-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Mentor Webinar January 23: Electro-Mechanical Co-Design
January 8, 2019 | Mentor, a Siemens businessEstimated reading time: Less than a minute
Poor communication between PCB designers and mechanical engineers can cause projects to miss their time-to-market and cost targets by 50% or more. When these teams can collaborate in real time to develop a virtual prototype of the finished product, they can be assured that the PCBs will fit perfectly in their mechanical housing prior to fabrication.
This live webinar, scheduled for January 23, 2019, will reveal how electro-mechanical co-design can enable you to meet your cost and time-to-market goals, allowing you to beat your competitors to market and deliver higher quality products.
Presenters are John McMillan, a member of the PADS Technical Marketing team, and Brent Klingforth, a technical marketing engineer.
What Attendees Will Learn
- How to break down the barriers between PCB design and mechanical design domains with PADS Professional’s MCAD Collaborator
- Demonstration of an actual electro-mechanical co-design session from the PCB designer and MCAD tool user’s perspective
- How to accelerate time-to-market, eliminate re-spins, and reduce product cost with electro-mechanical collaboration
Who Should Attend
- PCB and mechanical designers
- CAD managers
To register, click here.
Suggested Items
Real Time with... IPC APEX EXPO 2024: Exploring IPC's PCB Design Courses with Kris Moyer
04/18/2024 | Real Time with...IPC APEX EXPOGuest Editor Kelly Dack and IPC instructor Kris Moyer discuss IPC's PCB design training and education offerings. They delve into course topics such as design fundamentals, mil/aero, rigid-flex, RF design, and advanced design concepts. They also highlight material selection for high-speed design, thermal management, and dissipation techniques. The interview wraps up with details about how to access these courses online.
Cadence Unveils Palladium Z3 and Protium X3 Systems
04/18/2024 | Cadence Design SystemsThe Palladium Z3 and Protium X3 systems offer increased capacity, and scale from job sizes of 16 million gates up to 48 billion gates, so the largest SoCs can be tested as a whole rather than just partial models, ensuring proper functionality and performance.
Signal Integrity Expert Donald Telian to Teach 'Signal Integrity, In Practice' Masterclass Globally
04/17/2024 | PRLOGDonald Telian and The EEcosystem announce the global tour of "Signal Integrity, In Practice," a groundbreaking LIVE masterclass designed to equip hardware engineers with essential skills for solving Signal Integrity (SI) challenges in today's fast-paced technological landscape.
On the Line With... Podcast Talks With Cadence Expert on Manufacturing
04/18/2024 | I-Connect007In “PCB 3.0: A New Design Methodology: Manufacturing” Patrick Davis returns to the podcast to talk about design rules. As design considerations become more and more complex, so, too, do the rulesets designers must abide by.
Designing Electronics for High Thermal Loads
04/16/2024 | Akber Roy, Rush PCB Inc.Developing proactive thermal management strategies is important in the early stages of the PCB design cycle to minimize costly redesign iterations. Here, I delve into key aspects of electronic design that hold particular relevance for managing heat in electronic systems. Each of these considerations plays a pivotal role in enhancing the reliability and performance of the overall system.