April 2021 Issue of Design007 Magazine Available Now


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When we first started speaking with signal integrity experts for this issue, we were surprised to find that there were several schools of thought regarding simulation, including avoiding the use of simulation from the start. So, in the April issue of Design007 Magazine, we asked some of the industry’s premier experts on simulation to weigh in on this critical topic.

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Why We Simulate

04/29/2021 | Bill Hargin, Z-zero
When Bill Hargin was cutting his teeth in high-speed PCB design some 25 years ago, speeds were slow, layer counts were low, dielectric constants and loss tangents were high, design margins were wide, copper roughness didn’t matter, and glass-weave styles didn’t matter. Dielectrics were called “FR-4” and their properties didn’t matter much. A fast PCI bus operated at just 66 MHz. Times have certainly changed.

PCEA Expands in Its Sophomore Year

04/29/2021 | Andy Shaughnessy, Design007 Magazine
Andy Shaughnessy recently spoke with PCEA’s Scott McCurdy and Tomas Chester about the organization’s plans for its second year. They explained that they plan to add new chapters and members, especially younger engineers like Tomas.

IBM Awarded Best Technical Paper at IPC APEX EXPO 2021

04/19/2021 | I-Connect007 Editorial Team
Nolan Johnson and Happy Holden speak with Sarah Czaplewski, whose team at IBM won the Best Technical Paper award at this year’s IPC APEX for “Signal Integrity, Reliability, and Cost Evaluation of PCB Interlayer Crosstalk Reduction.”



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