DownStream: Smoothing out the Post-Processing Bumps


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During IPC APEX EXPO 2020 in San Diego, California, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers.

In this video interview from the show, Joe Clark, co-founder of DownStream Technologies, gives Guest Editor Kelly Dack an overview of the company and their innovative product line, which serves to smooth the bumps that can occur between source design output and manufacturing line input. As Joe explains, 2019 was a great year for the company, and he expects that trend to hold through 2020.

IPC APEX EXPO is the largest PCB industry event in North America. The next IPC APEX EXPO will be held January 26−28, 2021, at the San Diego Convention Center.

To watch this interview, click here.

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