-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Book Excerpt: 'The Printed Circuit Designer’s Guide to… High Performance Materials', Chapter 1
March 17, 2022 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
Evolution of the Resin System
Most basic resin systems have been around for a long time. Here is a little timeline of developments through more recent introductions.
- In 1907, the first laminate was made with pure phenolic resin by Westinghouse in Pittsburgh, Pennsylvania. Formica became the first true sheet laminate.The first application—a radio by Paul Eisler in 1936—led to practical manufacturing for military radios in the U.S., and use of single-sided copper-clad phenolic laminate started in about 1943 using paper and cotton as the structural component. Epoxy resin was introduced shortly after in 1947.
- Still reigning as the lowest loss resin system, a PTFE, RT/Duroid® was introduced in 1949.
- The first polyimide was discovered in 1908 by Bogart and Renshaw. However, the high heat-resistant polyimide laminate material was brought to the market in 1951.
- Isola began production of copper-clad laminate in 1956.
- Epoxy-based laminate systems followed around 1960 and used woven E-glass fabric.
- Shortly after, G-10 epoxy laminate (non-flame retardant epoxy resin plus E-glass) and a flame-retardant epoxy version called FR-4 (flame-retardant epoxy resin plus E-glass) were introduced in 1968.
From that time forward, there have been various blends, such as PPO (polyphenylene oxide)/epoxy, CE (cyanate ester)/epoxy, and polyimide/epoxy, that were created to balance properties of pure resin systems to achieve specific enhanced properties. Each new resin system was built on learning from previous products. Resin system developments for high heat applications such as LED lighting, ultra-thin non-reinforced films for capacitance and halogen-free systems to meet RoHS and REACH environmental requirements, continue to be developed to address the performance and reliability needs. With each new need, laminate material manufacturers go into the lab and see what new raw material can be used to improve resin system performance.
The process of developing a new resin system requires deep knowledge of how the PCB will be manufactured. PCB designers are most concerned with assembly process capability, long term reliability, thermal cycling performance, CAF resistance, and electrical performance, therefore, all these attributes must be balanced within the design of a resin system. The market requirements mean that laminate manufacturers must continue to research available options that will provide incremental improvements to the resin system performance.
Suggested Items
The Chemical Connection: Reducing Etch System Water Usage, Part 2
05/02/2024 | Don Ball -- Column: The Chemical ConnectionIn my last column, I reviewed some relatively simple ways to reduce water usage in existing etch systems: cutting down cooling coil water flow, adding chillers to replace plant water for cooling, lowering flow rate nozzles for rinses, etc. This month, I’ll continue with more ways to control water usage in your etcher. Most of these are not easily retrofittable to existing equipment but should be given serious consideration when new equipment is contemplated. With the right combination of add-ons, it is possible to bring the amount of water used in an etch system to almost zero.
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.
ENNOVI Introduces a New Flexible Circuit Production Process for Low Voltage Connectivity in EV Battery Cell Contacting Systems
04/03/2024 | PRNewswireENNOVI, a mobility electrification solutions partner, introduces a more advanced and sustainable way of producing flexible circuits for low voltage signals in electric vehicle (EV) battery cell contacting systems.
Heavy Copper PCBs: Bridging the Gap Between Design and Fabrication, Part 1
04/01/2024 | Yash Sutariya, Saturn Electronics ServicesThey call me Sparky. This is due to my talent for getting shocked by a variety of voltages and because I cannot seem to keep my hands out of power control cabinets. While I do not have the time to throw the knife switch to the off position, that doesn’t stop me from sticking screwdrivers into the fuse boxes. In all honesty, I’m lucky to be alive. Fortunately, I also have a talent for building high-voltage heavy copper circuit boards. Since this is where I spend most of my time, I can guide you through some potential design for manufacturability (DFM) hazards you may encounter with heavy copper design.