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Register Now for European Zuken Innovation World
May 17, 2017 | ZukenEstimated reading time: 1 minute
If you haven’t yet inked a date for your local European ZIW conference, then it's about that time. This your one chance to be part of the annual gathering of the electrical and electronic design community in a European city near you. Take advantage of the following opportunities at your local ZIW show:
- Networking
- Information sharing
- Catching up with old friends/colleagues
It’s also the best place to get a comprehensive update on where Zuken is going as a company on a global, regional and local level, in your own language.
- Our focus on customer challenges and next generation business and design issues
- Our investments
- Our commitment to innovation
You’ll also get product visions across the electrical and electronic design environment. We don’t publish these anywhere so you can only see them in person for:
- CR-8000
- CADSTAR and Next Generation CADSTAR
- E3.series
Finally, it’s your chance to listen to other users talk first-hand about their experiences using Zuken software. You can’t get that sort of candid discussion and learning opportunity online.
So take the chance to go live. You never know what you’ll learn.
Here are the dates for your calendars.
- Disney (Marne La Vallée), France – June 8
- Bologna, Italy – June 13
- Feusisberg/Zurich, Switzerland – June 26
- Coventry, United Kingdom – September 27
Don’t miss out!
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iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.