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Coefficient of thermal expansion (CTE) is typically considered for PCB reliability, but it can also have an impact on circuit performance for applications exposed to varying temperatures. Due to CTE, a circuit will change physical dimensions when the temperature changes. If the circuit has small features or tightly coupled features, the physical change of the circuit dimensions can cause a shift in electrical performance.

Brooks' Bits: Your Traces Have Hot Spots!

August 24, 2016 | Douglas G. Brooks, PhD

The reasons for the temperature variation at high temperatures is not too hard to understand. There may be minor contamination under the trace or in the copper that accounts for it. Certainly, at higher temperatures (say above about 300°C) the board may begin to delaminate, severely disrupting its cooling characteristics. There may be small variations in trace width or thickness that help account for the delam, and these effects would be randomly distributed along the length of the trace.



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