Analog Devices Strengthens Capacity and Resiliency Through Expanded Partnership with TSMC
March 4, 2024 | Analog Devices, Inc.Estimated reading time: 1 minute
Analog Devices, Inc. announced that the company has made a special arrangement with TSMC, the world’s leading dedicated semiconductor foundry, to supply long-term wafer capacity through Japan Advanced Semiconductor Manufacturing, Inc. (JASM), TSMC’s majority-owned manufacturing subsidiary in Kumamoto Prefecture, Japan.
Building on ADI’s more than 30-year partnership with TSMC, this adds another option for ADI to secure additional capacity of fine-pitch technology nodes to serve critical platforms across its business, including wireless BMS (wBMS) and Gigabit Multimedia Serial Link (GMSL™) applications. The joint efforts reinforce ADI’s resilient hybrid manufacturing network, which helps to insulate external factors while supporting the means to increase output and scale rapidly to meet customer needs.
“Our hybrid manufacturing network helps deliver a competitive edge to our customers. Together with TSMC, we can serve our customers with more resilient supplies, respond even more rapidly to customer needs and changing market conditions, and focus our investments on innovative manufacturing solutions that benefit society and the planet,” said Vivek Jain, Executive Vice President of Global Operations & Technology at ADI.
“Today’s announcement demonstrates TSMC’s commitment to helping our customers meet their long-term capacity needs,” said Sajiv Dalal, Executive Vice President of Business Development at TSMC North America. “We’re delighted to expand our ongoing collaboration with ADI that will help to ensure a steadfast and dynamic journey of semiconductor innovation with robust manufacturing capabilities.”
Suggested Items
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
Intel Takes Next Step Toward Building Scalable Silicon-Based Quantum Processors
05/02/2024 | BUSINESS WIRENature published an Intel research paper, “Probing single electrons across 300-mm spin qubit wafers,” demonstrating state-of-the-art uniformity, fidelity and measurement statistics of spin qubits.
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.
NextFlex Convenes the Hybrid Electronics Community at Binghamton University
05/01/2024 | NextFlexBinghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking.
HQ NextPCB of HQ Electronics Debut on the International Stage for Electronics Manufacture at IPC APEX 2024
05/01/2024 | PRNewswireHQ NextPCB of HQ Electronics, a leading Chinese-based multilayer PCB manufacturer and assembly house showcased its industrial prowess on the international stage for the first time at the IPC APEX Expo 2024.