An Excerpt From the Book ‘Thermal Management: A Fabricator’s Perspective’


Reading time ( words)

Introduction
Thermal management in the printed circuit board (PCB) world is big business! A recent Markets and Markets report projects the thermal management market to reach $16 billion by the year 2024 with an average CAGR of 8% over that period [1]. This is one of the fastest-growing segments of the PCB business and far outpaces the projected growth for the overall industry. While demand was originally driven by high-power telecommunication and mil-aero applications, it has rapidly expanded to include automotive, consumer electronics, and medical sectors. The components used in any electronic assembly generate heat whenever an electrical current flows through them, and the amount of heat depends on the particular attributes of the design (power requirements, design characteristics, transmission speed, etc.).

In addition to the heat generated from the electronic components, the resistance of the electrical connections, copper trace configuration, and PCB via structures contribute to the thermal output of the product. While RF/microwave and IMPCB applications hold the lion’s share of thermal management challenges, reduced PCB footprints combined with increased component densities can require advanced thermal management solutions on “vanilla” designs.

In our experience working with PCB designers throughout the years, there is a wide range of knowledge on the design side regarding the impact of thermal management design decisions on the PCB manufacturing process, and ultimately, product success. As we strenuously encourage early engagement between the designer and the PCB fabricator in all cases, it is particularly critical when developing an advanced thermal management solution. A disconnect between what the original design manufacturer (ODM) wants in performance and what the printed circuit fabricator recommends for the application is the biggest reason for an unsuccessful build of a new PCB design.

It is important to understand a couple of terms right from the start: thermal conductivity and thermal management. Thermal conductivity is the property of a material to conduct heat, while thermal management is the process of analyzing the system as a whole and effectively dissipating the thermal energy away from the heat source. We have chosen to focus this book on providing designers a thermal management desk reference on the most current thermal management techniques and methods from a PCB fabrication perspective, including a case study on an extreme mixed-technology design that we recently produced. We hope you find value in our efforts.

Reference

1. Markets and Markets, “Markets and Markets report projects the thermal management market to reach $16 billion by the year 2024 with an average CAGR of 8% over that period,” July 2019.

To download The Printed Circuit Designer’s Guide to…Thermal Management: A Fabricator’s Perspective, click here. You can also view other titles in our full library. Check out other books from American Standard Circuits, including The Printed Circuit Designer’s Guide to… Fundamentals of RF/Microwave PCBs and Flex and Rigid-Flex Fundamentals.

 

 

Share

Print


Suggested Items

Benchmarking Your Process Engineering

04/29/2021 | I-Connect007 Editorial Team
Mark Thompson has been in bare board fabrication for over 30 years. He is now laying out printed circuit boards at Monsoon Solutions, a high-tech design bureau near Seattle, Washington. With Mark’s extensive hands-on knowledge of PCB manufacturing, he brings a unique perspective to PCB design. In this discussion with the I-Connect007 editorial team, Mark shares what’s important from a process engineer’s point of view, and how to stay on top of evaluating and benchmarking your manufacturing process, along with insights from his new role as a designer.

Isola Releases IS550H Material

04/26/2021 | Nolan Johnson, I-Connect007
Nolan Johnson speaks with Michael Gay of Isola and Chris Hunrath of Insulectro about the release of their new halogen-free, high-thermal reliability material, which they hope fills the gap in the market between epoxies and polyimides.

EIPC Technical Snapshot: Supply Chain and Material Price Pressures

04/26/2021 | Pete Starkey, I-Connect007
EIPC’s seventh Technical Snapshot webinar on April 14 was timely and appropriate. In the context of current supply chain issues and material price pressures facing the PCB industry, particularly in Europe, the EIPC team brought together an outstanding group of experts—each a leading authority in his field—to analyse and comment upon the areas of concern and to respond to questions raised by a capacity audience. As Alun Morgan said, “If you don’t use the European supply chain, you won’t have it anymore!”



Copyright © 2021 I-Connect007. All rights reserved.