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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

September 17, 2021 | Nolan Johnson, I-Connect007

In some weeks, readership numbers are pretty even, which means I make my picks based on “excellence” or “achievement” of some sort. Other weeks, you readers “go viral” on a few key news items, making the selection process numerically driven. This was one of those weeks. Here, then, are the five most-read news items. Of course, leading the way are our esteemed technical editors, Pete Starkey and Dan Feinberg. These gentlemen are examples of my opening statement, as both enjoy huge popularity with readers precisely because they are so good at reporting on the industry.

All Systems Go! Comprehensive Thermal Analysis of a System Design

September 16, 2021 | Team Cadence, Cadence

In recent years, driven by the demand for smarter electronics, device designers have witnessed enormous scaling of large and hyperscale integrated circuits (ICs) and embraced development directions toward high density and reliability. These devices have increasingly higher thermal performance requirements—both transient and steady-state—and meeting them is becoming increasingly complex and time consuming.





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Fein-Lines: PCEA Presentation—Latest PCB Fab Processes

September 16, 2021 | Dan Feinberg, FeinLine Associates, Inc.

As someone who started his career as a PCB fab process engineer in the early '60s I find it interesting that many of the processes for PCB interconnects are still in use today. Yes, we had eyelets then, but, hey, we did start using...

The Digital Layout: Educational Accolades for Our Chapter Liaison

September 2, 2021 | Kelly Dack, Printed Circuit Engineering Association

In this month’s column, I will give kudos to our PCEA Chapter Liaison who has been capturing the efforts of the PCEA to educate our members and our industry as a whole and then pass the mic to our PCEA Chairman, Steph Chavez to...

Beyond Design: Fly-over Technology—When It All Gets Too Fast

August 26, 2021 | Barry Olney, In-Circuit Design Pty. Ltd.

The role of fly-over cables is to isolate signals from the limitations of the PCB materials. As signal speeds increase, the dielectric material’s Df and Dk become an issue, and traces need to be shaped and routed perfectly,...

Collaboration by Design Featuring:

  • Collaboration by Design, by Andy Shaughnessy 
  • Collaboration: The Key to Streamlining Your Design Process, a conversation with Patrick Davis 
  • PCB Design: It’s a Team Sport, by John Watson 
  • The Power of Designer and Manufacturer Collaboration, by Ian Huibregtse 
  • Collaboration by Design: The Role of EDA Tools, by Rich Tighe 
  • The Collaborative PCB Design Process—A Necessity for Efficient Manufacturing, by Tim Haag 
  • Collaboration to Shorten the Learning Curve, by Tara Dunn
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