-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
April Issue of The PCB Design Magazine Available Now
April 14, 2017 | Andy Shaughnessy, PCB Design007Estimated reading time: 1 minute
The April 2017 issue of The PCB Design Magazine is available now. This month, our expert contributors discuss the current state of high-speed materials, and the growth of low-loss laminates that pick up where FR-4 falls short.
Choosing the right material for your PCB was so simple a few decades ago. But today, designers often must select an advanced low-loss PCB material with low Df and Dk values—hopefully one that isn’t prohibitively expensive or terribly difficult for fabricators to register during lamination.
So, this month, we feature interviews with a variety of experts on advanced materials. Summit Interconnect’s Gerry Partida and All Flex Flexible Circuits’ Joe Menning spoke with our editorial team about the state of advanced materials from the fabricators’ viewpoint. Craig Davidson of TTM explains the company’s pursuit of embedded optical interconnect and the challenges surrounding optical PCBs. Bruce Mahler of Ohmega Technologies examines Ohmega’s resistive material technology and some of the drivers and issues in that segment of the industry. And APCT’s Steve Robinson discusses his company’s focus on working with PCB designers and engineers to create advanced, high-speed PCBs. Plus, columnist John Coonrod of Rogers Corporation discusses some of the challenges and remedies for woven glass weave effect.
We also have columns by our contributors Barry Olney of In-Circuit Design, and Alistair Little of Electrolube, as well as an interview with Lawrence Romine of Altium and an article about the TIE PCB design conference in Romania, coming up April 25-27.
Read the April issue of The PCB Design Magazine, now on the virtual newsstand and available for delivery in your e-mail inbox by subscribing here or by registering for myIConnect007 where you can manage all your subscriptions and gain instant access to our eBook library.
Suggested Items
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.