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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
December 16, 2022 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
The holiday season is in full swing for most of us; no matter which holiday you choose to recognize here in the second half of December, it’s almost certain that your routine has some level of interruption to it right now. Chances are, you might not be consuming as much of your usual diet of industry news and information, what with all the holiday treats and traditional meals to be consumed instead. That, gentle reader, is why we bring you this week’s Top 5 editor’s picks–your slimmed down version of the news, leaving you more time for the other delights of the season. So without further ado, we bring you the five news items you really should make room for this week.
And, as ever, the staff at I-Connect007 wish you a healthy, happy, joyous holiday season.
ICT Christmas Seminar 2022: The Caliber of a ‘World Cup’ Event
Published December 13
The best way to introduce this dispatch from the Institute of Circuit Technology’s Christmas Seminar, is to quote Pete Starkey’s opening paragraph:
“Regardless of the potential distraction of the international football match between England and Wales in the World Cup competition, an enthusiastic crowd of PCB fans gathered in Meriden UK for the Institute of Circuit Technology Christmas Seminar, an eagerly-awaited networking opportunity that included a face-to-face industry welcome event and an outstanding technical programme.”
Starkey’s reporting from the technical conference field is highly sought after reading for so many of us, and this report does not disappoint. Definitely recommended reading.
Pan Pacific Microelectronics Symposium 2023 Program Finalized
Published December 14
The program for the 27th Annual Pan Pacific Microelectronics Symposium has been finalized. The event, which will take place from Jan. 30 to Feb. 1, 2023, at the Sheraton Kauai Resort on Kauai, Hawaii, promotes international technical interchange and provides a premier forum for global networking among microelectronics professionals and business. Read more here for details.
Physics, Electrical Engineering, and PCB Design
Published December 9
Tamara Jovanovic is a periodic contributor to Design007 magazine, and an insightful voice of the young PCB design professional. In this article, published in the November 2022 issue, which we themed “Maxwell vs. Moore: A Fight to the Physics,” Jovanovic delves into how her classroom education and her daily professional life intersect in useful and interesting ways. Readers definitely responded to her writing.
Industry Innovation Starts Here
Published December 9
If you haven’t already started planning your trip to IPC APEX EXPO in San Diego, then it’s definitely time to start. This news piece, courtesy the IPC conference staff, calls out six key reasons that you—or someone from your team—should be at the conference. Helpful tips for getting the greatest value for your registration dollar are included. Give it a read, then book your plane tickets.
EIPC: Europe’s Energy Disadvantage
Published December 15
In this interview, EIPC’s Alun Morgan details the unsettling realities facing the European PCB industry due to the current war in Ukraine, and outlines steps that the EIPC plans to take to help raise awareness of the possible perils the industry might face as a result.
Suggested Items
U.S. Companies Invest Heavily in Robots
04/30/2024 | IFRManufacturing companies in the United States have invested heavily in more automation: total installations of industrial robots rose by 12% and reached 44,303 units in 2023. Number one adopter is the car industry followed by the electrical and electronics sector.
USPAE to Springboard U.S. Technology Forward
04/30/2024 | Marcy LaRont, PCB007 MagazineThe U.S. Partnership for Assured Electronics (USPAE) was launched as a nonprofit subsidiary of IPC in 2020, specifically to manage the DoD relationship and access to funding, and to develop a cooperative facility to develop UHDI capabilities in the U.S., not only for the defense sector, but for the whole of the U.S. electronics industry. It is a tall order, but industry veteran Joe O'Neil believes it will happen. Having been tasked with making the UHDI Capable Cooperative Production Facility (UCCPF) a reality, he provides an update on this important project for U.S. electronics manufacturing.
Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND
04/29/2024 | Samsung ElectronicsSamsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.
Arlon Electronic Materials Awarded Requalification to IPC-4101 QPL for All Polyimide Specification Sheets
04/29/2024 | IPCIPC's Validation Services Program has awarded Arlon Electronic Materials Division, an electronics material manufacturing company headquartered in Rancho Cucamonga, Calif., an IPC-4101 Qualified Products Listing (QPL) requalification for the third time.
Lockheed Martin Australia, The Department Of Defence Sign Strategic Partnership Head Contract
04/26/2024 | Lockheed MartinLockheed Martin Australia signed a landmark AUD$500 million contract with the Department of Defence to build Australia’s future Joint Air Battle Management System under project - AIR6500 Phase 1 (AIR6500-1).