It’s a brand-new year, and the magazine has a fresh new look and title. So, to ring in the new year with this first issue of Design007 Magazine, we asked representatives from a variety of PCB design-related companies to answer the question, “What’s New?”
For our first feature, a solid group of design veterans joined our expert discussion: Martyn Gaudion of Polar Instruments, Rick Almeida of DownStream Technologies, and Hemant Shah and Mark Hepburn, both with Cadence Design Systems. In a wide-ranging interview, they discussed everything from their companies’ newest and coolest technologies to the slight uptick in new PCB designers recently.
Ben Jordan of Altium explores the future of EDA and IoT, and predicts that EDA tool companies will need to “put the ‘A’ back in EDA.” Craig Armenti of Mentor is also bullish on automation, making the case for fully automated schematic verification in PCB design tools. In an interview, Karel Tavernier of Ucamco discusses his plans to enhance the automation of his company’s CAM tools, as well as the venerable Gerber standard, and why he’s such an advocate for artificial intelligence in the design process. And Ty Stephens of UK-based Pulsonix explains in an interview how his company plans to become a greater presence in the U.S., starting with their new component search engine that lets users bring in verified parts in one click.
We also have great columns from our regular contributors Barry Olney of iCD, Jade Bridges of Electrolube, and consultant Tim Haag.
SPECIAL SECTION: IPC APEX EXPO 2018 Pre-Show Coverage
As Star Trek celebrates its 50th anniversary, NASA prepares to map out the rest of the universe, known and unknown. This month, we feature interviews with two veteran PCB designers with spacecraft project experience: John Cardone of JMC Design Services and Tom Woznicki of Flex Circuit Design Company. We also have a great article on thermal PCB design by Continental Automotive’s Gabriel Ciobanu and Mentor Graphics’ Boris Marovic. Read on!
Controlled impedance PCBs are becoming more common now, especially in high-speed applications. Designing these boards can be particularly challenging. This month our expert contributors Barry Olney of In-Circuit Design, Martyn Gaudion of Polar Instruments, and Mark Thompson of Prototron Circuits focus on the ins and outs of controlled impedance design.
Controlled Impedance Design by Barry Olney
The Do's and Don'ts of Signal Routing for Controlled Impedance by Mark Thompson
Impedance Control, Revisited by Martyn Gaudion
Cannonball Stack for Conductor Roughness Modeling by Bert Simonovich
The Composite Properties of Rigid vs. Multilayer PCBs by Chet Guiles
Electronic Design Training Crucial to Industry Growth by Bob Sadowski
The Readers Speak by Andy Shaughnessy
It’s not a question of if you’ll encounter signal integrity problems, it’s a question of when. In this issue, the industry’s top SI experts weigh in with the latest tips, tricks and techniques for achieving signal integrity.
Leading off is Lee W. Ritchey's feature artice Differential Signal Design. Columnist Douglas Brooks explains How Electromagnetic Fields Determine Impedance, and Istvan Novak, Barry Olney and John Coonrod weigh in with articles that cover the practical side of SI.
Jack Olson concludes his two-part column The CAD Library, Part 2. All this, industry news highlights, and upcoming events can be found in this month’s issue of The PCB Design Magazine.
December is here, and much of the East Coast is under a blanket of snow. So, to take the chill off, we’re going to turn up the heat with December’s thermal management issue. First, we have an interview with Dr. Johannes Adam of Adam Research, a thermal expert who discusses his TRM software, the books he’s writing. Dr. Adam sounds the alarm, urging electrical engineers to have a better understanding of thermal issues.
Next, Doug Brooks discusses his collaboration with the same Dr. Adam on the book PCB Trace and Via Temperatures: The Complete Analysis, as well as some surprising findings, and why temperature charts based on a trace in isolation are inaccurate. Then, John Parry of Mentor explains how mechanical engineers and engineers, working together early in the process, can streamline thermal design time.
Ventec COO Mark Goodwin weighs in with a look at some new materials that feature a thermal capacity, and the effect of the automotive market on laminate development. And Anaya Vardya of American Standard Circuits discusses some of the choices facing PCB designers using insulated metal PCBs.
We also have a column by Barry Olney on signal flight time variance in multilayer PCBs, and a review of the SIITME design show in Romania, courtesy of Joe Fjelstad.
In most issues, we focus on the technical challenges facing PCB designers and design engineers. But this month, we’ve turned the spotlight on our readers with our special edition, Voices of the Industry. We asked for your thoughts on PCB design and the electronics industry, and—as usual—you weren’t shy about telling us exactly what you think. So read on!
Special Report — Alex Stepinski, Our First Recipient of the Good for the Industry Award
For years, hot air solder leveling was the predominant surface finish in the PCB industry. But now, there’s a veritable alphabet soup of available surface finishes, and each has its own advantages and disadvantages. This month, we focus on the latest in PCB surface finishes, with articles from George Milad and Rick Nichols, as well as columns and articles from our regular contributors.
The marketplace of PCB materials is getting bigger and better every day. But which laminates and processes are right for your design? In the September issue of The PCB Design Magazine, our contributors and columnists explore the often confusing world of PCB materials. Sanmina-SCI’s Steve Iketani and Brian Nelson discuss ways in which laminate trends are driven by both financial and loss budgets. Ohmega Technologies’ Bruce Mahler traces the evolution of thin-film resistor material, PWB Inc.’s Paul Reid elaborates on material decomposition and what can be done to prevent it, and Rogers Corporation’s John Coonrod looks at the use of high-frequency laminates for multilayer hybrids.
Also, check out articles by Lee W. Ritchey of Speeding Edge, Nolan Johnson of Sunstone Circuits, as well as the latest columns from Barry Olney, Doug Brooks, and much more.
All this, industry news highlights, and upcoming events can be found in this month’s issue of The PCB Design Magazine.
Each year, more and more PCB designers are designing boards that feature HDI technology. And no wonder: HDI can lead to substantial reductions in cost by lowering the board’s layer count. But as OEMs continue to squeeze more functionality into tiny handheld devices, there are still a lot of questions swirling around HDI design.
This month, we bring you our “experts discussion,” with Steve Bird of Finisar, Tony Torres of APCT, and MC Assembly’s Steve Jervey, Mike Smyth and Paul Petty. Then, San Diego PCB founder Mike Creeden shares his views on what it takes to design and manufacture a cutting-edge HDI board today. Craig Armenti of Mentor discusses the impact of HDI on power distribution and power integrity. Then we have an article by NCAB COO Jim Nuttall, who explains the state of HDI as he sees it, and the smart decisions that have to be made, from the design stage through volume production.
We also have an article by Bruce Wu of EDADOC, the largest design bureau in China, on the HDI trends he’s seeing in the domestic China market, as well as around the globe. We round things out with Vern Solberg, who has a great column on design strategies specifically for HDI boards.
We also bring you columns by Barry Olney of In-Circuit Design, consultant Tim Haag, and Jade Bridges of Electrolube.
Table of Contents
As the not-so-old saying goes, “If you don’t have signal integrity issues yet, you will.” This month we bring you a variety of SI articles, starting with our cover story by Michael Steinberger and Barry Katz of SiSoft, and Donald Telian of SI Guys. We also have feature articles by Dennis Nagle of Cadence Design Systems and Narayanan TV of Zuken, as well as a feature column by Abby Monaco of Intercept Technology. Finally, we have a great interview with American Standard Circuits’ John Bushie.
New SI Techniques for Large System Performance Tuning by D. Telian, M. Steinberger & B. Katz
Signal Integrity Tools and Design Methodology in the Modern Age by Dennis Nagle
Getting Signal Integrity Right by Design by Narayanan TV
Having Fun With Impedance by Abby Monaco
We Want Your PCB Design Tips! by Andy Shaughnessy
The Rise of the Independent Engineer by Barry Olney
When Coatings Go Wrong by Phil Kinner
Designing for Profitability: Don't Over-materialize by Barry Matties
The Gerber Guide, Chapters 15 & 16 by Karel Tavernier
As the speed of electronic devices continues to increase, so does the cost of re-spins, making good DFM practices more important than ever. Catching problems at the design stage can save weeks of wasted time, not to mention thousands of dollars. This month, we focus on design for manufacturability techniques and processes.
Understanding DFM and Its Role in PCB Layout, by Rick Almeida
DFM: The PCB Designer as Arbitrator, by Tim Haag
Make the Right Decisions at the Right Time in the PCB Design Process, by Martin Cotton
Split Planes in Multilayer PCBs, by Barry Olney
Cadence’s Brad Griffin Digs Deep Into DDR, by Kelly Dack
Good Vibes at IPC APEX EXPO 2015 by Andy Shaughnessy
Assembly may take place downstream, but good DFA techniques can save your company time and money. In the October issue of The PCB Design Magazine, our contributors and columnists explore the world of designing for assembly. Flextronics’ Murad Kurwa and Jesus Tan discuss the use of DFX processes for better DFA. PCB Libraries’ Tom Hausherr provides a primer on proper component placement, while Jack Olson offers guidance on placing components through the use of techniques such as floorplanning.
As always, this month we feature columns by our team of experts, including Paul Reid, Istvan Novak, and Barry Olney. All this, industry news highlights, and upcoming events can be found in this month’s issue of The PCB Design Magazine.
You’ve heard it before: “If you don’t have signal integrity issues, you will.” New low-loss materials are constantly being rolled out to help with signal integrity, and most EDA companies now offer some flavor of tool that can design high-speed, high-frequency boards. But signal integrity continues to perplex PCB designers and design engineers. This month’s issue is packed with technical articles as we delve deep into SI.
This month, we bring you our “experts discussion,” featuring Michael Steinberger of SiSoft, Mark Thompson of Prototron Circuits, and Yogen and Sunny Patel of Candor Industries, along with Happy Holden. Next, Barry Olney of In-Circuit Design looks into exactly when a trace becomes a transmission line. Bert Simonovich of Lamsim Enterprises discusses some new ways to model high-speed backplane channels. Then, Oracle’s Istvan Novak looks into ways to use causal models for your power deliver network to achieve more accurate results. And there's more... check it out:
Ever since the first PCBs were designed, spaces, traces, and features have been shrinking at an almost exponential rate, along with available board real estate. For some designers, what was formerly a jigsaw puzzle has become a logistical nightmare. This month, our first feature story is an interview with Albert Gaines, owner of HiGain Design Services, who focuses on the ins and outs of designing with tight tolerances. David Ledger-Thomas of Honeywell Aerospace discusses some of his techniques for handling fine spaces and traces. And Mark Thompson of Prototron Circuits covers this topic from the viewpoint of the CAM operator, offering a variety of tips to help designers stay out of trouble when things get small.
Designing with Fine Lines and Features - Albert Gaines
From the CAM Shop: Tight Tolerance Design Tips - Mark Thompson
Designing PCBs with Tighter Tolerances - David Ledger-Thomas
The Importance of Design for Profit Interview with Mike Brown
The Gerber Guide, Chapters 13 & 14 by Karel Tavernier
Let’s Get Small by Andy Shaughnessy
Mastering “Black Magic” with Howard Johnson’s Seminars by Barry Olney
The Dilemma: Soldermask for High-Frequency PCBs by John Coonrod
Special Section: IMPACT Washington, D.C. 2016 by Patty Goldman
A decade ago, most PCB designers didn’t have to worry about the challenges associated with higher speeds. But now, many electronic products feature high-speed PCBs, and designs are getting faster all the time. This month, we take the high road and focus on high-speed design techniques.
Effective Characteristic Impedance, by Kirk Fabbri
Effects of Surface Roughness on High-Speed PCBs, by Barry Olney
I3: Incident, Instantaneous, Impedance, by Martyn Gaudion
Effects of DC Bias on Ceramic Capacitors, by Istvan Novak
Controlled Impedance: A Real-World Look at the PCB Side, by Dan Beaulieu and Bob Tarzwell
Insertion Loss: A Bigger Concern in High-Speed Digital, by John Coonrod
IPC Updates CID, and DFX Takes Off, by Andy Shaughnessy
Push the Button, Max, by Tim Haag
Picking the right PCB manufacturer is tougher than ever. Sure, there are plenty of good fabricators competing for your business, but how do you determine which company is the best for your needs? In the November issue of The PCB Design Magazine, our contributors and columnists explore the world of qualifying fabricators. Rob Scott of Next Level PCB details his methods for conducting full audits of PCB manufacturers. Designer Kelly Dack discusses some of the criteria he keeps in mind when considering a new fabricator. And columnist Mark Thompson of Prototron tells us what designers should look for in a manufacturer regarding quotes, on-time performance, and controlling various impedances.
We also feature articles by Tom Hausherr of PCB Libraries and Karel Tavernier of Ucamco. And as always, this month we feature columns by our team of experts, including Amit Bahl and Barry Olney.
All this, industry news highlights, and upcoming events can be found in this month’s issue of The PCB Design Magazine.
We’ve heard it for decades: The days of throwing a design over the wall are ancient history. After all, designers have embraced fully optimized DFM processes. Right? Maybe not.
DFM continues to cause designers problems. Even designers seem to realize that they might not know all they need to know about fabrication.
In our feature interview, Consulting Technical Editor Happy Holden discusses the importance of predictive engineering in DFM, and why some PCB designers equate a design rules check with DFM guidelines. In our second feature, Happy discusses the history of predictive engineering, and how it should be utilized by PCB designers and manufacturers.
Next, Mentor’s Pat McGoff discusses the evolution of DFM software, and the importance of good DFM processes during new product introduction (NPI). And Hemant Shah and Ed Acheson of Cadence Design Systems focus on new DFM tools that use predictive engineering to provide feedback to designers so errors can be addressed in real-time, not after the design is completed.
We also bring you columns by our regular contributors Barry Olney of In-Circuit Design, Jade Bridges of Electrolube, and consultant Tim Haag.
PCB designers get downright exorcised about their EDA tools. One point of contention has to do with automation itself: How much is too much? Some designers prefer manual control—not just for routing, but for much of the layout. Others want as much automation and horsepower as they can get. This month, our feature story by Intercept Technology’s Abby Monaco highlights the challenges EDA software companies face trying to give designers the power, and control, that they need. UTC’s Stephen V. Chavez explains why he prefers a mix of control and automation, and why mastery of each EDA tools is critical. Guest Editor Kelly Dack discusses why he prefers manual control for autorouting and more. And Barry Olney explains why artificial intelligence should be built into EDA tools from scratch, citing some of the repetitive tasks that could be addressed easily with AI.
We also have an interview with DownStream Technologies co-founder Joe Clark, and Joe Fjelstad’s review of last month’s TIE PCB design show in Romania.
It’s a New Year, and time to put our party hats away. We’re sure to face a variety of opportunities and challenges over the next 12 months. This month, our contributors David Wiens, Mark Thompson, Martyn Gaudion, Sharon Starr, and Abby Monaco peer into their crystal balls and discuss what we can expect in the coming year or so.
Just when you were getting used to signal integrity analysis, power integrity takes center stage! Now, instead of focusing primarily on a signal traveling down a transmission line, PCB designers also have to worry about energy distribution along transmission planes as well. In the December issue of The PCB Design Magazine, our contributors and columnists explore the ins and outs of power integrity. Brad Brim of Cadence Design Systems explores the team approach to assuring power integrity. And columnist Istvan Novak of Oracle explains how to make accurate PDN measurements with a variety of cable shields—whether high-quality, low-quality, conductive foil, or braided wire, with single or multiple layers of wire mesh.
We also feature articles by John Vaughan of Circuit Solutions and Tom Woznicki of Flex Circuit Design Company. And as always, this month we feature columns by our team of experts, including Barry Olney, John Coonrod, Amit Bahl and Martyn Gaudion.
All this, industry news highlights, and upcoming events can be found in this month’s issue of The PCB Design Magazine.
What does your company do when a board fails? When the board is designed, fabricated and assembled by three different entities, not to mention shipped by a fourth, figuring out what went wrong can be difficult, not to mention time-consuming.
This month, we’re approaching this question from the point of view of the PCB designers and design engineers, because they tend to bear the brunt of the blame when a PCB starts smoking.
In our first feature, Gaudentiu Varzaru of the Politehnica University of Bucharest discusses all the ways for problems to creep into a PCB design, including overly automated EDA tools. Scott Decker of UTC Aerospace Systems explains why no one has the right to point fingers—there is plenty of blame to go around when a board fails. EPTAC’s Kelly Dack focuses on the use of root cause analysis, and how RCA can help technologists quickly find the cause of failure and make sure it never happens again. And consultant Tim Haag explains how tough it is to find the root cause. He shares a few horror stories about failures that were not his fault, despite what everyone else thought at first.
We also have columns from our columnists Barry Olney and John Coonrod. And we are introducing Jade Bridges of Electrolube, whose first column focuses on coatings for thermal management.
Table of Contents:
Some PCB designers say that working with their design engineers is one of their biggest hurdles. Others say it all comes down to a lack of communication. We asked a variety of engineers and designers to discuss the reasons for this divide, and what can be done to address this problem. This month we have feature articles by design instructor Rick Hartley and Analog Home’s Steve Hageman, as well as interviews with lead designer Andy Critcher of Total Board Solutions and Randy Faucette, director of engineering at Better Boards Inc.
hWe also have an interview with Todd Westerhoff of SiSoft, and Adcom’s Ruth Kastner discusses the design that lead her team to win a Mentor Graphics Technology Leadership Award this year. And we’re introducing guest columnist Mark Tinkler of Vision Circuits.
Working with Circuit Design Engineers by Rick Hartley
The Roles of the Designer and the Design Engineer Interview with Steve Hageman
Designers and Engineers: Two Sides of the Same Coin Interview with Andy Critcher
The Partnership: Design Engineers and PCB Designers Interview with Randy Faucette
SiSoft: Optimizing the State of the Art Interview with Todd Westerhoff
Behind the Scenes: Adcom’s TLA Award-Winning Design by Ruth Kastner
The Gerber Guide, Chapters 9 & 10 by Karel Tavernier
Leaving Las Vegas, on a High Note by Andy Shaughnessy
DDR3/4 Fly-by vs. T-topology Routing by Barry Olney
The Basics of Hybrid Design, Part 2 by Tim Haag
Design Tips for Easier Conformal Coating by Phil Kinner
Outsourcing PCB Design: How it can Help by Mark Tinkler
What is Signal Launch and Why Should You Care? by John Coonrod
HDI is here, and it brings a whole host of benefits, as well as potential challenges. In this issue, Charles Pfeil and Happy Holden, and Paul Reid offer tips on designing reliable HDI PCBs. We’ll also feature columns by Dan Smith, Barry Olney, Tim Haag, John Coonrod, and Charles Pfeil, as well as an article on designing medical PCBs by Kenneth MacCallum of Starfish Medical
Years ago, signal integrity was a problem for the EEs to deal with. But at today’s high speeds, even short traces can be affected by transmission line issues. This month, The PCB Design Magazine delves into the world of signal integrity.
Yuriy Shlepnev of Simberian discusses the design of PCBs and packaging interconnects for data links running at 28–32 Gbps bitrates. And Barry Olney of In-Circuit Design focuses on the effects of crosstalk, timing and skew on signal integrity. You’ll also find an article by John Parry of Mentor Graphics, and regular columns by Charles Pfeil, Bob Tarzwell and Dan Beaulieu, John Coonrod, and Tim Haag.
All this, plus industry news highlights and upcoming events, can be found in this month’s issue of The PCB Design Magazine.
The medical electronics market is blowing up, and there doesn’t seem to be a ceiling. A recent report estimates that the global medical device market will reach $409.5 billion by 2023, expanding at a CAGR of 4.5% from 2018 to 2023.
All of this bodes well for PCB designers and design engineers. Medical is one segment that just keeps growing, and more people in our industry are moving into medical every year.
So, for this month’s medical issue of Design007 Magazine, we asked our expert contributors to give us their prescription for best practices in the medical PCB design segment. In our feature story, StarFish Medical’s Kenneth MacCallum discusses some of the trends he’s seeing in medical electronics, and some of the challenges designers face in this evolving market. Next, we have an interview with DfR Solutions’ Dock Brown, fresh from his SMTAI keynote on medical hardware. Dock explains how predictive engineering software can be used early in the design cycle to spot component failures and drive costs down.
Consultant Tim Haag has a great feature column about how electronic medical devices are playing a lifesaving role in his family right now, and why your job matters, even if it doesn’t always seem that way. Then we have an interview with Tamara Jovanovic, a recent graduate and PCB designer at Happiest Baby, a Los Angeles company that makes smart baby beds that safely swaddle and clip an infant into the bassinet so that the parents can get some rest—or take a shower. Finally, we have an interview with Dr. Titu Botos of NeuronicWorks, who discusses IoT and why he believes that the Internet of Body (IoB) could be the “next big thing.”
We also have columns by our regular contributors Steph Chavez, Barry Olney, Vern Solberg, Doug Brooks (with special guest Dr. Johannes Adam of ADAM Research), Istvan Novak, Alistair Little, and Bob Tise and Dave Baker. And we have an article on the effects of fiber weave on high-speed signal integrity by CF Yee of Keysight Technologies.
For some PCB companies, mil/aero work is their bread and butter, and one of the last markets that can’t (legally) move overseas. Defense is a safe segment to bet on. But as we found while putting together this issue, mil/aero is not for those managers with an aversion to paperwork or cybersecurity regulations, or anyone who needs to get paid quickly.
Our first feature is based on an interview with Freedom CAD’s COO Scott Miller; Lenthor Engineering VP of Sales/Engineering John Rolle and VP of Marketing Dave Moody; and Zentech’s CEO and President Matt Turpin and VP John Vaughan. They discuss the mil/aero challenges they see for PCB design bureaus, fabricators, and assembly providers, especially in the area of cybersecurity.
American Standard Circuits CEO Anaya Vardya attended the International Paris Air Show recently, and he speaks with Dan Beaulieu about some of the highlights of the world’s largest air show. Charlie Capers of Trilogy Circuits discusses some of the benefits, as well as regulatory hurdles, facing companies entering the mil/aero market. Next, Stephen V. Chavez, CID+, of UTC Aerospace Systems, explains the myriad of cybersecurity hoops that companies like his have to deal with. And Craig Armenti of Mentor Graphics focuses on ways to use vibration and acceleration analysis tools to improve reliability.
You’ll also find columns from our regular contributors Barry Olney of iCD, Alistair Little of Electrolube, and consultant Tim Haag. We top things off with amazing coverage of the recent IPC event IMPACT Washington, D.C., written by Patty Goldman, editor of The PCB Magazine.
Designers have a plethora of ideas about how to best layout a PCB. But how many designers understand that good design techniques can lead their company to greater success, and even profit? In our cover story, Prototron’s Mark Thompson offers 10 design strategies that can help your bottom line. We also feature articles on profitable design strategies by Gary Griffin of Fast Interconnect and Barry Olney of In-Circuit Design Pty Ltd. And we round out this issue with interviews with Nolan Johnson of Sunstone Circuits and Greg Roberts of EMA Design Automation.
The Top 10 Ways Designers Can Increase Profits by Mark Thompson
Design Strategies for Success—and Profit by Gary Griffin
The Need for Speed: Strategies for Design Efficiency by Barry Olney
EMA is Bullish on Data Management Interview with Greg Roberts
Sunstone Circuits R&D: 3D Printing Great for Prototyping Interview with Nolan Johnson
The Gerber Guide, Chapter 7 & 8 by Karel Tavernier
Back to Vegas by Andy Shaughnessy
The Principles of Hybrid Design, Part 1 by Tim Haag
Design and Production: Some Essential Facts by Phil Kinner
How Many Vias Does It Take To...? by Douglas G. Brooks
Dynamic Models for Passive Components by Istvan Novak
The term “outsourcing” often conjures up negative images of PCB design jobs being sent overseas. But some day, your team may need to send designs out, for a variety of reasons. It pays to be prepared, just in case. This month, The PCB Design Magazine digs into the details of design outsourcing.
Mike Creeden of San Diego PCB outlines when you should outsource, when you shouldn’t, and some of the myriad sources for outside design help. †And Kelly Dack focuses on setting up a list of deliverables and making the right contacts—before you need them. You’ll also find an article by Joe Fjelstad of Verdant Electronics, and regular columns by Barry Olney, Istvan Novak, Abby Monaco, and Bob Tarzwell and Dan Beaulieu.
All this, plus industry news highlights and upcoming events, can be found in this month’s issue of The PCB Design Magazine.
For years, designers used Gerber, and that was that. But then came ODB++, and the race was on. Now, scrappy newcomer IPC-2581 is making inroads too, and putting up a challenge. We’ll focus on the great data transfer format debate in this issue of The PCB Design Magazine.
Karel Tavernier of Ucamco and Julian Coates of Mentor Graphics engage in a spirited back-and-forth discussion about the benefits and drawbacks of Gerber and ODB++. Hemant Shah and Ed Acheson of Cadence Design Systems discuss the latest updates to IPC-2581, and Amit Bahl of Sierra Circuits explains how IPC-2581 can help streamline the development of stack-ups. And Julian Coates offers the most current information about the ODB++ format.
You’ll also find an article by Paul Reid, and a regular column by Bob Tarzwell and Dan Beaulieu.
All this, plus industry news highlights and upcoming events, can be found in this month’s issue of The PCB Design Magazine.
You’ve heard the stories. Most CAM departments say that anywhere from 80-100% of designs from new customers are inaccurate or incomplete, often necessitating a Friday afternoon call to the designer, or the job being put on hold. So, what can we do to optimize the design data package and make the handoff to the fabricator as smooth as possible? We asked a variety of industry experts to weigh in on this topic.
Steph Chavez, a CID instructor with EPTAC and IPC Designers Council Executive Board member, explains how designers can break the design data bottleneck, and why it’s so critical that designers and fabricators stay in touch throughout the design cycle. Mark Thompson brings us a feature column that explains what fabricators would like to see in each design data package.
Next, CAM engineers JanNell Taylor and Andy Schilloff of GreenSource Fabrication discuss their preparations for GreenSource’s upcoming entry into the commercial market, and how they will be able to trigger jobs from their off-site location in a different state. Then, Kelly Dack, CID+, discusses many of the ways that designers are inadvertently shooting themselves in the foot by assigning similar or confusing naming conventions to layers of artwork. And we wrap things up with a feature by columnist Jan Pedersen of Elmatica, who explains the need to move design data fully into the digital realm.
This month, we’re introducing a brand-new column, Connect the Dots, by Bob Tise and Dave Baker of Sunstone Circuits, as well as columns from our regular contributors Barry Olney, Vern Solberg, and John Coonrod. We also have an interview with the Designers Council’s Mike Creeden and Steph Chavez, who discuss their upcoming column The Digital Layout, which will launch next month. And we have an article by CF Yee of Keysight Technologies on the impact of routing on multi-gig signal transmissions.
Embedded technology is slowly becoming more prevalent, as technologists begin to take advantage of this buried technology. Embedding frees up real estate and eliminates solder joints, which are responsible for so many of the failures in the field. Embedding can also reduce resistance and parasitic inductance, which can lower EMI and improve signal integrity, all of which are positive things for PCB designers.
In our first feature article, Dan Brandler and Manuel Herrera of Ohmega Technology, and Contributing Editor Happy Holden cover the history of embedded processes, their advantages and disadvantages, their benefits for PCB designers, and the future of this intriguing technology.
Then, Scott McCurdy of Freedom CAD discusses various types of embedded technology, including buried capacitance, planar magnetic boards, and components placed inside cavities in the board. Next, our columnist Vern Solberg takes us through the current state of embedding resistors, capacitors, and inductors, and some of the roadblocks that embedded technologists must contend with. Finally, Dora Yang, and engineer with PCBCart, discusses the design and fabrication process for embedded thin-film resistors, and their numerous applications.
We also bring you columns by our regular contributors Barry Olney of In-Circuit Design, John Coonrod of Rogers Corporation, Dave Becker of All Flex, and Alistair Little of Electrolube.
What’s new in PCB design, and where is the industry headed? If you’ve been asking yourself the same question, you’ve come to the right place.
In this issue, technologists from the biggest names in PCB design software tools discuss their companies’ latest innovations and the trends they see going forward. Interviews include David Wiens of Mentor Graphics, Brad Griffin of Cadence Design Systems, Bob Williams of Pulsonix, Rick Almeida of DownStream Technologies, and Bob Potock of Zuken.
Technology Outlook with Mentor Graphics - Interview with David Wiens
What’s New at...Pulsonix? - Interview with Bob Williams
What’s New at...Zuken? - Interview with Bob Potock
What’s New at...Downstream Technologies? - Interview with Rick Almeida
What’s New at...Cadence Design Systems? - Interview with Brad Griffin
The Gerber Guide, Chapter 6 by Karel Tavernier
A Tale of Two Shows by Andy Shaughnessy
Faster than a Speeding Bullet by Barry Olney
How to Design-Out Production Problems by Phil Kinner
Multilayer PCB Bonding Materials for High-Frequency Applications by John Coonrod
NAMM 2016 Review by Dick Crowe and Dan Feinberg
Our first issue focuses on high-speed design challenges, with feature articles and columns by design industry veterans from all over the PCB design community This month, veteran author and instructor Lee Ritchey presents a tutorial on proper PCB stackup. Longtime HDI technologist Happy Holden traces the advancements in speed and density that he’s seen in his many years as a judge on Mentor Graphics’ Technology Leadership Awards program. And John Levreault of Orvelle Technologies provides a case study that focuses on two super-small, super-dense boards that he designed.
Is the Cloud the limit? In our Articles Department, Iain Wilson of Iron Atom explains the ins and outs of their new Cloud-based pre-CAM tool. And don’t miss the star columnists who you’ve come to know and trust in PCBDesign007 and the Inside Design newsletter: Barry Olney, Istvan Novak, Doug Brooks, Bert Simonovich, Paul Reid, and Tom Hausherr. And please extend a warm welcome to our newest columnist, Jack Olson, who goes in depth into the principles and fundamentals of PCB design in his own unique way. If you know Jack, you know what we’re talking about!
We can’t make all of your design challenges go away. But in each issue of The PCB Design Magazine, we’ll offer you the information you need to make your job simpler, if not easier.
More and more PCB designers are members, or leaders, of design teams, some of which are located across a variety of geographic regions. This month, we focus on what’s current in concurrent design in this issue of The PCB Design Magazine.
Dave Wiens of Mentor Graphics discusses how to best optimize collaboration for PCB systems design. Craig Armenti of Zuken offers tips and best practices for multi-site concurrent design. And columnist Barry Olney of In-Circuit Design lays out a step-by-step plan for concurrent design, from pre-layout analysis through virtual prototyping and more.
You’ll also find an article on selecting an assembly repair facility by a new contributor, Ron Fukui of PSI Repair Services, as well as columns by Amit Bahl and Bert Simonovich.
Artificial intelligence has been grabbing the headlines a lot over the past few years. It’s one of the hotter segments to watch, especially with drones, robots, autonomous vehicles and virtual reality applications becoming more popular every day. What does AI mean for PCB designers and their EDA tools?
This month, we asked our expert contributors to discuss AI and what it might mean to PCB design and the rest of the electronics industry. Technical Editor Dan Feinberg has been reporting on AI for years, and he offers a look at where AI is now in terms of consumer products, and some of the hurdles that AI faces in the upcoming years. David White of Cadence Design Systems shares his thoughts on Cadence’s work with AI and what it could mean to EDA tools. And Mentor’s Paul Musto explains how the company plans to harness the power of AI, and why old-school PCB designers shouldn’t feel threatened by AI-driven EDA tools.
We have Part 2 of Tom Hausherr’s collection of standard PCB components, and an article by Chang Fee Yee of Keysight Technologies on reducing crosstalk in multi-board interconnect. And Simberian’s Yuriy Shlepnev brings us an article on localizing interconnect structures at speeds above 10 Gbps. We also have columns from our regular contributors Barry Olney of iCD, consultant Vern Solberg, and consultant Tim Haag.
• Artificial Intelligence: More Questions than Answers, by Dan Feinberg
• Cadence is Bullish on AI, a conversation with David White
• Artificial Intelligence: The Future of EDA? a conversation with Paul Musto
• 10 Fundamental Rules of High-Speed PCB Design, Part 1, by Barry Olney, In-Circuit Design
• Embedding Components, Part 3: Implementing Discrete Passive Devices, by consultant Vern Solberg
• Contract Positions: Go the Extra Mile, by consultant Tim Haag
• Standard PCB Component Families, Part 2, by Tom Hausherr, PCB Libraries
• Achieving Minimal Crosstalk in Multi-board Interconnect, by Chang Fei Yee, Keysight Technologies
• Life Beyond 10 Gbps: Localize or Fail! by Yuriy Shlepnev, Simberian Inc.
The PCB design segment seems to be doing pretty well right now. But let’s face it: Eventually, odds are that you’re either going to wind up job-hunting or hiring a new technologist for your firm. In this “Help Wanted” issue, our contributors discuss hiring—from both sides of the desk.
Abby Monaco gives her thoughts on job-seeking in the EDA world, from her point of view as both a hiring manager and a job candidate. Technical Editor Kelly Dack discusses his own job-hunting experience, and how his IPC CID credentials came in quite handy. SnapEDA founder Natasha Baker explains how she manages to hire top-notch electrical engineers who are also being recruited by Amazon and Facebook. Associate Professor Bojan Jovanovic of the University of Niš, Serbia, discusses his efforts to put together the perfect PCB design curriculum. And columnist Tim Haag discusses his own job-seeking experience in real time; he found himself looking for work after he began this month's column.
Circuit board designers and fabricators are paying more attention than ever to the global medical electronics market, which is slated to reach $56 billion in the next five years. But medical PCBs come with their own unique technological and regulatory challenges. This month, we bring you interviews with some of the movers and shakers in the world of medical PCB design and manufacturing: Kenneth MacCallum of StarFish Medical, Anaya Vardya of American Standard Circuits, and Amir Davoud of Innovative Circuits Inc. Happy new year!
Column: Doing My Part for Medical Electronics
Medical PCB Design: Not Just Another High-Rel Board
American Standard Circuits: Leading the Way in Medical Electronics
Innovative Circuits Sees Healthy Medical Market
Plane Crazy, Part 2
How to Design a PDN for the Worst-Case Scenario
A New Year and a Few Milestones
Enhancing Thermal Performance of CSP Integrated Circuits
Catching up with Tom Hausherr of PCB Libraries
Download the December 2012 issue of The PCB Design Magazine now! Our sophomore issue focuses on routing and placement strategies and challenges, with feature articles and columns by the design industry veterans you’ve come to know and trust through PCBDesign007 and the Inside Design Newsletter.
Placement and routing is only getting tougher as real estate shrinks and densities increase. And there are as many routing techniques as there are designers. Some PCB designers would rather cut off their left arm than use an autorouter.
This month, Barry Olney of In-Circuit Design Pty Ltd lays out his top techniques for interactive placement and routing, including using cross-probing between the schematic and PCB. And Noah Fenley of ACD discusses DFA tips and tricks for avoiding footprint errors, cumulative pin-pitch mistakes, and other miscues that might trigger a late-night call from your EMS provider.
Our December issue also features our top columnists Doug Brooks, Jack Olson, Tom Hausherr and Abby Monaco. And help us welcome our newest columnist, Amit Bahl of Sierra Circuits. If you design complex, HDI boards, Amit’s column Design for Manufacturing is a must-read. In Amit’s inaugural column, he explains why it’s so important for PCB designers to turn off their iPods, step away from their CAD systems, and go visit a fabricator. When was the last time you saw the inside of a board shop?
A wide variety of PCB materials are available today, from standard FR-4 to high-speed, low-loss laminates and PTFE-based bond ply materials. But every material poses a different challenge to PCB designers trying to stay ahead of the technology curve. We focus on the impact of materials on PCB design in this issue of The PCB Design Magazine.
Barry Olney of In Circuit Design explains the best methods for selecting the correct materials, at the best price point, for digital designs. John Andresakis of Oak-Mitsui discusses a ceramic-filled organic-based composite material that is used to create RF capacitor laminates. Martin Cotton of Ventec Laminates covers the need for materials suppliers to win certifications, such as AS9100C. Amit Bahl of Sierra Circuits explains how high-speed networks are driving the development of new materials. And John Coonrod of Rogers Corporation discusses the effects of operating environments on PCB materials.
You’ll also find a regular column by Tim Haag, a new series on sketch routing by Charles Pfeil of Mentor Graphics, and a new column co-written by Robert Tarzwell and Dan Beaulieu.
Over the past 60 years, packages have continued to evolve, and shrink. The transistor outline “metal cans” of the 1950s would look out of place today. Some packages are no bigger than the period at the end of this sentence, complete with their own “inhalation warning.” Now, more types of packages than ever before that can be mounted on today’s PCBs. But package design is more complex than ever, too.
For this issue of Design007 Magazine, we asked a variety of package experts to share their opinions about the component package trends of today and tomorrow, as well as some of the drivers behind this evolution. In our first feature interview, Chuck Bauer of TechLead Corporation explains some of the trends he’s seeing in packages, such as fan-out wafer-level and 3D packaging, and the need for new packaging technologies to be scalable and cost-effective. Next, Tom Hausherr provides one of the most exhaustive collections of standard PCB components that I’ve seen, complete with package size codes and dimensions.
Bill Acito of Cadence Design Systems discusses the many challenges faced by PCB designers and packaging designers, and he offers some new tips and tricks for dealing with ever-denser packages, not to mention time and budget constraints. And Christian Keller of Altium provides an overview of BGA fanout and escape routing, including techniques for using stacked and staggered microvias, blind vias, and via-in-pads.
We have columns by our regular contributors, including Barry Olney of iCD, John Coonrod of Rogers Corporation, and Alistair Little of Electrolube. And we also have articles by Chang Fei Yee of Keysight Technologies and Yuriy Shlepnev of Simberian.
Choosing the right material for your PCB was so simple a few decades ago. But today, designers often must select an advanced low-loss PCB material with low Df and Dk values—hopefully one that isn’t prohibitively expensive or terribly difficult for fabricators to register during lamination.
So, this month, we feature interviews with a variety of experts on advanced materials. Summit Interconnect’s Gerry Partida and All Flex Flexible Circuits’ Joe Menning spoke with our editorial team about the state of advanced materials from the fabricators’ viewpoint. Craig Davidson of TTM explains the company’s pursuit of embedded optical interconnect and the challenges surrounding optical PCBs. Bruce Mahler of Ohmega Technologies examines Ohmega’s resistive material technology and some of the drivers and issues in that segment of the industry. And APCT’s Steve Robinson discusses his company’s focus on working with PCB designers and engineers to create advanced, high-speed PCBs. Plus, columnist John Coonrod of Rogers Corporation discusses some of the challenges and remedies for woven glass weave effect.
We also have columns by our contributors Barry Olney of In-Circuit Design, and Alistair Little of Electrolube, as well as an interview with Lawrence Romine of Altium and an article about the TIE PCB design conference in Romania, coming up April 25-27.
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It’s been almost 25 years since the first Designers Council meeting in Atlanta. Now, the council has chapters around the world, with thousands of members. This month, we bring you interviews with some of the people who helped make the Designers Council what it is today: Gary Ferrari, Anne Marie Mulvihill, Rick Hartley, Mike Creeden, and Scott McCurdy. Happy holidays!
The Designers Council: Elevating PCB Design, and Designers by Andy Shaughnessy
IPC Designers Council: Serving PCB Designers for Almost 25 Years by Andy Shaughnessy
McCurdy: How to Build a Successful IPC Designers Council Chapter by Judy Warner
Interview: IPC Designers Council Viewpoint: Gary Ferrari
Interview: IPC Designers Council Viewpoint: Rick Hartley
Interview: IPC Designers Council Viewpoint: Mike Creeden
Plane Crazy, Part 1 by Barry Olney
Systematic Estimation of Worst-Case PDN Noise: Target Impedance and Rogue Waves by Istvan Novak
Why Do Different Test Methods Yield Different Electrical Values? by John Coonrod
...and MUCH MORE!
Yes, most PCB designers still use Gerber, but rival data formats are making big strides. This month, we untangle the maze of design data transfer, with supporters of Gerber, ODB++, and IPC-2581 making the case for their preferred format. Is one truly better than the rest, or should we – as one author suggests – combine the best features of several formats into one super standard?
Flexible circuits are becoming more popular in everyday electronics. But when it comes to design, rigid PCBs and flexible circuits are completely different animals. We focus on the ins and outs of flex design in this issue of The PCB Design Magazine.
Thomas Stearns of Brander International discusses why procuring flexible circuits is so different from procuring rigid PCBs. Dave Becker of All Flex explains why flexible circuitry can be seen as the perfect 3D packaging tool. And Tom “Flexdude” Woznicki of Flex Circuit Design Company gets stealthy and discusses how to create “Ninja flex” circuits with shielding films.
You’ll also find an article on DDR3 routing by a new contributor, Robert Feranec of FEDEVEL, as well as our regular columns by Barry Olney, Tim Haag, and John Coonrod.
For the past decade or so, we’ve watched as North America’s PCB designers began reaching retirement age. The problem is that not many young people are entering the field of PCB design, and outgoing senior designers’ positions are increasingly being covered by design engineers. This month, we ask, “Who are the next generation of PCB designers?”
Our first feature is an interview with Fairfield Geotechnologies’ Susy Webb, who has been teaching her class “The Basics of PCB Design” at PCB West for years. Over time, Susy’s attendees have switched from a roomful of designers to almost entirely engineers, so we asked he shared her thoughts and a few stories about educating the next generation of PCB designers.
Next is an article by Mike Creeden of San Diego PCB. Mike discusses the “changing of the guard,” some misconceptions that managers have regarding the art of PCB layout, and why asking electrical engineers to design today’s high-speed PCBs may be easier said than done. Our third feature is an interview with Mentor’s Paul Musto, who explained the company’s relationship with universities, and the need for designers to have an exhaustive knowledge of the fabrication process, which many electrical engineers may lack as they start designing boards.
Columnist Tim Haag channels Peter, Paul and Mary by asking, “Where have all the designers gone?” He discusses the need for the “old guard” of PCB designers to pass on their knowledge to the youngsters, and some of the ways the job requirements for a designer have evolved over the years. And in a feature interview, Bryan LaPointe and Dan Fernsebner of Cadence Design Systems explain how designers of Generation Z will differ from their predecessors, and what can be done to bring more smart, young people into the design community.
We also have columns from regular contributors Barry Olney and Phil Kinner, as well as a great technical article from Yuriy Shlepnev, president of Simberian Inc.
It wasn’t that long ago that flex and rigid-flex were considered expensive specialty circuits. But times have changed, and flex circuits are now found in most of our personal electronic devices. This month, we focus on designing flex and rigid-flex circuits. In our feature story, Craig Armenti of Mentor Graphics offers a variety of rigid-flex design tips and best practices. Tom “Flexdude” Woznicki of Flexible Circuit Design Company discusses the changes he’s seen in flex design during his company’s first 25 years in operation. And American Standard Circuits’ Anaya Vardya and Dave Lackey tell us about their new book, The Printed Circuit Designer's Guide to…Flex and Rigid-Flex Fundamentals. We also have columns by our contributors Barry Olney of In-Circuit Design, Bert Simonovich of Lamsim Enterprises, Tim Haag of Intercept Technology, and Alistair Little of Electrolube.
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Designers like you are more productive than ever before, but you’re also juggling more data, in more formats, than you ever could have imagined. This month, we discussed design data management in interviews with Stephen Garcia and Brian Paper of Bay Area Circuits, Natasha Baker of SnapEDA, Manny Marcano of EMA Design Automation, and Mark Gallant of DownStream Technologies.
Are You Drowning in Data? by Andy Shaughnessy
Good in, Good out: Bay Area Circuits Discusses Data Strategies by Barry Matties
SnapEDA: The Female-Owned Startup Revolutionizing CAD Data by Andy Shaughnessy
EMA: Helping Technologists Manage Disparate Data by Andy Shaughnessy
Downstream Takes on Data Documentation Management by Andy Shaughnessy
Why Autorouters Don't Work: The Mindset! by Barry Olney
The Gerber Guide, Chapter 4 by Karel Tavernier
Do you run simulation on your PCB designs? Circuit boards have grown increasingly faster and more complex, yet simulation is still not standard procedure, even with high-technology designs.
This month, our veteran contributors discuss a variety of simulation techniques that can help you save time and avoid costly re-spins. Mike Steinberger of SiSoft lays out the case for implementing automated checking of high-speed boards, something that's already being performed by IC layout designers. Yuriy Shlepnev of Simberian details the best technique for measuring correlation to 50 GHz and beyond. Barry Olney of In-Circuit Design Pty. Ltd. takes on the role of medical examiner and explores various methods of postmortem simulation. And Dr. Raul Camposano and Steven McKinney of Nimbic detail the applications that are the most likely, and unlikely, to benefit from moving to the cloud.
A PCB design isn’t worth much if it can’t be manufactured, or if it gives your fabricator a migraine. But there has been an apparent disconnect between design and fabrication, to the point that the industry had to come up with a special term: design for manufacturing, or DFM. We focus on the ins and outs of DFM in this issue of The PCB Design Magazine.
Michael Ford of Mentor Graphics explains why Lean NPI practices can lead to a more manufacturable design. Ben Jordan of Altium helps close the gap between design and fabrication, and explains why all manufacturers are not created equally. Mark Thompson of Prototron Circuits discusses the reality of using good DFM practices every day. And Amit Bahl of Sierra Circuits focuses on why consulting with your fabricator is so critical, especially with complex or hybrid designs. You’ll also find our regular columns by Barry Olney and Dan Smith, along with a brand-new column by Tim Haag of Intercept Technology, “Tim’s Takeaways.” All this, plus industry news highlights and upcoming events, can be found in this month’s issue of The PCB Design Magazine.
Over the past few decades, we’ve seen a gradual expansion of the number of multi-board electronic devices. Products are more complex now, plain and simple. There’s no way that anyone could build a car, not to mention an autonomous car, with a single PCB in 2018.
For our June issue, we have a variety of features that are chock-full of multi-board design information. In our first interview, Dave Wiens of Mentor discusses multi-board design techniques, from a 30,000-foot view down to a nuts-and-bolts board level, including the various trade-offs that occur throughout the design cycle. Zuken’s Bob Potock provides a technical article on the 3D convergence of multi-board PCB and IC packaging design, and the importance of ECAD and MCAD collaboration. And in an interview, Ben Jordan of Altium breaks down many of the challenges related to multi-board design, and some of the techniques that can simplify complex designs. As Ben says, “It’s not a complicated concept.”
We have columns from our regular contributors. Barry Olney of In-Circuit Design explains DDR3 and DDR4 fly-by topology termination and routing, while John Coonrod of Rogers Corporation discusses exceptions designers might encounter when comparing material data sheets. And Jade Bridges of Electrolube shines a spotlight on the selection of thermal management materials. We also have an article from Chang Fei Yee of Keysight Technologies that outlines the best methods for achieving signal integrity during layer transition in high-speed boards.
Technological innovations have been coming at us so fast that it’s often difficult to keep track of them. We asked our contributors to discuss new technology that they were excited about. In this issue, Douglas Brooks, PhD, focuses on a variety of experiments conducted with the Thermal Risk Management (TRM) tool, such as finding the temperature inside the barrel of a via. Columnist Barry Olney of In-Circuit Design explains how his new iCD Design Integrity platform can make PCB designers much more productive. Dingru Xiao of Cadence Design Systems discusses new tool options that integrate the functions needed by power integrity engineers and PCB designers in one platform. And columnist Tim Haag of Intercept Technology wonders if PCB designers will ever be able to design boards with a hologram, just like the one in the first “Iron Man” movie.
As board speeds and densities continue to increase, it’s becoming more difficult for PCB designers to shorten their design cycles and meet time-to-market demands. This month, we’re featuring articles by Scott Miller of Freedom CAD Services, Bob Potock of Zuken, and Mark Thompson of Prototron Circuits, as well as tips from our subscribers on accelerating the PCB design cycle.
Don’t Be Held Hostage by Design Cycle Time by Scott Miller
The Readers Speak: Tips on Accelerating Your Design Cycle by Andy Shaughnessy
Speeding up the Design Cycle: 10 Things to Remember by Mark Thompson
Squeezing Seconds Out of the Design Cycle by Andy Shaughnessy
Stackup Planning, Part 4 by Barry Olney
Avoiding the Black Spot of Negative Expectations by Tim Haag
Impact of Final Plated Finish on PCB Loss by John Coonrod
The Gerber Guide, Chapter 3 by Karel Tavernier
Most PCB designers claim to be designing for manufacturability, but CAM engineers tell a different story. This month, our expert contributors discuss many of the DFM challenges they see with incoming PCB designs, and present a variety of options for ensuring manufacturability. Hint: Communication can prevent many DFM snafus. Plus: Post-show coverage of the IPC Apex Expo 2013!
PCB designers advocate doing the tough work and taking nothing for granted. But there are a myriad of myths floating around in this industry—myths that just won’t go away. We face these myths head-on in this issue of The PCB Design Magazine.
Barry Olney of In-Circuit Design Pty Ltd. explains why there are no one-way trips for your signals, and timing for the round trip must be considered. Abby Monaco of Intercept Technology discusses the myths she’s faced while working for an EDA software company. And Amit Bahl of Sierra Circuits looks at how the 3/3 limitation is now a thing of the past, thanks to semi-additive processing. You’ll also find an article by Mark Toth of CadSoft Computer, and columns by Doug Brooks and John Coonrod. And don’t miss our post-show coverage of the IPC Design Forum and APEX EXPO 2014. All this, plus industry news highlights and upcoming events, can be found in this month’s issue of The PCB Design Magazine.
We’ve all heard plenty about 5G lately. The transition from 3G to 4G meant a 10x increase in speed, but 5G will be at least 1,000 times faster than 4G. What does 5G mean to PCB designers and manufacturers?
For this month’s issue on 5G technology, we asked a variety of contributors to help us flesh out what this all means to PCB designers and manufacturers. In our expert’s discussion, John Hendricks of Rogers Corporation discusses Rogers’ plans to field high-speed materials for 5G applications, and Ben Jordan of Altium explains what 5G means for EDA software tool providers. Next, Technology Editor Dan Feinberg focuses on how 5G will affect our industry, and who won’t be affected by this change. CF Yee of Keysight Technologies has a feature article on PAM-4 and its application in 400Gb Ethernet to support the huge traffic volume expected with 5G. And John Coonrod of Rogers discusses the challenges that 5G presents to laminate manufacturers, who will have to contend with microwave frequencies below 6 GHz and millimeter-wave frequencies about 30 GHz.
We also have columns from regular contributors Barry Olney, Tim Haag, and Alistair Little, as well as an interview with columnist Mark Thompson and an article on constraint-driven design by Zuken’s Ralf Bruening.
PCB designers have been focusing on good DFM practices for decades now. But many fabricators still see many of the same old design mistakes and miscues, not to mention a few new ones. What’s going on? In this issue, designer and CID instructor, Kelly Dack, explains why solid DFM techniques sometimes require designers to take back control from their increasingly automated EDA tools. Next, in an interview, Gary Ferrari of FTG Corp. discusses the art and science of DFM techniques, as well as some common problems that designers could easily avoid. We’ve also included a handy index of recent DFM articles.
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Cars now have exponentially more electronic features than a decade ago, and automotive electronics is one of the “driving” forces in electronics design and manufacturing. This month, we’re featuring automotive articles by Monica Andrei of Continental Automotive Systems, Tom O’Connor and James G. McLeish of DfR Solutions, and Michael Ford of Mentor Graphics.
Automotive Systems Design: A Support Engineer's Perspective by Monica Andrei
Physics of Failure Durability Simulations for Automotive Electronics by James G. McLeish & Tom O’Connor
Car Talk Column by Andy Shaughnessy
Top Gear: PADS Professional Road Test Column by Barry Olney
The Gerber Guide, Chapter 2 Article by Karel Tavernier
Radiated emissions can cause a variety of problems on your PCB – even if you’re designing boards with "mature" technologies. In this issue, our columnists and contributors tackle the challenges of achieving EMC (Electromagnetic Compatibility), and discuss some proven methods for minimizing EMI (Electromagnetic Interference) transmissions from the ground up.
Lee Ritchey heads up the issue with his featured article EMI: What it is, Where it Comes from and How to Control It while John Coonrod's excellent feature column, Microwave Radiation Loss Concerns in PCBs gives great advice of how to deal with EMI issues.
After your layout is finished, now comes the tough part: Conveying design intent to your fabricator. In the March issue of The PCB Design Magazine, our expert contributors focus on a variety of methods for documenting your design for manufacture.
Mark Gallant of DownStream Technologies discusses the growth of documentation software tools, and addresses some reasons why these tools eventually caught on. Martyn Gaudion of Polar Instruments explains why designers need to be more tolerant of tolerance. And Amit Bahl of Sierra Circuits looks at how IPC-2581 helps document design intent.
You’ll also find an article by Nicholaus Smith of Integrated Device Technology, and columns by Barry Olney and Istvan Novak. And this month, we’re introducing “The Town Crier,” a new column by Dan Smith of Raytheon, sometimes known as “Mr. HDI.” Don’t miss his PCB designer survey!
And don’t miss our IPC APEX EXPO 2014 show guide. All this, plus industry news highlights and upcoming events, can be found in this month’s issue of The PCB Design Magazine.
New developments in electronics are pushing automotive technologists to new levels of innovation every day, and the automotive segment is now driving much of today’s PCB design and manufacturing efforts. We’re headed into a brave new world, with autonomous and electric vehicles leading the way. But what does this mean for PCB designers and design engineers? For this issue of Design007 Magazine, we asked our expert contributors to discuss the world of automotive electronics, and what all of this innovation means for PCB designers.
In our experts interview, Editor Dan Feinberg reviews the evolution of AI, autonomous cars, and electric vehicles, including what he’s seen in years of covering CES for his column. Zuken’s Humair Mandavia discusses the company’s EDA tools and focus on the automotive electronics market. Thomas Wischnack of Porsche Engineering Services explains how Porsche approaches PCB and hardware development, and offers tips for new PCB designers. James McLeish of DfR Solutions highlights his company’s high-reliability test software that is used by autonomous vehicle developers.
Next, Tarun Amla of ITEQ discusses ITEQ’s focus on developing PCB materials for autonomous and electric vehicles, as well as 5G technology. Pete Christiansen of Magi Scitech shows us the company’s new graphene heat sink, which offers thermal management capabilities for automotive and household electronics. And EDADOC’s William Zhou and Wen Ling discuss their longtime design of automotive PCBs, which has made the company one of the biggest forces in the automotive electronics industry in China.
We also have columns from our regular contributors Mark Thompson, Barry Olney, Phil Kinner, and John Coonrod, as well as interviews with Dorine Gurney and Ken Taylor of Polar Instruments, and Anaya Vardya and John Bushie of American Standard Circuits.
Sales and marketing in the PCB industry used to be fairly simple. Then came the Internet, LinkedIn, Facebook, and Twitter. What approaches should you use? In this issue, Barry Olney of In-Circuit Design Pty. Ltd. explains how EDA sales and marketing techniques have evolved as EDA has matured. Next, Abby Monaco of Intercept Technology discusses how the Internet and social media have enabled salespeople to target exactly the right buyer. DownStream Technologies founder Rick Almeida explains his sales and marketing philosophy. Al Wasserzug of Cirexx International focuses on the sales and marketing techniques that are specific to flex circuits. And Lawrence Romine of Altium discusses the company’s philosophy of selling directly to the PCB designer.
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Attention! You may not realize it, but PCB designers are in a veritable war zone, day in and day out. This month, our cover story is an interview with two “soldiers” in this war on failure, Kelly Dack and Mark Thompson of Prototron. We also have feature columns by Paul Reid and Tim Haag, as well as an interview with Per Viklund and Alex Caravajal of Mentor Graphics.
Fighting the War on Failure by Andy Shaughnessy
Kelly Dack and Mark Thompson Unite in the War on Failure by Andy Shaughnessy
Failure Mode: Hole Wall Pullaway by Paul Reid
Mentor Graphics Helps Bridge Gap Between PCB and RF by Barry Matties
Stackup Planning, Part 3 by Barry Olney
A Brief Overview of High-Frequency Laminates by John Conrad
Let’s get small! Board densities continue to increase, and features are shrinking every day. In the May issue of The PCB Design Magazine, our contributors and columnists discuss how ever-advancing HDI technology affects the job of the PCB designer. Joe Fjelstad of Verdant Electronics traces the evolution of HDI, and looks at the pros and cons of some cutting-edge interconnection types available today. Chris Ryder of AT&S explains why HDI PCBs require extra attention to detail and communication between designer and fabricator. And columnist Amit Bahl dispels the myth that HDI is a costly endeavor; he shows how HDI processes can be economical by reducing layer counts.
As always, catch up on the latest columns from Abby Monaco, Barry Olney, Jack Olson,and much more.
What is the state-of-the-art for high-speed design? In the February issue of The PCB Design Magazine, our expert contributors focus on design on the bleeding edge.
Yuriy Shlepnev of Simberian explains how to identify the dielectric and conductor roughness models for interconnect and packages running at speeds of 50 GHz and beyond. Barry Olney of In Circuit Design explains how to become a routing star by effectively routing multiple loads. Amit Bahl of Sierra Circuits looks at how high-speed design is being driven by trends in semiconductor manufacturing and connectors.
Also, columnist Mark Thompson discusses what happens during a typical CAM process. John Coonrod replies to some common FAQs regarding microwave PCB materials. And Andy Shaughnessy provides a post-show review of DesignCon 2014.
For this issue of Design007, our expert contributors discussed their newest tools and technology. First, Editor Kelly Dack sits down with Sam Chitwood of Cadence Design Systems to discuss the newest Sigrity power integrity software, and how it may help designers preclude so-called “exothermal events.” Chuck Ferry of Mentor explains how HyperLynx now allows designers to automate SERDES channel validation early in the design process.
Columnist Tim Haag examines some of our newest technology and ponders whether this will help draw more young people into a PCB design career. Natasha Baker of SnapEDA explains how her small company creates so much of its technology from scratch, and how it has allowed the company to grow so much in only five years. And Arno Kolk of the Estonian Electronics Industries Association discusses the explosive growth of technology in his country in the past few decades.
We also have columns from our regular contributors Barry Olney and Alistair Little, as well as an interview with Nechan Naicker of EDA Technologies, a design engineering company based in South Africa.
Time after time, we’ve heard about issues that continue to challenge readers like you, and some of the most often cited problem areas are related to vias. Whether blind, buried, microvias, thermal vias, landless or back-drilled, vias are a big problem. In this issue, David Wolf of Conductor Analysis Technologies takes us through the company’s analysis program and highlights some of the trends and problems areas he sees in via structures. Mark Thompson of Prototron Circuits focuses on some typical via missteps and miscues he sees in the CAM department. Martyn Gaudion of Polar Instruments discusses vias, modelling and signal integrity. And David Warren of Sunstone Circuits takes us through the company’s move into the RF and microwave space.
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Supply chain management is one aspect of the design world that often takes a back seat to the latest PCB design tricks and techniques. But if you don’t manage your supply chain, it will wind up managing you. This month, our cover story by David Ledger-Thomas and our interviews with Gary Ferrari of FTG and John Pavlak of Rogers Corporation discuss supply chain management from the PCB designer’s viewpoint.
Supply Chain Challenges and Opportunities by David Ledger-Thomas
An Update on the Rogers Material Supply Line by Barry Matties
Gary Ferrari Shares His Thoughts on PCB Design and More by Barry Matties
10 Considerations for Outsourcing PCB Designs by Steve Dobson
The Gerber Guide by Karel Tavernier
The PCB Design Supply Chain by Andy Shaughnessy
Stackup Planning, Part 2 by Barry Olney
It’s a flexible world out there. Flexible circuits are everywhere now, but designing flex is a whole different ballgame than designing typical rigid boards. This month in The PCB Design Magazine, our contributors and columnists discuss some current tips and techniques for designing flex circuits. Glenn Oliver of DuPont, Matt Doyle and John Dangler of IBM, and Rick Brandwein and Paul Abrahamson of Molex discuss the “Zen” of high-speed flex circuit design. And columnists Amit Bahl and John Coonrod explain the latest flex design tricks from a manufacturer’s perspective.
As always, catch up on the latest columns from Paul Reid, Barry Olney, Jack Olson, and much more.
What does 2014 hold for PCB design? What sort of advances are we likely to see in technology? In this issue, our clairvoyant contributors look back on the past year and give us a glimpse into 2014.
Todd Westerhoff of SiSoft explains why designers should begin the new year by testing and correlating simulation models instead of relying on someone else’s word. Columnists Andy Shaughnessy, Ray Rasmussen and Steve Williams break down the industry’s major events of 2013 and look ahead to 2014 and beyond.
We’ll also feature articles by Alexander Ippich of Multek and Ben Jordan of Altium. And columnist Barry Olney finishes his two-part series on PDN planning and capacitor selection.
How do you feel about your suppliers’ customer service? How do your customers feel about your service? Every company in our industry claims to put the customer first, but what does that mean in a firm’s day-to-day operation? How well do you know your customers?
For this month’s issue, we asked a variety of industry experts to weigh in on the venerable customer. For our experts interview, Sunstone Circuits’ Nolan Johnson and our columnist Dan Beaulieu had a rousing discussion about what it takes to satisfy a customer, and how far a company can—and should—go to please that customer. Next, we have an interview with Jay Gorajia of Mentor, who discusses the company’s consulting services and the group’s focus on the “digital twin.” Then, we feature an interview with Ben Jordan of Altium, who explains how the latest tool upgrade was driven by customer demand, as well as the many methods Altium uses to acquire and measure customer satisfaction. And consultant Tim Haag, formerly in tech support for an EDA vendor, tells us what designers really want, along with a few horror stories.
We also have columns from our contributors Barry Olney, Martyn Gaudion, and Phil Kinner, and we’d like to welcome our newest columnist, John Talbot of Tramonto Circuits as well. Lastly, we have an article by Hemant Shah and Ed Acheson of Cadence Design Systems on the latest IPC-2581 updates, and an article on NPI by Dora Yang of PCB Cart.
What does leadership mean to you? This month, we focus on leadership, and the difference between a good manager and a great leader. We feature articles by SnapEDA founder Natasha Baker, Mentor Graphics’ Michael Ford, IPC President John W. Mitchell, David Dibble of Dibble Leaders, and an interview with Leo Lambert, vice president of the training provider EPTAC. We’ll also share the results of our I-Connect007 leadership survey. Lead, follow, or get out of the way!
IPC-A-610, Acceptability of Electronic Assemblies is the most widely used IPC standard. This month our expert contributors Teresa Rowe of IPC and Leo Lambert of EPTAC discuss the latest updates to this document, what they mean to product developers, and the various steps in the revision process itself.
IPC-A-610: What’s New with Rev F? by Leo Lambert
Rigid-Flex PCB Right the First Time— Without Paper Dolls by Benjamin Jordan
All About That Via? by Andy Shaughnessy
Stackup Planning, Part 1 by Barry Olney
Avoiding Overload in Gain-Phase Measurements by Istvan Novak
The Art of Bending and Forming PCBs by John Coonrod
Sometimes it feels as if we’re floating in a sea of “Design For” acronyms: DFM, DFA, DFT, DFE, DFX...the list goes on. But in the end, isn’t it all about profit? In the July issue of The PCB Design Magazine, our contributors and columnists discuss DFP and the best practices for creating profit in your designs while keeping costs down. Steve Hageman of AnalogHome explains how virtual prototyping can help you design PCBs more profitably. Tom Hausherr of PCB Libraries shows how increasing productivity leads to greater profits. Barry Olney of In-Circuit Design breaks down the various levels where costs can be coaxed out of a design. Amit Bahl of Sierra Circuits details how solid DFP techniques can create higher yields in HDI board design. And Lawrence Romine of Altium explains how designers benefit from being able to track their ever-changing supply chains in real time.
As always, catch up on the latest columns from Mark Thompson, Jack Olson, and much more.
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