DesignCon 2017 Announces Heidi Barnes as Winner of the Engineer of the Year Award


Reading time ( words)

DesignCon today announced Heidi Barnes of Keysight Technologies as the recipient of the 2017 Engineer of the Year Award. Selected for her dedication to problem solving and enthusiasm for leading and collaborating with teams, Barnes was awarded earlier today at DesignCon. The conference took place this week, January 31 – February 2, at the Santa Clara Convention Center. For additional information please visit: designcon.com.

"I am thrilled to be named the recipient of the Engineer of the Year Award by DesignCon," said Heidi Barnes, senior applications engineer for high speed digital applications in the EEs of EDA Group, Keysight Technologies. "We've made tremendous strides in this space and it's an honor to receive an award where industry luminaries including Eric Bogatin and Michael Steinberger were also named winners." 

This prestigious award recognizes professionals in the engineering community that lead, develop and contribute to the design and test of chips, boards or systems. Award nominees were put forth by peers, finalists were carefully selected by the Design News editorial staff and the winner was voted for by the DesignCon community. With this achievement, Barnes will be provided with a $10,000 grant or scholarship that she has chosen to present to Harvey Mudd College. 

Barnes is known for her ability to solve problems in the signal integrity (SI) and power integrity (PI) field for Fortune 500 companies, serves on the DesignCon Technical Program committee and leads conference planning as a co-chairperson for the test and measurement track. At DesignCon 2017, Barnes presented in technical sessions and tutorials on SI and PI, and participated in various panels. 

"Heidi continuously proves her commitment to SI and PI with her involvement in DesignCon planning and presenting, and received an impressive seven nominations for the 2017 Engineer of the Year award," said Naomi Price, conference content director, DesignCon. "Her colleagues hold her in the highest regard for her ability to lead teams and develop thoughtful, logical and technical ideas, as she designs and works with some of the most complex channels and tools in the industry. Given these characteristics, it's no surprise she was selected as the award winner. I'd like to congratulate Heidi on receiving this recognition, and also congratulate the other award finalists." 

Finalists for the 2017 Engineer of the Year award include Istvan Novak, senior principal engineer at Oracle, Krishnaswamy Ramkumar, senior technical staff member at Cypress Semiconductor, Ransom Stephens, principal at Ransom's Notes, and Yuriy Shlepnev, CEO at Simberian Inc.

For more information on DesignCon 2017 Engineer of the Year Award, please click here.

DesignCon Media & Association Partners

DesignCon is proud to partner with the following publications: Aspencore, Chinese American Semiconductor Professional Association (CASPA), Chip Design Magazine, ConnectorSupplier.com, EDA Café, Electronic System Design Alliance, Embedded Systems Engineering, How2Power, IBIS Open Forum, Microwave Journal, Signal Integrity Journal. 

About DesignCon 

DesignCon is the world's premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country. This three-day technical conference and expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry's leading experts and solutions providers. More information is available at: designcon.com/santaclara. DesignCon is organized by UBM Americas, a part of UBM plc (UBM.L), an Events First marketing and communications services business. For more information, visit ubmamericas.com.

Share




Suggested Items

Altimade Puts Designers and Manufacturers Together

06/24/2022 | Andy Shaughnessy, Design007 Magazine
Despite all of the talk about the need for communication between designers and manufacturers, many PCB designers still do not talk with their manufacturers for a variety of reasons. Altium and MacroFab aim to change this dynamic. In this interview, Ted Pawela, chief ecosystem officer of Altium and head of Altium’s Nexar Business Unit, and MacroFab CEO Misha Govshteyn, discuss the new Altimade manufacturing service that Altium is introducing in partnership with MacroFab. Ted and Misha provide an overview of the Altimade process, how it links designers to fabricators, assembly providers, and component distributors, and they explain how it could pave the way for true design with manufacturing, or DWM.

The Survey Said: Why Don’t You Know Your Fabricator?

06/23/2022 | I-Connect007 Editorial Team
When we want to find out what challenges our readers are facing, we just ask. And they don’t mind sharing—the good, the bad, and the ugly. In a recent survey, we asked our PCB designer readers, “Why don’t you know who is going to manufacture your boards?” Here are some of more interesting replies we received, edited slightly for clarity. Do you see yourself in these replies?

Producing Diverse Designs in Concert With Manufacturing

06/16/2022 | Scott Miller, FreedomCAD Services
There is a new acronym bubbling up in the design world: DWM, which stands for “design with manufacturing.” Why is this different than design for manufacturing, or DFM? With DWM, the emphasis is on integration between the design team and the manufacturers during the design process. DWM is much more than that. We are tasked with producing designs that meet various technical requirements, yet are cost-effective and manufacturable. We provide this service to hundreds of customers who have varying degrees of processes, tools, and manufacturing partners. Given this diversity, we have recognized the importance of designing with manufacturing to achieve the product development goals of manufacturability and technical excellence.



Copyright © 2022 I-Connect007. All rights reserved.