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Mentor Webinar: Ensuring DDR4 Electrical Performance at Intended Data Rates
July 2, 2020 | Mentor, a Siemens businessEstimated reading time: Less than a minute
DDR interfaces have many signal integrity and timing requirements that must be guaranteed between multiple signal groups. Conformance to the requirements should be verified before a board is fabricated to reduce the chance of prototype spins. Traditionally, designers have relied on dedicated SI experts to perform this task, or laid out boards based on manufacturer’s guidelines and skipped post-route verification entirely, hoping to avoid problems in the lab. Increasing data rates have pushed DDR operating margins to the point where simply following physical design rules is no longer enough to ensure that a design will work as intended.
This on-demand webinar will discuss the different electrical requirements associated with DDR designs and show how board and system designers can use HyperLynx to perform post-route verification themselves, helping free up scarce SI experts to focus on their company’s most challenging analysis problems.
The webinar is presented by Min Maung, a senior technical marketing engineer for HyperLynx Analysis Tools Suite for the Electronic Board Systems segment at Mentor, a Siemens Business.
To view this on-demand webinar, or for more information, click here.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Siemens Delivers New Solido IP Validation Suite
05/07/2024 | SiemensSiemens Digital Industries Software introduced Solido™ IP Validation Suite software, a comprehensive, automated signoff solution for quality assurance across all design intellectual property (IP) types, including standard cells, memories and IP blocks.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/07/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.
Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs
05/07/2024 | Happy Holden -- Column: Happy’s Tech TalkA significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12 (and more), down to four. Besides reducing direct processing steps, yield will increase as defect producing operations are eliminated.