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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
January 21, 2022 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
Next week, we’ll be in San Diego. In fact, I fly down tomorrow morning to start preparations, along with most of the I-Connect007 team. The weather forecast says to expect sunny, with the occasional cloud, all week, with daytime temperatures around 70 degrees. That’ll be nice, as I’m sure COVID-related social distancing guidelines will encourage us to socialize outside as much as is feasible.
Don’t get me wrong, the team is very excited to be covering the IPC APEX EXPO week in-person. We’ll be practicing our exposure minimization and proper social distancing as best as we can, however. We will also be covering the virtual AltiumLive event, which overlaps with IPC APEX EXPO. Expect to see Andy Shaughnessy and other I-Connect007 faces reporting on both events next week.
Andy and I have been creating these must-read lists since June of 2020, five months after the last in-person IPC APEX EXPO—yes, it’s been that long! So, this is the first of our five must-reads covering the lead-up week to a physical show. No surprise then that reader interest has been somewhat APEX- and AltiumLive-centric this week. Here are the top five standouts from a busy, busy week of news.
Best Technical Papers at IPC APEX EXPO 2022 Selected
Published January 14
In the article, IPC Chief Technologist, Matt Kelly, says, ““The [Technical Program Committee] is absolutely focused on providing highest quality content to the technical conference. This commitment to quality is reflected in this year's selection of Best of Conference, NextGen, and Best Student Research papers. We extend our congratulations to all the award winners." Click through to see who those award recipients are.
Booming Semiconductors: AT&S Shaping Coming Data Revolution
Published January 17
This news piece updates readers on what AT&S presented for latest latest developments in the field of IC substrates at the Consumer Electronics Show CES in Las Vegas. Substrates are key to the semiconductor chips that get placed on the printed circuit boards; keeping up on the latest in semiconductor substrates just makes sense.
Real Time with… IPC APEX EXPO: Siemens’ Supply Chain Solutions
Published January 17
I-Connect007 speaks with Oren Manor of Siemens Digital Industries Software about the company’s booth at IPC APEX EXPO, which will highlight a DSI platform meant to help designers find and use components in their designs during these tough supply chain challenges.
Mycronic to Demonstrate Enhanced Process Control Solutions for Flexible PCB Assembly at IPC APEX EXPO
Published January 19, 2022
From the press release, “Mycronic will continue to demonstrate the benefits of the flexible factory at IPC APEX EXPO in San Diego, January 25-27, 2022. In addition to the latest in integrated SMT assembly solutions, advanced jet printing technology, dispensing and material handling solutions, the company will highlight recent advances in 3D inspection technologies, process analysis tools and process control software.” Click through to read more.
MacDermid Alpha’s Electrolube to Present Two Keynotes on Resins and Coatings at IPC APEX EXPO
Published January 20
Phil Kinner, global business and technical director for Electrolube’s Coatings Division, and Beth Turner, Electrolube’s senior technical manager, will both present papers at the event. Kinner’s is titled “Conformal Coatings: State of the Industry Versus State of the Art,” and Turner’s is titled “Bio-based Encapsulation Resins: Good for the Environment, Good for Your Environment.” Click through for more details.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/26/2024 | Andy Shaughnessy, Design007 MagazineIn this week’s roundup, we have a variety of articles covering everything from design through assembly, and even box build. I’ve always wondered whether box build was all it was cracked up to be. Do customers really pick one EMS provider over another because one company offers box build? And if you’ve ever wanted to volunteer, IPC’s Thought Leaders Program is looking for a few good technologists to help them on their mission. Check out Stanton Rak’s article, which was published in the spring issue of IPC Community.
Stan Rak: Elevating the Ideas and Insights of IPC's Thought Leaders Program
04/25/2024 | Stanton Rak, SF Rak CompanyAs a member of the IPC Thought Leaders Program (TLP), I am responsible for identifying knowledge-sharing opportunities that can generate ideas and insights that strengthen the IPC community as well as create a sustainable and lasting future for its members. I am delighted to highlight some of my recent contributions as a member of the TLP.
Alternative Manufacturing Inc. Awarded QML Requalification to IPC J-STD-001 and IPC-A-610
04/24/2024 | IPCIPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) requalification to Alternative Manufacturing Inc (AMI).
IPC Design Competition Champion Crowned at IPC APEX EXPO 2024
04/24/2024 | IPCAt IPC APEX EXPO 2024 in Anaheim, California, five competitors squared off to determine who was the best of the best at PCB design.
Big Win for Defense Production Act Budget Allocation in FY24 Budget
04/23/2024 | I-Connect007 Editorial TeamOne year ago, President Biden issued a determination that chips and packaging are critical for national security. Since that time, much work has been done to continue the conversation in Washington, elevating the importance of the entire chips value chain, and including printed circuit boards and substrates, without which chips cannot operate.