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Current IssueBreaking High-speed Material Constraints
Do you need specialty materials for your high-speed designs? Maybe not. Improvements in resins mean designers of high-speed boards can sometimes use traditional laminate systems. Learn more in this issue.
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This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
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Ansys Helps Accelerate Development of TMYTEK's Next-Gen mmWave Technology for 5G, Satellite Communications
July 17, 2023 | PRNewswireEstimated reading time: 1 minute
Leading mmWave technology developer TMY Technology, Inc. (TMYTEK) uses Ansys simulation software to improve the performance, efficiency, and quality of its antenna-in-package (AiP) designs through rapid design verification. TMYTEK relies on numerous Ansys solvers to improve on its next-generation mmWave technologies for 5G and satellite communications quickly — significantly reducing associated development costs.
AiP technologies integrate complex radio frequency components with their related circuitry into a single chip design — an important development in the miniaturization of the radio systems required for consumer electronics and various mmWave applications supporting 5G networks. However, application complexities and ever-increasing market demands for smaller, more compact electronics require engineers to manage and validate their AiP designs more efficiently to reduce cost and time to market.
TMYTEK relies on Ansys solutions to develop its next-generation mmWave technologies, including its 5G open radio access network (O-RAN), small cell antenna, and satellite communication user terminal electronic steering antenna designs. Ansys helps TMYTEK deliver precise results in rapid AiP performance verification, from fast, predictively accurate thermal results, to parasitic parameter calculations, to process automation.
"Using Ansys, we can offer comprehensive design services to our customers, accelerate R&D and speed time to market," said Su-Wei Chang, founder and president at TMYTEK. "Ansys solutions enable us to comprehensively simulate and measure AiP performance faster — spanning antenna and radio-frequency module parasitic parameters, thermal activity, signal and power integrity, and customized system integration design performance. This results in greater efficiency up and down the development chain, freeing time up for future projects."
"As the demand for novel mmWave solutions continues to grow, AiP design complexity and time-to-market requirements present major challenges for our customers," said John Lee, vice president and general manager of the electronics, semiconductor and optics business unit at Ansys. "Ansys simulation solutions drive the rapid innovation behind these novel mmWave technologies, such as TMYTEK's, shaping the future of 5G antenna design."
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The Shaughnessy Report: Unlock Your High-speed Material Constraints
05/15/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportThe world of PCB materials used to be a fairly simple one. It was divided into two groups: the “traditional” laminates, often called FR-4, and the high-speed laminates developed especially for high-speed PCBs. These were two worlds that usually didn’t collide. But then traditional laminates started getting better, and high-speed designers and design engineers took notice and started to reconsider what FR-4 could be used for.