New DownStream Software Supports Flex, Rigid-Flex and Embedded Component Designs


Reading time ( words)

Downstream Technologies has released new versions of their industry-leading PCB post-processing solutions CAM350 / DFMStream V 14.5 and BluePrint-PCB V6. With these releases, both products will now support the importation and visualization of CAD designs containing flex, rigid-flex and embedded component data in both 2D and 3D views.

“Flex and embedded component designs have become more popular as electronic products have become smaller and more complex, especially in the military, aerospace, medical and commercial markets,” said Rick Almeida, one of DownStream’s founders. “With these new releases our tools support full flex/rigid-flex bi-directional passing of stack-up data, as well as unique documentation features not found in any tools."

Downstream_3D_Flex_2.jpgThis release is the first of several planned releases supporting flex, rigid-flex and embedded components. It focuses on importing and visualizing flex/rigid-flex data created by PCB CAD tools in 2D & 3D view ports, as well as easily documenting complex rigid/rigid-flex stack-ups and provides the ability to share that documentation with PCB fabricators.

 

Key Highlights and Features to Support for Flex/ Rigid-Flex and Embedded Components

  • Import / Export ODB++ and IPC 2581 Modification
  • Import / Export Modification to support PCB Core Material Data
  • Stack-Up Visualizer Modification
  • 3D View Port Modification
  • Area Tool Modification
  • DFM Analysis Modification
  • Parametric Solder and Paste Mask Generation
  • Assembly Panel Creation
  • New Documentation Objects
  • Output Generation

Availability
CAM350 / DFMStream V 14.5 and BluePrint-PCB V6 will be available December 2020 to all DownStream customers as part of a maintenance release. Actual features and content will vary based on the end-user configurations. Contact local sales offices for configurations and pricing.

About DownStream Technologies
DownStream Technologies LLC is a software and services company focused on helping engineering organizations optimize and automate the PCB Release Process. Our tools redefine how engineering professionals post-process PCB designs to create and distribute all the deliverables required for a complete PCB assembly release package. CAM350® provides verification, optimization and output generation to efficiently drive PCB fabrication. DFMStream® is a comprehensive, yet easy-to-use tool suite designed to help engineers and designers verify design and manufacturing rules on PCB design databases, Gerber and NC data any time during the PCB design cycle. BluePrint for Printed Circuit Boards® works with CAM350® (and other PCB CAD systems) to help users quickly produce comprehensive electronic drawings to drive PCB fabrication, assembly and inspection processes. More information about DownStream can be found at downstreamtech.com

Share

Print


Suggested Items

DFM 101: PCB Materials

04/30/2021 | Anaya Vardya, American Standard Circuits
One of the biggest challenges facing PCB designers is understanding the cost drivers in the PCB manufacturing process. This article is the first in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product reliability.

Karen McConnell: Recipient of the IPC Raymond E. Pritchard Hall of Fame Award

03/11/2021 | Patty Goldman, I-Connect007
"I heard about IPC when I started a new job at UNISYS after graduating college. I moved from ASIC design to printed circuit boards," said Karen McConnell after being inducted into the Raymond E. Pritchard Hall of Fame. "At the time, in the late ’80s and early ’90s, there were rumors going around that printed circuit boards were going to disappear, and ASICs were going to take over the world. But something in printed circuit boards fascinated me. I minored in robotics in college as an electrical engineer and the data used to fabricate, assemble and test the boards is actually all robotic language. I was hooked."

Cadence’s Celsius: Don’t End up Holding the Hot Potato!

12/17/2020 | Clive "Max" Maxfield, Maxfield High-Tech Consulting
I was just thinking about the party game Hot Potato. It reminded me of today’s increasingly competitive marketplace: Accurate thermal analysis must be performed, and any potential issues have to be identified and addressed as early as possible in the design cycle. Otherwise the system will run into problems, market windows will be missed, and someone will be left holding the hot potato. Trust me, you do not want to be that someone.



Copyright © 2021 I-Connect007. All rights reserved.