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This article will present a hybrid manufacturing process to manufacture FHE systems with a two-layer interconnect structure utilizing screen printing of silver conductive ink, filled microvias to connect ink traces at the different layers, and use of the traditional reflow process to attach the semiconductor chips to the printed substrates.
In my previous column series on stackup planning, I described the traditional stackup structures that use a combination of signal and power/ground planes. But to achieve the next level in stackup design, one needs to not only consider the placement of signal and plane layers in the stackup, but also visualize the electromagnetic fields that propagate the signals through the substrate.
When you send your design for manufacturing, your partner does not know what type of device the board will be part of nor the conditions in which it will have to perform. It’s common for harsh environments or exposure to mess up...
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