-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueOpportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
Manufacturing Know-how
For this issue, we asked our expert contributors to share their thoughts on the absolute “must-know” aspects of fab, assembly and test that all designers should understand. In the end, we’re all in this together.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Orange Co. Designers Council Meeting Draws A Packed House
September 6, 2016 | Judy Warner, I-Connect007Estimated reading time: 1 minute
On September 1, the Orange County Chapter of the IPC Designers Council filled the beautiful, modern presentation room at Alcon Labs in Irvine, California. (Thanks to Jay Wellman, PCB design supervisor at Alcon).
Speaker John Stine, VP of operations at Summit Interconnect’s Anaheim facility (parent company of KCA Electronics), gave a presentation on flex and rigid-flex design and fabrication. At least 75 electronics professionals listened as Stine, an expert in flex and rigid-flex technologies, discussed proper trace geometries, grounding, cover lay, adhesives, signal integrity, impedance control, book-bindings and much more in his 80-minute presentation.
The constant need to reduce size, weight and power (SWaP) is driving the increased use of flex materials, which are lighter than their rigid counterparts and can be folded (thus reducing the footprint), and flex eliminates the need for heavier cables for interconnects. This is especially applicable for the mil/aero and defense applications for which KCA has been specializing in for many years. Stine also illustrated how layering flex substrates with an internal stiffener can provide a very low-loss solution for high-speed applications (RF/microwave/MMW) in a way that rivals or exceeds the performance found in high speed rigid laminates.
The dialog between Stine and the designers stayed active throughout the lunch-and-learn presentation, and the content appeared to be very practical and immediately applicable to the attendees. Summit Interconnect CEO and President Shane Whiteside was in attendance and generously donated several raffle prizes on behalf of Summit/KCA, which were drawn at the end of the event.
I thoroughly enjoy these Designers Council meetings every time I attend. And a special thanks to Orange County Chapter President Scott McCurdy, who has been a tireless servant of our local design and electronics community. Those of us fortunate enough to live in SoCal continue to reap the benefits of his leadership. I’ll definitely be back to cover the next Designers Council meeting.
Suggested Items
IMI Taps New Opportunities to Sustain Grit in China
03/28/2024 | IMIIntegrated Micro-Electronics, Inc. (IMI), Joey S. Bantatua, IMI China’s head of operations and general manager was recently interviewed by Asia Electronics Industry (AEI) magazine where he talked about the prospects of the country both as a market and a production hub.
Kimball Electronics Publishes Annual Sustainability Disclosures with its 2023 Guiding Principles Report
03/28/2024 | BUSINESS WIREKimball Electronics, Inc. published its annual sustainability disclosures in its 2023 Guiding Principles Report, themed “How We Are Winning Together The Kimball Way.”
iNEMI Webinar: Humidity Robustness and Insulation Coordination for e-Mobility
03/27/2024 | iNEMIThis webinar is a follow-up to the recent Seminar on Humidity Robustness and Insulation Coordination for e-Mobility, organized by iNEMI and ZESTRON Europe and supported by the ECPE.
Electronics Industry Sentiment Rises in March
03/27/2024 | IPCIPC releases March 2024 Global Sentiment of the Electronics Supply Chain Report
Mycronic to Showcase More Versatile, High-productivity Assembly Solutions at IPC APEX EXPO 2024
03/27/2024 | MycronicMycronic, the leading Sweden-based electronics assembly solutions provider, will continue to respond to growing customer demand for high-flexibility, high-productivity solutions for zero-defect PCB assembly at IPC APEX EXPO 2024 in Anaheim, CA on April 9 - 11.