amps

06/13/2018 | John Coonrod, Rogers Corporation
Ready or not, 5G is coming, and it will require the right circuit materials for many different types of high-frequency circuits, including power amplifiers. 5G represents the latest and greatest in wireless technology, and it will be challenging to design and fabricate, starting with the circuit board materials, because it will operate across many different frequencies, such as 6 GHz and below, as well as at millimeter-wave frequencies (typically 30 GHz and above).



Copyright © 2018 I-Connect007. All rights reserved.