-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Electronic System Design Industry Reports Revenue of $3.8 Billion in Q3 2022, ESD Alliance Reports
January 23, 2023 | SEMIEstimated reading time: 1 minute
Electronic System Design (ESD) industry revenue increased 8.9% from $3.45 billion in Q3 2021 to $3.76 billion in Q3 2022, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 13.4%.
“The electronic design automation (EDA) industry posted overall gains in Q3 2022, with double-digit increases in all product categories except Semiconductor IP,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. “All geographic regions except Japan recorded growth in the quarter, with Asia Pacific reporting a double-digit increase.”
The companies tracked in the EDMD report employed 55,369 people globally in Q3 2022, an 8.2% increase over the Q3 2021 headcount of 51,182 and up 1.8% compared to Q2 2022.
The quarterly EDMD report contains detailed revenue information with the following category and geographic breakdowns.
Revenue by Product and Application Category – Year-Over-Year Change
- Computer-Aided Engineering (CAE) revenue increased 16.7% to $1,231.2 million. The four-quarter CAE moving average increased 14.8%.
- IC Physical Design and Verification revenue increased 12.2% to $687.4 million. The four-quarter moving average for the category increased 3.4%.
- Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue increased 15.6% to $344.7 million. The four-quarter moving average for PCB and MCM rose 13.2%.
- Semiconductor Intellectual Property (SIP) revenue decreased 1.0% to $1,360.2 million. The four-quarter SIP moving average grew 16.5%.
- Services revenue increased 20.8% to $144 million. The four-quarter Services moving average increased 26.8%.
Revenue by Region – Year-Over-Year Change
- The Americas, the largest reporting region by revenue, procured $1,622.1 million of electronic system design products and services in Q3 2022, an 8.5% increase. The four-quarter moving average for the Americas rose 16.8%.
- Europe, Middle East, and Africa (EMEA) procured $451 million of electronic system design products and services in Q3 2022, a 0.2% increase. The four-quarter moving average for EMEA grew 3.8%.
- Japan’s procurement of electronic system design products and services decreased 8.5% to $237.8 million. The four-quarter moving average for Japan declined 0.8%.
- Asia Pacific (APAC) procured $1,456.4 million of electronic system design products and services in Q3 2022, a 16.3% increase. The four-quarter moving average for APAC increased 16.2%.
Suggested Items
Synopsys, Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU
05/03/2024 | PRNewswireSynopsys, Inc. announced that Samsung Electronics has achieved successful production tapeout for its high-performance mobile SoC design, including flagship CPUs and GPUs, with 300MHz higher performance using Synopsys.ai™ full stack AI-driven EDA suite and a broad portfolio of Synopsys IP on Samsung Foundry's latest Gate-All-Around (GAA) process technologies.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/03/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.
Real Time with… IPC APEX EXPO 2024: Software Solutions for Circuit Board Challenges
05/03/2024 | Real Time with...IPC APEX EXPONolan Johnson speaks with Will Webb from Aster Technologies about their software solutions for design teams, manufacturing, test engineers, and process engineers. Aster's software addresses the increasing complexities of circuit boards and the need for alternative testing methods.
Real Time with… IPC APEX EXPO 2024: My Role as a Technology Solutions Director
05/02/2024 | Real Time with...IPC APEX EXPOPeter Tranitz, senior director of technology solutions at IPC, shares insights into his role as the design initiative lead. He details his advocacy work, industry support, and the responsibilities of the design initiative committee. The conversation also covers the revamping of standards, the IPC Design Competition, and the implementation of design rules in software tools.
Real Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products
05/01/2024 | Real Time with...IPC APEX EXPOChris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.