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Last year was a watershed year for the IPC-2581 standard. A broad cross-section of printed circuit board software suppliers, OEMs, equipment suppliers, manufacturers, and service suppliers, having implemented IPC-2581 both in trial and in production use, provided significant positive feedback to the IPC 2-16 committee regarding their experiences utilizing the standard to produce PCB products.
Working closely with the IPC-2581 Consortium's Technical Committee, many of these adopters proposed feature enhancements leading to IPC-2581B Amendment 1, published in January of this year. This release supports the most comprehensive set of industry requirements for printed circuit board fabrication, assembly, and test in a data-centric, open, license-free, industry driven standard format. On behalf of the IPC 2-1-6 Committee, I would like to extend our sincere gratitude to all who participated in this effort.
That stated, we recognize there is still more work to be done. Moving forward, the 2-16 technical committee is actively soliciting input from industry for the next major revision of the IPC-2581 standard. Regardless of your present IPC-2581 adoption status, we want to hear from each of vou. The objective of this next round of enhancements is to eliminate risk and inefficiency in your day-to-day operations, and streamline your production processes. To accomplish this objective, we need to understand where each of you experiences "bottlenecks" requiring inordinate amounts of time and effort to be expended to collate, review, and interpret your customer's drawings, documents, and data. This may include activities necessary to transform, translate, and re-enter the information, and/or where you encounter the need to pause design or manufacturing operations to solicit additional information from the customer/supplier to insure their requirements/information are adequately understood and verified. The intent is for IPC-2581 files to be complete and consistent in the initial delivery, and that its content be structured in a machine-readable form to enable automated design and manufacturing operations from producer to consumer throughout the product life cycle. This, once achieved, eliminates manual, labor-intensive and error-prone human interactions wherever they exist.
Industry-proposed enhancements are already being captured by the technical committee. Examples include:
- Support for bareboard stack-up structures including multiple zones for flex and rigid-flex
- Enhanced ability to communicate comprehensive requirements for impedance-controlled elements
- Representation for fabrication and assembly including embedded component technologies
- Support for multi-level bond pads and wire-bond constructs
- Enhanced support for complex drilled and milled features
- Enhanced support for complex via structures
- 3D model support for conveying complex assembly details
- Enhanced DFx collaboration
- Embedded schemas, external links, and other methods of defining comprehensive requirements for a product
- Support of variant bills of materials
- Enhanced support for polarized parts
Please take a moment to consider this solicitation for input. lf you are the correct point of contact in your organization, I would respectfully request a response regarding your interest in participating in the requirements definition process. lf there are other subject-matter experts within your organization better suited to discuss these specific (or any other) requirements, please forward this request to them and, if deemed appropriate, pass their contact information to me to plan follow-up with them directly.
Send all of your feedback to me by clicking here.
Gary J. Carter
IPC 2-16 Committee Co-Chair
01/20/2023 | Andy Shaughnessy, Design007 Magazine
We’re in the middle of show season, and it certainly “shows.” Thank you very much. I’m here all week. Don’t forget to tip your wait staff. This week, we published a variety of articles, columns, and news items, and much of it centered on trade shows. Technical Editor Dan Feinberg brings us a report from CES 2023. IPC announced the winners of the Best Technical Paper awards for IPC APEX EXPO 2023. And we have an interview with Altium’s Rea Callender about the company’s educational efforts at APEX and around the globe.
01/06/2023 | Andy Shaughnessy, Design007
The youngsters are back in school, and we’re all back to work. The water is back on for most of us in Atlanta; when temps dropped down to 8 degrees Fahrenheit, our pipes started bursting left and right. After a Christmas dinner with no water, I have a new appreciation for H2O. It’s been a busy week, and we published a variety of articles, columns, and news items. In this week’s top five, we have news about the market in Southeast Asia, a look at what the CHIPS Act really entails, a deep dive into CMMC, and a peek at how printed electronics developers are using flexible circuit concepts to facilitate PEC. We also say goodbye to a Top Gun PCB designer who left us way too soon.
12/29/2022 | Andy Shaughnessy, Design007 Magazine
While it may be traditionally considered a PCB fab and assembly show, IPC APEX EXPO is quickly becoming a destination for PCB designers and design engineers. Flipping through this year’s schedule, I counted 15 Professional Development and Technical Conference classes that focus on PCB design, as well as several fabrication classes that many of you should probably take. I checked in with Carlos Plaza, IPC’s senior director of educational development, to discuss the organization’s drive to present more PCB design curriculum at the upcoming show and how the show can give designers the tools they need to overcome the many challenges currently facing the industry.