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In some weeks, readership numbers are pretty even, which means I make my picks based on “excellence” or “achievement” of some sort. Other weeks, you readers “go viral” on a few key news items, making the selection process numerically driven. This was one of those weeks. Here, then, are the five most-read news items. Of course, leading the way are our esteemed technical editors, Pete Starkey and Dan Feinberg. These gentlemen are examples of my opening statement, as both enjoy huge popularity with readers precisely because they are so good at reporting on the industry.
In recent years, driven by the demand for smarter electronics, device designers have witnessed enormous scaling of large and hyperscale integrated circuits (ICs) and embraced development directions toward high density and reliability. These devices have increasingly higher thermal performance requirements—both transient and steady-state—and meeting them is becoming increasingly complex and time consuming.
As someone who started his career as a PCB fab process engineer in the early '60s I find it interesting that many of the processes for PCB interconnects are still in use today. Yes, we had eyelets then, but, hey, we did start using...
In this month’s column, I will give kudos to our PCEA Chapter Liaison who has been capturing the efforts of the PCEA to educate our members and our industry as a whole and then pass the mic to our PCEA Chairman, Steph Chavez to...
The role of fly-over cables is to isolate signals from the limitations of the PCB materials. As signal speeds increase, the dielectric material’s Df and Dk become an issue, and traces need to be shaped and routed perfectly,...
