-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
December 2, 2022 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
Normally, the holiday season is a slow(ish) news time, but this year just feels different. My opinion is that the technology industry banked up a whole bunch of innovations and new products during the pandemic disruptions, which are coming to market as quickly as possible. The November/December news is full of technology discussion, as my selections this week clearly demonstrate.
We have a discussion on additively manufactured electronics, as well as a high-level look at fabrication for the UHDI market—both emerging markets. I also noticed that our readers were quite interested in industry reports on U.S. semiconductor industry challenges, and a forward look at the drivers in the flexible PCB fabrication market, so I was sure to include the links again. Finally, I thought I’d share the news item about a new missile guidance system prototype test that caught reader attention and which has garnered quite a bit of attention.
3D Electronic Devices With Additive Manufacturing
Published November 29
In the news on Dec. 1, Nano Dimension issued a press release announcing Q3 2022 results where the company shares that it is on track to increase revenue by 10X over 2020’s results. That news shines a spotlight on this article from Shavi Spinzi discussing the possibilities of additively manufactured electronics.
Global Flexible PCB Market Report 2022: Rising Use in the Aerospace and Aviation Sector Boosts Growth
Published November 25
My recent conversations with flex manufacturers all have a familiar tone: “We’re really busy, capacity is maxed out.” Well, this quote from the Flexible PCB Marketplace Report news release corroborates what I’m hearing: “The [flex] market is expected to surge in the coming years due to the rising use of flexible printed circuit boards in consumer electronics, especially smartphones, laptops, displays, and other electronic devices. According to official industrial sources, around 1.5 billion smartphones were sold in the year 2019.” The article discusses automotive, aviation and aerospace.
Understanding the UHDI Market
Published November 28
This interview with Meredith LaBeau and Todd Brassard from Calumet Electronics included this in the setup to the conversation, “The more we investigate UHDI in the current market, the more advanced packaging becomes a part of the conversation. The two emerging technologies lean on each other for their overall success. UHDI is the method by which state-of-the-art advanced packaging will be fabricated; substrates are creating a market for UHDI capabilities.” In many ways, Calumet is blazing the trail for nimble PCB fabricators to move forward into capabilities that support advanced packaging. Clearly, readers were interested this week in what LaBeau and Brassard had to say.
New Report Identifies Challenges to Continued U.S. Leadership in Semiconductor Design, Innovation
Published November 30
This report from the Semiconductor Industry Association (with Boston Consulting Group) identifies three key areas the U.S. must address in the administration of the CHIPS Act in order to maintain a leadership position: Design and R&D investment needs are on the rise, there is a shortage of domestic design talent, and open access to global markets is under pressure. Take a read and see if you agree.
PAC-3 Intercepts Target In Successful Test of Lockheed Martin Remote Interceptor Guidance
Published November 25
Lockheed Martin announced that their new missile communication device connected with a U.S. Army PAC-3 missile in flight. This prototype system is seen as a step forward in missile guidance systems.
Suggested Items
Latest Test and Inspection Solutions from GOEPEL electronic at SMTconnect 2024
04/29/2024 | GOEPEL electronicGOEPEL electronic will be demonstrating automated test and inspection equipment at SMTconnect, taking place in Nuremberg from June 11 to 13, 2024.
Arlon Electronic Materials Awarded Requalification to IPC-4101 QPL for All Polyimide Specification Sheets
04/29/2024 | IPCIPC's Validation Services Program has awarded Arlon Electronic Materials Division, an electronics material manufacturing company headquartered in Rancho Cucamonga, Calif., an IPC-4101 Qualified Products Listing (QPL) requalification for the third time.
Warm Windows and Streamlined Skin Patches – IDTechEx Explores Flexible and Printed Electronics
04/26/2024 | IDTechExFlexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use. From luminous car controls to food labels that communicate the quality of food, the uses of this technology are endless and can upgrade many areas of everyday life.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics
04/24/2024 | I-Connect007 Editorial TeamIn our fast-changing, deeply competitive, and margin-tight industry, factory analytics can be the key to unlocking untapped improvements to guarantee a thriving business. On top of that, electronics manufacturers are facing a tremendous burden to do more with less. If you don't already have a copy of this book, what follows is an excerpt from the introduction chapter of 'The Printed Circuit Assembler’s Guide to... Factory Analytics: Unlocking Efficiency Through Data Insights' to whet your appetite.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.