Siemens Receives Three Samsung Foundry SAFE EDA Awards

Reading time ( words)

Siemens Digital Industries Software announced that long-term partner Samsung Foundry has recognized its partnership and substantial contributions to the broader Samsung Foundry ecosystem over the past year with three Samsung SAFE Awards. As part of its inaugural Samsung SAFE (Samsung Advanced Foundry Ecosystem) awards program, Siemens is recognized in the categories of Best Innovation, Best Collaboration and Best Technical Support. The new Samsung Foundry awards program recognizes achievement of the highest standards of design, development, and technology implementation to accelerate silicon innovation.

“I’m pleased to congratulate Siemens as the winner of these three 2020 Samsung Foundry SAFE awards for their EDA solutions,” said Jaehong Park, executive vice president of Foundry Design Platform Development at Samsung Electronics. “These awards reflect our continued partnership with Siemens to address customers’ 2D and 3D design challenges across elements of Samsung Foundry’s design flows and target markets for our most advanced process nodes.” 

Siemens’ High Density Advanced Packaging (HDAP) flow earned the Best Innovation award for collaboration on Samsung's Multi-Die Integration (MDI™) packaging solution, which helps mutual customers rapidly prototype, implement, verify and thermally analyze their highly sophisticated multi-die package implementations. The Siemens technologies powering the HDAP flow include:

  • Xpedition™ Substrate Integrator software, which enables rapid early prototyping and planning of heterogeneous semiconductor package assemblies,
  • Xpedition™ Package Designer software, which provides constraint-driven place-and-route functionality with manufacturing preparation,
  • Simcenter™ Flotherm™ software, which delivers complete package assembly thermal modeling and analysis,
  • Simcenter™ 3D software, which provides complete, thermally induced stress and reliability analysis for package assemblies,
  • Calibre® 3DSTACK software, which provides signoff DRC and LVS checking of complete multi-die system assemblies at any process node.

Siemens’ Calibre® YieldEnhancer (SmartFill) product team earned Samsung’s Best Technical Support recognition. The Calibre YieldEnhancer tool combines advanced design analysis with multiple filling solutions to optimize chip filing for both digital and analog designs.

The product team for Siemens’ Calibre Circuit Verification suite won this year’s Samsung SAFE award for Best Collaboration. The team worked closely with Samsung to ensure that each of the following tools in this suite support Samsung’s latest process technology:

  • Calibre® nmLVS software -- Samsung Foundry was the first foundry to leverage the Calibre nmLVS-recon offering to speed circuit verification during early design,
  • Calibre® PERC reliability software, which employs a unique, integrated analysis to automate complex reliability verification checks,
  • Calibre® xACT parasitic extraction software, which delivers the high levels of accuracy required for three dimensional FinFET structures.

“Siemens is pleased and honored that our long-lasting partnership with Samsung Foundry has resulted in these first SAFE EDA awards,” said Michael Buehler-Garcia, vice president of Product Management for Calibre Design Solutions at Siemens. “As our mutual customers continue to develop higher complexity designs, Samsung Foundry and Siemens will continue to partner to enable the advanced platforms customers need to bring these increasingly sophisticated designs to life.”



Suggested Items

Bridging the Simulation Tool Divide

04/12/2021 | I-Connect007 Editorial Team
Todd Westerhoff of Siemens EDA recently spoke with the I-Connect007 Editorial Team about the divide between users of high-powered enterprise simulation tools and those who need a more practical tool for everyday use, and how Siemens is working to bridge the gap. Todd also shared his views on why so many engineers do not use simulation, as well as advice for engineers just getting started with simulation tools.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

02/26/2021 | Andy Shaughnessy, I-Connect007
We’re seeing an increase in optimism as more people are vaccinated and states under lockdown begin flipping open their shutters. This positive outlook is spreading, albeit slowly.

The Magnitude of Stackup Considerations

03/01/2021 | Michael R Creeden, CID+, MIT, Insulectro
When I was asked to write about stackup creation, I paused at the magnitude of this subject. It is similar to the framework used to pour concrete cement—you need to get the framework right because the framework has such a big impact on the final outcome. Such is the case with shaping the success or failure of our circuits. In writing the newest training manual due out early this year, I observed that the longest chapter in the textbook was dedicated to this subject.

Copyright © 2021 I-Connect007. All rights reserved.