With the development of communication and IT industries and the ever-increasing demand for information analysis, many chip makers have racked their brains trying to provide customers with better technology, such as increased computing power and storage capacity of chips as well as diversifying their product offerings.
Thermal management expert Johannes Adam, PhD, was kind enough to take the train from his home in Leimen, Germany to meet with me during productronica in Munich. He is the creator of TRM (Thermal Risk Management) software and contributor, with Douglas G. Brooks, of "PCB Trace and Via Currents and Temperatures: The Complete Analysis, 2nd Edition." He’s also working on his own book on thermal management. Johannes sat down for an interview, and I asked him to share his views on the current state of thermal management for PCBs, and what the industry can do to put the spotlight on what’s hot in PCBs.
What’s New in EDA: The Experts Discussion, a conversation with Martyn Gaudion, Rick Almeida, Hemant Shah and Mark Hepburn
IoT: Let’s Put the “A” Back in EDA, by Ben Jordan
Fully Automated Schematic Verification, by Craig Armenti
Ucamco Focuses on Improving Gerber, CAM Automation, a conversation with Karel Tavernier
Pulsonix Ready for 2018, a conversation with Ty Stephens