-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Reliability and Harmonization of Global Standards at Forefront of EIPC Efforts
March 18, 2015 | Pete Starkey, I-Connect007Estimated reading time: 7 minutes
Weinhold: Well I think we have to go back a few years. The IEC standards were built around the national standards from Britain, Germany, and other countries. Then in the late 70s, IPC got involved and Dieter Bergman did an outstanding job at harmonizing the IEC and the IPC standards over many years. Now, we don't see this kind of harmonization any more, and it could lead to the point where these standards are drifting away from each other, which is not good for the industry in general. So new standards, for example IEC standards, are proposed by the Asian countries which represent approximately 90% of the global PCBs that are manufactured. So, we could easily lose leadership if we don't make an effort to harmonize these standards.
Starkey: I understand. Thank you, Michael. Alun, you have another EIPC conference coming up in the summer. Where will this be, and what will be the main focus?
Morgan: It will be in June in Berlin, I believe the 18th and 19th of June. We've organized a visit to the Fraunhofer Institute's new laboratory, which Michael visited in December last year. It is very impressive and has been totally rebuilt.
Starkey: This is where a lot of innovations originated, particularly in embedded component technology.
Morgan: Absolutely. Professor Lang has been really instrumental in bringing these advancements on. And they have really an extremely comprehensive laboratory there, especially in terms of signal integrity testing, which is another theme that we're very interested in following. So I think we will certainly have that as a major theme. We chose Berlin for two primary reasons. One, it's easily accessible. It's also in Germany, which is where, say, 47% of the PCBs in Europe are made, so this is a good location for the local market. And secondly, we were able to get the visit with Fraunhofer, which is going to mean so much to our organization and to our industry over the years. It's brought many, many projects out of the research laboratories into really practical applications, and I think that's something we should be very grateful for.
Starkey: Alun and Michael, it's been nice to talk to you. Thank you very much indeed for your time. Have an enjoyable show and have a successful next EIPC conference.
Video from EIPC Winter Conference, Munich 2015
Suggested Items
DuPont Showcases AI Innovations Featuring Advanced Interconnects at 2024 International Electronic Circuits Exhibition
05/13/2024 | DuPontDuPont announced it will showcase its comprehensive range of advanced circuit materials and solutions at the 2024 International Electronic Circuits Exhibition in Shanghai. With a product portfolio that includes fine line, signal integrity, power and thermal management, DuPont will exhibit at Booth #8L06 at the National Exhibition and Convention Center (NECC) from May 13 to 15.
MKS’ Atotech to Participate in ECTC
05/10/2024 | MKS’ AtotechAt this year’s 74th IEEE Electronic Components and Technology Conference (ECTC), MKS’ Atotech will present and demonstrate its latest product and service innovations.
The Chemical Connection: Reducing Etch System Water Usage, Part 2
05/02/2024 | Don Ball -- Column: The Chemical ConnectionIn my last column, I reviewed some relatively simple ways to reduce water usage in existing etch systems: cutting down cooling coil water flow, adding chillers to replace plant water for cooling, lowering flow rate nozzles for rinses, etc. This month, I’ll continue with more ways to control water usage in your etcher. Most of these are not easily retrofittable to existing equipment but should be given serious consideration when new equipment is contemplated. With the right combination of add-ons, it is possible to bring the amount of water used in an etch system to almost zero.
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.