Zuken USA Now Accepting Abstracts for ZIW 2018


Reading time ( words)

Zuken USA is now accepting abstracts for Zuken Innovation World (ZIW) 2018, to be held on April 23-25 in San Diego, California. The event includes a two-day technical conference and one-day exhibition to be held at the Coronado Island Marriott Resort & Spa.

ZIW annually offers more than 40 technical sessions including Zuken University classes showcasing how-to and best practices for the current and upcoming 2018 product releases. Zuken’s Expert Bar and the Technology Showcase provide one-on-one access to Zuken’s technical team and partner solutions.

Abstracts are now being accepted for 45-minute educational presentations. Suggested presentation topics include design disciplines such as PCB, IC packaging, wire harness, control panel and design data management. Industry trends, process innovation and new design methodologies are also topics of interest.

Presentations must be noncommercial in nature and should focus on technology, techniques or methodology. Case studies, how-to information and usage tips are favored and individual or team presentations are welcome.

Abstracts of 100-300 words and speaker biographies should be submitted to Zuken by November 3, 2017. For additional details and deadline information, visit the ZIW Speakers Corner.

About ZIW

Zuken Innovation World conferences take place annually at venues around the globe. The conferences bring together the best technical and business minds in the Zuken community for dynamic interaction that interests, educates and inspires our attendees. The ZIW Americas agenda will feature a mix of user presentations, Zuken University classes, discussion groups and lively networking events.

Share

Print


Suggested Items

IEEE’s Romanian SIITME Show a Success

01/09/2018 | Joe Fjelstad, Verdant Electronics
The 23rd annual IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) was held in Constanta, Romania, in October 2017. It attracted more than 190 participants from Romania, and 13 other counties. While there might be some who question the suitability of Romania as a venue for such a conference, the country has a long technological history and has produced some top innovators and pioneers in aviation including Aurel Vlaicu, Traian Vuia, Henri Coanda, who prototyped an early jet aircraft in 1910.

Romania’s PCB Design Students Compete at TIE 2017

06/19/2017 | Gaudentiu Varzaru, Politehnica University of Bucharest
During the last week in April, the 26th Interconnection Techniques in Electronics (TIE) show was held at the Gheorghe Asachi Technical University in Iasi, Romaina, a wonderful hill town not unlike Rome. The event, a convention for the Romanian electronic packaging community, included a series of actions designed to draw smart young students to the electronics industry, which is clearly growing. Participants had only four hours to create this PCB design, which was generated by a team of professionals from Continental Automotive Romania Timisoara.

Romanian Electronics Industry Celebrates 25th Anniversary of TIE

06/15/2016 | Joe Fjelstad, Verdant Electronics
The high point of the Romanian TIE event was a competition among the students to design and layout a circuit for a specific product meeting to the maximum extent possible a long list of design and product requirements. The students had four hours to deliver a design which was then evaluated by a team comprised of a university instructor and a seasoned industry engineer.



Copyright © 2018 I-Connect007. All rights reserved.