FEATURED NEWS AND INFORMATION:
FEATURED ARTICLES AND COLUMNS:

Digital Transformation: Enabling a Digital Thread Across IC/Package/PCB Design

May 17, 2022 | Team Siemens, Siemens Digital Industries Software

If you’ve been keeping up with the electronics trade news, you’re probably aware that there is a slow but steady growth of ICs now being implemented in 2.5D or 3D IC configurations. Over the last decade, these device configurations have been steadily growing in popularity in highest-capacity FPGAs, high-bandwidth memory devices, and processors targeting high-performance computing and datacenters. But with Apple’s recent announcement of M1 Ultra—which will power its new generation of desktop and laptop computers—the age of 3D IC is quickly coming upon us and may become the norm rather than the exception. So, it behooves us to ask, what if any impact will this have on PCB systems design?

Target Condition: Happier in a Vacuum: The Design Narcissist

May 17, 2022 | Kelly Dack, EPTAC Corporation

Without a doubt, arrogant workplace attitudes have existed in this industry over the decades. Hopefully, as a profession, PCB designers are moving forward and accepting the fresh, positive signals from the many training leaders and trade organizations emphasizing the importance of stakeholder awareness. These visionary champions are conveying the message that we are better off when we look out for all our important industry stakeholders’ functions collectively, as we perform within our personal areas of expertise.





MORE ARTICLES

COLUMNS:

We have reached the end of this series regarding the five pillars of the component library. We now have a robust library that provides the required resources for the ever-changing industry. Above that is having a flexible library to...

The New Chapter: Prepping for an Internship? Three Tips to Shore Up Your Skills

May 9, 2022 | Hannah Nelson & Paige Fiet, IPC Student Directors

When I first logged onto my computer in summer 2021, I was beyond nervous. I had just accepted the role of corporate intern at Caterpillar Inc., where I would be working on the product service development team. As I started my...

Designers Notebook: Design for Test, Part 3

May 4, 2022 | Vern Solberg, Consulting

The general trend in electronics is to improve performance and minimize product size, often leading to more complex printed circuit board and higher component density. Semiconductor packaging in particular, have become more complex,...

Are You Designing in a Vacuum? Featuring:

  • Are You Designing in a Vacuum? by Andy Shaughnessy
  • Tips for Designing in—and Escaping From—the Vacuum, with Jen Kolar and Cory Grunwald
  • Designing in a Vacuum Q&A: Mark Thompson, with Mark Thompson
  • Happier in a Vacuum: The Design Narcissist, by Kelly Dack
  • Designing in a Vacuum Q&A: From a Service Bureau Perspective, with Nick Barbin
  • Designing in a Vacuum Q&A: Carl Schattke, with Carl Schattke
Copyright © 2022 I-Connect007. All rights reserved.