Development of Flexible Hybrid Electronics

August 14, 2019 | Weifeng Liu, PhD, Flex

This article will present a hybrid manufacturing process to manufacture FHE systems with a two-layer interconnect structure utilizing screen printing of silver conductive ink, filled microvias to connect ink traces at the different layers, and use of the traditional reflow process to attach the semiconductor chips to the printed substrates.

Beyond Design: Stackup Planning, Part 5

August 14, 2019 | Barry Olney, In-Circuit Design Pty. Ltd.

In my previous column series on stackup planning, I described the traditional stackup structures that use a combination of signal and power/ground planes. But to achieve the next level in stackup design, one needs to not only consider the placement of signal and plane layers in the stackup, but also visualize the electromagnetic fields that propagate the signals through the substrate.



Connect the Dots: Five Best Practices to Ensure Manufacturability

August 1, 2019 | Bob Tise, Sunstone Circuits

When you send your design for manufacturing, your partner does not know what type of device the board will be part of nor the conditions in which it will have to perform. It’s common for harsh environments or exposure to mess up...

Education and Training Featuring:

CA Design’s Bob Chandler on Training PCB Designers, a conversation with Bob Chandler
Pulsonix is Bullish on Next-gen Designers, a conversation with Bob Williams
Teaching Young Girls About STEM Careers, a conversation with Brooke Campbell
Industry Experts Talk Flex Design, a conversation with Mike Creeden, Chris Hunrath, and Steven Bowles
Flexible Circuits Go to College, by Joe Fjelstad, Verdant Electronics
SMTA Pilot Program for Emerging Engineers, by Tara Dunn, Omni PCB

Copyright © 2019 I-Connect007. All rights reserved.