I-Connect007 Launches ‘The Printed Circuit Designer’s Guide to… Signal Integrity by Example’ Micro eBook

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I-Connect007 is excited to announce the release of the next book in our micro eBook Design series: The Printed Circuit Designer’s Guide to… Signal Integrity by Example.

The Printed Circuit Designer’s Guide to…is an ongoing series of micro eBooks specifically dedicated to the education of PCB designers. This book series has become the gold standard for people seeking the most relevant design information available.
 
The latest title in this new line of eBooks, The Printed Circuit Designer’s Guide to… Signal Integrity by Example, is authored by Fadi Deek of Mentor, a Siemens business. This free micro eBook details the importance of eliminating signal integrity challenges. The chapters explore four possible signal integrity problems using an understanding of essential signal integrity principles.
 
“This eBook looks under the hood and identifies two often neglected sources of reflections: the package model and the input gate capacitance of the receiver. Considering these two features, many of the mysterious ringing effects are instantly understood,” says Dr. Eric Bogatin, dean of the Teledyne LeCroy Signal Integrity Academy.
 
This eBook has something to offer any engineer interested in identifying problems, root causes, and solutions surrounding electronic transmissions.
 
We welcome you to download this book for free by visiting www.I-007eBooks.com/SIE. You can find all of the titles in our eBook series by visiting our library at www.I-007eBooks.com.
 
Here are some other exciting titles in our micro eBook series:

• The Printed Circuit Buyer’s Guide to… AS9100, by Imagineering, Inc.  

• The Printed Circuit Designer’s Guide to… Design for Manufacturability (DFM), by Altium  

• The Printed Circuit Designer’s Guide to… Flex and Rigid-Flex Fundamentals, by American Standard Circuits  

• The Printed Circuit Designer’s Guide to… Secrets of High-Speed PCBs – Part 1,by Polar Instruments

• The Printed Circuit Designer’s Guide to… Secrets of High-Speed PCBs – Part 2,by Polar Instruments

• The Printed Circuit Assembler’s Guide to…Conformal Coatings, by Electrolube

• The Printed Circuit Designer’s Guide to… Power Integrity by Example, by Mentor, a Siemens Business – coming soon!

• The Printed Circuit Designer’s Guide to…Executing Complex PCBs, by Freedom CAD – coming soon!

• The Printed Circuit Designer’s Guide to…Documentation, by DownStream Technologies – coming soon!

• The Printed Circuit Designer’s Guide to…Thermal Management, by Ventec International Group – coming soon!  

We hope you enjoy The Printed Circuit Designer’s Guide to… Signal Integrity by Example in eBook format, if you'd like to order this book from our print-on-demand service, click here.
 
For more information, contact:

Barb Hockaday
I-Connect007 I-007eBooks

03/09/2023 | I-Connect007 Editorial Team

What happens when die sizes shrink? As IPC design instructor Kris Moyer explains, quite a bit. Shrinking silicon can mean rising signal speed and rise times, and traditional PCB designers may find themselves dealing with problems formerly only seen by RF engineers. We asked Kris to discuss the pros and cons of silicon shrinkage and some of the techniques and trade-offs that PCB designers and design engineers need to understand as they find themselves entering the RF arena.

12/08/2022 | Nolan Johnson, I-Connect007

Nolan Johnson checks in with Polar’s Martyn Gaudion on the evolving needs of global PCB manufacturing markets in a post-pandemic world, where generating accurate PCB specification documentation is essential to successfully navigating today's rampant supply chain constraints. Polar has positioned itself to meet these needs through agile software product developments that allow OEMs and fabricators to simulate material interactions and end-product specifications, including in-demand features like a comprehensive "structure view" that allows users to visualize all the transmission lines on a given a PCB. Though keeping pace with the demands of a rapidly growing industry has been challenging, Polar's commitment to innovation has kept its software suite ahead of the curve.

08/05/2022 | I-Connect007 Editorial Team

I recently spoke with Todd Westerhoff, product marketing manager for signal integrity software tools at Siemens. We discussed a new capability called HyperLynx Apps that offers a new take on traditional signal and power integrity analysis, and how that fits in with the Siemens plan to put SI and PI tools into the hands of more designers early in the design cycle.