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Wearable Devices Teams up with Qualcomm to Elevate Extended Reality Experience
February 28, 2024 | Globe NewswireEstimated reading time: 1 minute
Wearable Devices Ltd. , a technology growth company specializing in artificial intelligence (“AI")-powered touchless sensing wearables, today announced a collaboration agreement with Qualcomm Technologies, Inc. This collaboration will help those looking to use Wearable Devices' innovative Mudra technology when developing products using the Qualcomm Snapdragon Spaces™ XR Developer Platform, redefining interaction in augmented reality (“AR”) and virtual reality (“VR”) environments.
The Mudra technology, known for its touchless control capabilities, has been optimized to work with Snapdragon Spaces, enhancing the user experience with intuitive, gesture-based interactions. This collaborative approach aims to showcase the innovative potential of combining Mudra's touchless control technology with Snapdragon Spaces, setting a new standard for immersive digital experiences.
"Partnering with Qualcomm Technologies marks a significant milestone in our journey to revolutionize the XR industry," said Offir Remez, Executive Vice President of Business Development at Wearable Devices. "The integration of our cutting-edge Mudra technology with Snapdragon Spaces is enhancing the XR experience and reimagining how we interact with digital worlds. Together, we're paving the way for a future where seamless, intuitive gestures bring us closer to technology, making immersive environments more accessible and engaging than ever before,” added Mr. Remez
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UHDI Fundamentals: UHDI Applications for Wearable Electronics
05/31/2024 | Anaya Vardya, American Standard CircuitsWearable electronics is a type of technology that can be worn on the body and often integrated into clothing or accessories. These devices typically offer functionalities beyond traditional clothing, such as monitoring health metrics, providing notifications, or enhancing communication. Ultra high density interconnect (UHDI) has several potential applications in wearable electronics, primarily in enhancing visual experiences, data analysis, and communication.
Bell Awarded Funding for Phase 1B of DARPA Speed and Runway Independent Technologies (SPRINT) X-Plane Program
05/30/2024 | BellBell Textron Inc., a Textron Inc. company, has been down-selected for Phase 1B of Defense Advanced Research Projects Agency (DARPA) Speed and Runway Independent Technologies (SPRINT) X-Plane program.
AIM Solder Joins International Electronics Manufacturing Initiative (iNEMI)
05/29/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials, is proud to announce its membership with the International Electronics Manufacturing Initiative (iNEMI).
Saying ‘Yes’ to Additive Technology at Winonics
05/28/2024 | Marcy LaRont, PCB007 MagazineCalifornia-based PCB manufacturer Winonics has been on a journey to develop additive manufacturing technology that can go the distance. CEO Dennis Brown, Director of Technology Gary Abel, and VP of Operations Sidali Koulougli discuss the company’s history, acquisition strategy, and investment in new equipment, as well as highlight their R&D efforts in additive manufacturing. The team's commitment to quality, customer service, and flexibility as a smaller, nimbler company is part of what makes it a go-to PCB manufacturer for the projects that others turn away.
Delving Into Special Sessions at IPC APEX EXPO 2024
05/28/2024 | Happy Holden, I-Connect007Once again, we were back at IPC APEX EXPO for another show and conference, and back to gathering in the Anaheim Convention Center. With Disneyland just across the street, there were tourists everywhere. This APEX EXPO was bigger than ever, with more activities, Professional Development Courses, standards committee meetings, and the 16th Electronic Circuits World Convention. I really enjoyed walking around and seeing everything the show had to offer.