-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Insertion Loss Performance Differences Due to Plated Finish and Circuit Structure
October 2, 2019 | John Coonrod, Rogers CorporationEstimated reading time: 1 minute
Abstract
Many different final plated finishes are used in the PCB industry, each with its own influence on insertion loss. The impact of an applied finish on insertion loss generally depends on frequency, circuit thickness, and design configuration. This article will evaluate the effects of final plated finishes on the insertion loss of two popular high-frequency circuit design configurations: microstrip transmission-line circuits and grounded coplanar-waveguide (GCPW) transmission-line circuits.
Data will be presented for loss versus frequency for six different plated finishes commonly used in the PCB industry, and opinions will be offered as to why the loss behavior differs for the different plated finishes and for the different circuit configurations. Because the insertion loss of high-frequency circuits also depends on substrate thickness, circuits fabricated on substrates with different thicknesses will be evaluated to analyze the effects of substrate thickness on insertion loss using different plated thicknesses.
This article will also explore many different aspects of the final plated finishes on PCB performance. The nickel thickness in electroless nickel immersion gold (ENIG) finishes normally has some variations; data will show the effects of these variations on the RF performance of a PCB. Immersion tin is often used to minimize thickness variations and analysis will show the effects on RF performance for different thicknesses of immersion tin. The effects of plated finish on PCB performance can vary widely over frequency, and those effects will be shown for a wide range of frequencies from 1 to 100 GHz.
Insertion Loss Overview
The insertion loss of a high-frequency PCB circuit can decrease the usable signal levels of a system, whether in a receiver or a transmitter. Details on insertion loss can be found in a previous IPC paper, although a simple review of insertion loss might be helpful before examining the data on PCB final plated finishes. The total insertion loss is comprised of four loss components.
To read the rest of this article, which appeared in the September 2019 issue of Design007 Magazine, click here.
Suggested Items
Stan Rak: Elevating the Ideas and Insights of IPC's Thought Leaders Program
04/25/2024 | Stanton Rak, SF Rak CompanyAs a member of the IPC Thought Leaders Program (TLP), I am responsible for identifying knowledge-sharing opportunities that can generate ideas and insights that strengthen the IPC community as well as create a sustainable and lasting future for its members. I am delighted to highlight some of my recent contributions as a member of the TLP.
Alternative Manufacturing Inc. Awarded QML Requalification to IPC J-STD-001 and IPC-A-610
04/24/2024 | IPCIPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) requalification to Alternative Manufacturing Inc (AMI).
IPC Design Competition Champion Crowned at IPC APEX EXPO 2024
04/24/2024 | IPCAt IPC APEX EXPO 2024 in Anaheim, California, five competitors squared off to determine who was the best of the best at PCB design.
Big Win for Defense Production Act Budget Allocation in FY24 Budget
04/23/2024 | I-Connect007 Editorial TeamOne year ago, President Biden issued a determination that chips and packaging are critical for national security. Since that time, much work has been done to continue the conversation in Washington, elevating the importance of the entire chips value chain, and including printed circuit boards and substrates, without which chips cannot operate.
Real Time with... IPC APEX EXPO 2024: A Conversation with IPC's CEO: New Venue, Sustainability, and More
04/23/2024 | Real Time with...IPC APEX EXPOBarry Matties hosts Dr. John W. Mitchell, CEO of IPC, on the final day of IPC APEX EXPO 2024. They discuss the new venue in Anaheim and broach a range of topics, from traffic and booth experiences to workforce development, sustainability, and the CHIPS Act. And they offer advice for newcomers as IPC looks forward to an even better show experience next year.