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Bonding Hybrid Multilayer Constructions at Rogers Corporation
March 10, 2021 | Real Time with...IPCEstimated reading time: Less than a minute
John Ekis, Rogers Corporation's market segment director for aerospace and defense, discusses the SpeedWave™ family of low-dielectric constant, ultra-low-loss prepreg materials with excellent filling and bonding characteristics for hybrid multilayer constructions. SpeedWave™ is available in multiple spread and open weave glass style and resin content combinations, and is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing.
Watch this Real Time with... IPC APEX EXPO 2021 interview conducted by Pete Starkey, I-Connect007 Technical Editor.
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Arlon EMC Receives IPC-4101 QPL Recertification
03/20/2024 | Arlon Electronic MaterialsArlon Electronic Materials has successfully completed an intensive two-day recertification audit by IPC Validation Services that examined Arlon’s manufacturing processes and testing procedures to assure that they are in conformance to the requirements of IPC-4101E-WAM1, the Specification for Base Materials for Rigid and Multilayer Printed Boards.
Northrop Grumman Honors Suppliers for Excellence
03/14/2024 | Northrop GrummanNorthrop Grumman Corporation honored more than 70 suppliers for their outstanding contributions in 2023. In an annual recognition event, the companies included women-, minority- and veteran-owned small businesses as well as those operating in underdeveloped areas.
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